Patents by Inventor Hoi Phen

Hoi Phen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device with selective nickel palladium gold plated leadframe and method of making the same
    Publication number: 20070235843
    Abstract: An electronic device comprises a leadframe attached to a die and embedded in a mold packaging with enhanced adhesion property. The leadframe comprises a bonding surface, a soldering surface, a mold adhesion surface, and a die attachment surface wherein the soldering surface and bonding surface are selectively plated with nickel/palladium/gold. The mold adhesion surface and the die attachment surface are roughened for better attachment to a mold and a die respectively.
    Type: Application
    Filed: April 7, 2006
    Publication date: October 11, 2007
    Inventors: Joseph Martin, King Fu, Hoi Phen