Abstract: The coil body of the coil component includes a first coil, a second coil, and a third coil arranged in order along one direction when viewed from the facing direction of the pair of main surfaces of the element body. The first coil, the second coil, and the third coil have alternating winding directions, and the number of turns of the second coil is relatively small, thereby improving the characteristics of the coil component.

Abstract: Since the coil body of the coil component includes a plurality of coils and the first coil is one of the plurality of coils included in the coil body, the current route from the external terminal of the first to the outer peripheral turn of the second coil portion where stray capacitance occurs is significantly shorter than the route of current flowing between the pair of external terminals, and the voltage drop in the outer peripheral turn of the second coil portion is relatively small, so that stray capacitance between the second coil portion and the first external terminal is small.

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Abstract: In a coil component, a double coil is configured of a first coil portion and a second coil portion, and a first through conductor of the first coil portion and a second through conductor of the second coil portion are adjacent to each other. Thus, the first coil portion and the second coil portion have enhanced magnetic coupling at locations (that is, the first through conductor and the second through conductor) at which planar coil patterns of upper and lower surfaces of an insulating substrate are connected, in addition to magnetic coupling in the planar coil patterns wound around a through hole. Therefore, according to the coil component, a high coupling coefficient between the first coil portion and the second coil portion is realized.

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Abstract: In a coil component, an uneven structure provided by an insulation layer and a resin wall contributes to extension of a contact area with respect to a magnetic body, so that an adhesive force with respect to the magnetic body is improved. In addition, the magnetic body protrudes downward toward an exposed region of the resin wall corresponding to a recessed portion in the uneven structure, a volume thereof is increased, and coil characteristics such as an inductance value are improved.

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Abstract: In the coil component, external stress applied when the upper coil structure, the lower coil structure, and the magnetic sheet are stacked is dispersed by the undulation of both main surfaces of the magnetic sheet. By dispersing the stress in this manner, a situation in which defects such as cracks occur in the coil structure is effectively suppressed.

Abstract: In the coil component, since the contact area between the external terminal electrode and the element body is increased by the protrusion of the external terminal electrode, the external terminal electrode and the element body are more closely attached to each other. Therefore, the attachment strength between the external terminal electrode and the element body can be improved. Hence, it is possible to suppress peeling of the external terminal electrode from the element body.

Abstract: In the coil component, the coupling coefficient can be adjusted by the magnetic sheet and the insulator interposed between the pair of coils. For example, by increasing the magnetic permeability of the magnetic sheet so that the magnetic flux generated in the coil easily passes through the magnetic sheet, the coupling coefficient decreases. In the coil component, the coupling coefficient can be adjusted while the thickness of the element body is suppressed.

Abstract: Since the magnetic sheet is adopted as the coil component, magnetic saturation is likely to occur in the magnetic sheet, and it is considered that the DC superimposition characteristic of the coil component is deteriorated. However, since the inner edge of the coil structure backs down with respect to the inner edge of the magnetic sheet so that the magnetic flux generated in the coil easily circulates, the deterioration of the DC superimposition characteristics due to the adoption of the magnetic sheet is suppressed.

Abstract: In a coil component, heat radiation around a through conductor is improved. In the coil component, since the cross-sectional area of the inner end portion of the planar coil is designed to be relatively large, heat generated in the through conductor is easily transferred to the inner end portion. Since heat is efficiently transferred from the through conductor to the inner end portion, high heat radiation around the through conductor is achieved.

Abstract: In a coil component, coupling coefficient is improved. In the coil component, the coupling position between the outer end portion of the first planar coil and the first lead-out portion is biased toward the second lead-out portion with respect to the center line of the first lead-out portion, whereby the length of the second planar coil not alongside with the outermost turn of the first planar coil is shortened. By shortening the length of the second planar coil, the coupling coefficient between the first coil portion and the second coil portion is increased.

Abstract: In a coil component, fixing strength of an external terminal is improved. In the coil component, on the end face of the element body, the center position of the external terminal electrode in the first direction is biased toward the center position of the end face with respect to the center position of the outer end portion. Therefore, the fixing area between the external terminal electrode and the element body is increased on the center position side of the end face, and thus fixing strength between the external terminal electrode and the element body is improved.

Abstract: A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.

Abstract: An electronic component preventing peeling of an external terminal is provided. Since each of the external terminal electrodes on the upper face has a U-shaped outline, stress concentration is less likely to occur at an inner end portion than in the external terminal electrode having a corner at the inner end portion. Therefore, for example, even when an impact is applied, a situation in which the external terminal electrode peels off from the upper face due to stress concentration is prevented.

Abstract: A coil component improving insulation between external terminals provided on the same surface of an element body is provided. In the coil component, when a voltage is applied via the external terminal electrode, for example, a potential difference may occur between the outer end portions. In the coil component, since the insulation between the outer end portions is enhanced by the upper insulator exposed on the end face of the element body, even when a potential difference occurs between the outer end portions, a situation in which the outer end portions are short-circuited on the end face is prevented.

Abstract: By overlapping the protruding portion of the first insulator and the protruding portion of the second insulator via the protruding portion of the substrate, the DC superposition characteristic of the coil component is improved.