Patents by Inventor Hoi Ping Patrick Phen

Hoi Ping Patrick Phen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device with selective nickel palladium gold plated leadframe and method of making the same
    Patent number: 7504712
    Abstract: An electronic device comprises a leadframe attached to a die and embedded in a mold packaging with enhanced adhesion property. The leadframe comprises a bonding surface, a soldering surface, a mold adhesion surface, and a die attachment surface wherein the soldering surface and bonding surface are selectively plated with nickel/palladium/gold. The mold adhesion surface and the die attachment surface are roughened for better attachment to a mold and a die respectively.
    Type: Grant
    Filed: April 7, 2006
    Date of Patent: March 17, 2009
    Assignee: QPL Limited
    Inventors: Joseph Andrew Martin, King Yin Fred Fu, Hoi Ping Patrick Phen