Patents by Inventor Hoi P. Le

Hoi P. Le has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ultrasonic bonding process for making a microfluid device
    Patent number: 6928731
    Abstract: A piezoelectric ceramic ink-jet print head is made by an inventive ultrasonic bonding process. Specifically, there are several improved features of ink jet print heads, including a more cost-effective bonding process using an ultrasonic bonding technique, an improved piezoelectric ceramic crystal pattern, and improved print head-piezoelectric electrical contacts. Further, there is an ultrasonic bonding process joining metallic objects with ultrasonic energy.
    Type: Grant
    Filed: May 21, 2004
    Date of Patent: August 16, 2005
    Assignee: Picojet, Inc.
    Inventors: Hue P. Le, Hoi P. Le, Thanh P. Le, Linh B. Tran
  • Ultrasonic bonding process for making a microfluid device
    Publication number: 20040237304
    Abstract: There is disclosed a piezoelectric ceramic ink-jet print head and made by an inventive ultrasonic bonding process. Specifically, there are disclosed several improved features of ink jet print heads, including a more cost-effective bonding process using an ultrasonic bonding technique, an improved piezoelectric ceramic crystal pattern, and improved print head-piezoelectric electrical contacts. Further, there is disclosed an ultrasonic bonding process joining metallic objects with ultrasonic energy.
    Type: Application
    Filed: May 21, 2004
    Publication date: December 2, 2004
    Applicant: Picojet, Inc.
    Inventors: Hue P. Le, Hoi P. Le, Thanh P. Le, Linh B. Tran
  • Microfluid device and ultrasonic bonding process
    Patent number: 6783213
    Abstract: There is disclosed a piezoelectric ceramic ink-jet print head and made by an inventive ultrasonic bonding process. Specifically, there are disclosed several improved features of ink jet print heads, including a more cost-effective bonding process using an ultrasonic bonding technique, an improved piezoelectric ceramic crystal pattern, and improved print head-piezoelectric electrical contacts. Further, there is disclosed an ultrasonic bonding process joining metallic objects with ultrasonic energy.
    Type: Grant
    Filed: October 15, 2002
    Date of Patent: August 31, 2004
    Assignee: PicoJet, Inc.
    Inventors: Hue P. Le, Hoi P. Le, Thanh P. Le, Linh B. Tran
  • Microfluid device and ultrasonic bonding process
    Publication number: 20030088981
    Abstract: There is disclosed a piezoelectric ceramic ink-jet print head and made by an inventive ultrasonic bonding process. Specifically, there are disclosed several improved features of ink jet print heads, including a more cost-effective bonding process using an ultrasonic bonding technique, an improved piezoelectric ceramic crystal pattern, and improved print head-piezoelectric electrical contacts. Further, there is disclosed an ultrasonic bonding process joining metallic objects with ultrasonic energy.
    Type: Application
    Filed: October 15, 2002
    Publication date: May 15, 2003
    Inventors: Hue P. Le, Hoi P. Le, Thanh P. Le, Linh B. Tran
  • Ultrasonic bonding of ink-jet print head components
    Patent number: 6530653
    Abstract: A piezoelectric ceramic ink-jet print head is made by ultrasonic bonding processes. Several improved features of ink jet print heads include more cost-effective bonding processes using an ultrasonic bonding technique, an improved piezoelectric ceramic structural element pattern, and improved print head piezoelectric electrical contacts. There is also disclosed an ultrasonic bonding process for joining ceramic and metallic objects.
    Type: Grant
    Filed: July 25, 2001
    Date of Patent: March 11, 2003
    Assignee: PicoJet, Inc.
    Inventors: Hue P. Le, Hoi P. Le, Thanh P. Le, Linh B. Tran
  • Microfluid device and ultrasonic bonding process
    Patent number: 6464324
    Abstract: There is disclosed a piezoelectric ceramic ink-jet print head and made by an inventive ultrasonic bonding process. Specifically, there are disclosed several improved features of inkjet print heads, including a more cost-effective bonding process using an ultrasonic bonding technique, an improved piezoelectric ceramic crystal pattern and improved print head-piezoelectric electrical contacts. Further, there is disclosed an ultrasonic bonding process joining metallic objects with ultrasonic energy.
    Type: Grant
    Filed: January 31, 2000
    Date of Patent: October 15, 2002
    Assignee: PicoJet, Inc.
    Inventors: Hue P. Le, Hoi P. Le, Thanh P. Le
  • Ultrasonic bonding of ink-jet print head components
    Publication number: 20020060724
    Abstract: A piezoelectric ceramic ink-jet print head is made by ultrasonic bonding processes. Several improved features of ink jet print heads include more cost-effective bonding processes using an ultrasonic bonding technique, an improved piezoelectric ceramic structural element pattern, and improved print head piezoelectric electrical contacts. There is also disclosed an ultrasonic bonding process for joining ceramic and metallic objects.
    Type: Application
    Filed: July 25, 2001
    Publication date: May 23, 2002
    Inventors: Hue P. Le, Hoi P. Le, Thanh P. Le, Linh B. Tran