Patents by Inventor Hoko Suto

Hoko Suto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
    Patent number: 7795325
    Abstract: An adhesive composition containing: (a) a thermoplastic resin; (b) a radical-polymerizable compound including two or more (meth)acryloyl groups; (c) a curing agent that generates a radical by photoirradiation of 150 to 750 nm and/or heating at 80 to 200° C.; and (d) a liquid rubber having a viscosity of 10 to 1000 Pa·s at 25° C.
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: September 14, 2010
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Shigeki Katogi, Hoko Suto, Masami Yusa
  • ADHESIVE COMPOSITION, ADHESIVE COMPOSITION FOR CIRCUIT CONNECTION, CONNECTED BODY SEMICONDUCTOR DEVICE
    Publication number: 20090261483
    Abstract: An adhesive composition containing: (a) a thermoplastic resin; (b) a radical-polymerizable compound including two or more (meth)acryloyl groups; (c) a curing agent that generates a radical by photoirradiation of 150 to 750 nm and/or heating at 80 to 200° C.; and (d) a liquid rubber having a viscosity of 10 to 1000 Pa·s at 25° C.
    Type: Application
    Filed: June 26, 2009
    Publication date: October 22, 2009
    Applicant: HITACHI CHEMICAL CO., LTD.
    Inventors: Shigeki KATOGI, Hoko SUTO, Masami YUSA
  • Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
    Patent number: 7576141
    Abstract: An adhesive composition containing: (a) a thermoplastic resin; (b) a radical-polymerizable compound including two or more (meth)acryloyl groups; (c) a curing agent that generates a radical by photoirradiation of 150 to 750 nm and/or heating at 80 to 200° C.; and (d) a liquid rubber having a viscosity of 10 to 1000 Pa·s at 25° C.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: August 18, 2009
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Shigeki Katogi, Hoko Suto, Masami Yusa
  • Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
    Publication number: 20050282924
    Abstract: An adhesive composition containing: (a) a thermoplastic resin; (b) a radical-polymerizable compound including two or more (meth)acryloyl groups; (c) a curing agent that generates a radical by photoirradiation of 150 to 750 nm and/or heating at 80 to 200° C.; and (d) a liquid rubber having a viscosity of 10 to 1000 Pa.s at 25° C.
    Type: Application
    Filed: May 27, 2005
    Publication date: December 22, 2005
    Applicant: HITACHI CHEMICAL CO., LTD.
    Inventors: Shigeki Katogi, Hoko Suto, Masami Yusa