Patents by Inventor Hokuto EDA

Hokuto EDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210327637
    Abstract: In an insulation layer of a coil component, a thickness of a second covering part and a third covering part located on the penetration hole side of a first covering part is thinner than that of the first covering part. A stray capacitance occurring between a flat coil pattern and external terminal electrodes is reduced by making the first covering part of the insulation layer thicker than the second covering part and the third covering part. Further, since the second covering part and the third covering part of the insulation layers are thinner than the first covering part, a magnetic volume is increased while external dimensions of the base body is maintained, and thus a high inductance is realized.
    Type: Application
    Filed: April 19, 2021
    Publication date: October 21, 2021
    Applicant: TDK CORPORATION
    Inventors: Hokuto EDA, Masataro SAITO, Kohei TAKAHASHI, Takamasa IWASAKI, Hitoshi OHKUBO, Masazumi ARATA
  • Publication number: 20210327641
    Abstract: In a coil component, a stray capacitance may occur between a conducting wires of an upper layer and a conducting wires of a lower layer arranged in the vertical direction due to the potential difference between them. In the coil component, a separation distance between the conducting wire of the upper layer and the conducting wire of the lower layer is designed to be longer than twice a thickness of an insulation coating of a portion covering a side surface of the conducting wire, and a sufficiently long distance is secured, and thus the stray capacitance is reduced.
    Type: Application
    Filed: April 19, 2021
    Publication date: October 21, 2021
    Applicant: TDK CORPORATION
    Inventors: Hokuto EDA, Masataro SAITO, Kohei TAKAHASHI, Takamasa IWASAKI
  • Publication number: 20210225588
    Abstract: In a coil component and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.
    Type: Application
    Filed: April 7, 2021
    Publication date: July 22, 2021
    Applicant: TDK CORPORATION
    Inventors: Hitoshi OHKUBO, Masazumi ARATA, Manabu OHTA, Shou KAWADAHARA, Yoshihiro MAEDA, Takahiro KAWAHARA, Hokuto EDA, Shigeki SATO
  • Publication number: 20210193369
    Abstract: In a coil component, a non-magnetic part is bridged between a first coil and a second coil in a cross section of an element body. Therefore, a magnetic flux in a direction along a magnetic core of the first coil and a magnetic core of the second coil is hindered by the non-magnetic part between the first coil and the second coil. Accordingly, a magnetic flux of the first coil and a magnetic flux of the second coil are difficult to interfere with each other.
    Type: Application
    Filed: December 18, 2020
    Publication date: June 24, 2021
    Applicant: TDK CORPORATION
    Inventors: Masataro SAITO, Masazumi ARATA, Hokuto EDA, Kohei TAKAHASHI, Takamasa IWASAKI
  • Patent number: 11043329
    Abstract: In a planar coil element, a dead space in a non-overlapping region is reduced by designing a total width of a first resin wall and a first turn located in the non-overlapping region to be narrow, more specifically, by designing the total width to be narrower than a total width of a second turn outside the first turn and a second resin wall located inside the turn and also than a total width of a third turn on the outer side and a third resin wall located inside the turn. As a result, a volume of a magnetic element body in a magnetic core portion of a coil can be increased, and an, inductance value, which is a magnetic characteristic, can also be improved.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: June 22, 2021
    Assignee: TDK CORPORATION
    Inventors: Hitoshi Ohkubo, Masazumi Arata, Takahiro Kawahara, Hokuto Eda, Hiroki Tsujiai
  • Publication number: 20210183566
    Abstract: In a coil component, the pressure resistance is improved by main surfaces and of a main body portion being covered with an insulating layer. The main body portion has a surface part, the resin ratio of the surface part is higher than the internal resin ratio, and insulation is enhanced at the surface part. As a result, the pressure resistance on the surface of the main body portion is further improved and the pressure resistance of the entire coil component is further improved.
    Type: Application
    Filed: December 8, 2020
    Publication date: June 17, 2021
    Applicant: TDK CORPORATION
    Inventors: Hitoshi OHKUBO, Miyuki ASAI, Masazumi ARATA, Hokuto EDA
  • Publication number: 20210166858
    Abstract: In a coil component, a double coil is configured of a first coil portion and a second coil portion, and a first through conductor of the first coil portion and a second through conductor of the second coil portion are adjacent to each other. Thus, the first coil portion and the second coil portion have enhanced magnetic coupling at locations (that is, the first through conductor and the second through conductor) at which planar coil patterns of upper and lower surfaces of an insulating substrate are connected, in addition to magnetic coupling in the planar coil patterns wound around a through hole. Therefore, according to the coil component, a high coupling coefficient between the first coil portion and the second coil portion is realized.
    Type: Application
    Filed: December 1, 2020
    Publication date: June 3, 2021
    Applicant: TDK CORPORATION
    Inventors: Masataro SAITO, Masazumi ARATA, Hokuto EDA, Kohei TAKAHASHI, Takamasa IWASAKI
  • Publication number: 20210166859
    Abstract: In a coil component, a first planar coil and a second planar coil are wound around a common magnetic core and are magnetically coupled to each other. However, the first planar coil and the second planar coil are not electrically connected to each other and form coil structures which are separate from each other. Thus, as compared with a case in which the first planar coil and the second planar coil form one coil structure, the first planar coil and the second planar coil are less likely to affect each other's characteristics.
    Type: Application
    Filed: December 2, 2020
    Publication date: June 3, 2021
    Applicant: TDK CORPORATION
    Inventors: Masataro SAITO, Masazumi ARATA, Hokuto EDA, Kohei TAKAHASHI, Takamasa IWASAKI
  • Patent number: 10998130
    Abstract: In a coil component and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: May 4, 2021
    Assignee: TDK CORPORATION
    Inventors: Hitoshi Ohkubo, Masazumi Arata, Manabu Ohta, Shou Kawadahara, Yoshihiro Maeda, Takahiro Kawahara, Hokuto Eda, Shigeki Sato
  • Patent number: 10943719
    Abstract: In a coil component, an insulation layer covers an upper surface of a conductor pattern. Accordingly, insulating properties between the conductor pattern and a magnetic body are enhanced, and insulating properties between the conductor patterns are enhanced. In addition, in the coil component, the magnetic body enters a space between resin walls such that the insulation layer is covered. Therefore, a volume of the magnetic body above the conductor pattern is increased, and high coil characteristics are realized.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: March 9, 2021
    Assignee: TDK CORPORATION
    Inventors: Miyuki Asai, Hokuto Eda, Masazumi Arata, Hitoshi Ohkubo
  • Publication number: 20200373064
    Abstract: In a coil component, an uneven structure provided by an insulation layer and a resin wall contributes to extension of a contact area with respect to a magnetic body, so that an adhesive force with respect to the magnetic body is improved. In addition, the magnetic body protrudes downward toward an exposed region of the resin wall corresponding to a recessed portion in the uneven structure, a volume thereof is increased, and coil characteristics such as an inductance value are improved.
    Type: Application
    Filed: May 19, 2020
    Publication date: November 26, 2020
    Applicant: TDK CORPORATION
    Inventors: Miyuki ASAI, Hokuto EDA, Masazumi ARATA, Hitoshi OHKUBO
  • Publication number: 20200373050
    Abstract: In a coil component, an insulation layer covers an upper surface of a conductor pattern. Accordingly, insulating properties between the conductor pattern and a magnetic body are enhanced, and insulating properties between the conductor patterns are enhanced. In addition, in the coil component, the magnetic body enters a space between resin walls such that the insulation layer is covered. Therefore, a volume of the magnetic body above the conductor pattern is increased, and high coil characteristics are realized.
    Type: Application
    Filed: May 19, 2020
    Publication date: November 26, 2020
    Applicant: TDK CORPORATION
    Inventors: Miyuki ASAI, Hokuto EDA, Masazumi ARATA, Hitoshi OHKUBO
  • Patent number: 10847312
    Abstract: In a planar coil element, since an overlapping portion of a fourth resin wall of a first conductor pattern protrudes from an end surface of a main body portion, restriction on a width of the overlapping portion is relaxed, and the wide overlapping portion is realized. Therefore, an improvement in a withstand voltage between the second external terminal electrode formed on the end surface and an outermost turn of the first conductor pattern is realized. Similarly, regarding the second conductor pattern, the improvement in the withstand voltage between the first external terminal electrode formed on the end surface and an outermost turn of the second conductor pattern is realized.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: November 24, 2020
    Assignee: TDK CORPORATION
    Inventors: Hitoshi Ohkubo, Masazumi Arata, Takahiro Kawahara, Hokuto Eda, Hiroki Tsujiai
  • Publication number: 20200303116
    Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.
    Type: Application
    Filed: March 6, 2020
    Publication date: September 24, 2020
    Applicant: TDK CORPORATION
    Inventors: Takahiro KAWAHARA, Manabu OHTA, Kenei ONUMA, Yuuya KANAME, Ryo FUKUOKA, Hokuto EDA, Masataro SAITO, Kohei TAKAHASHI
  • Publication number: 20200143980
    Abstract: A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.
    Type: Application
    Filed: January 3, 2020
    Publication date: May 7, 2020
    Applicant: TDK CORPORATION
    Inventors: Hitoshi OHKUBO, Masazumi ARATA, Manabu OHTA, Yuuya KANAME, Yoshihiro MAEDA, Takahiro KAWAHARA, Hokuto EDA, Shigeki SATO
  • Patent number: 10559417
    Abstract: A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: February 11, 2020
    Assignee: TDK CORPORATION
    Inventors: Hitoshi Ohkubo, Masazumi Arata, Manabu Ohta, Yuuya Kaname, Yoshihiro Maeda, Takahiro Kawahara, Hokuto Eda, Shigeki Sato
  • Publication number: 20190385792
    Abstract: In a coil component and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.
    Type: Application
    Filed: August 29, 2019
    Publication date: December 19, 2019
    Inventors: Hitoshi OHKUBO, Masazumi ARATA, Manabu OHTA, Shou KAWADAHARA, Yoshihiro MAEDA, Takahiro KAWAHARA, Hokuto EDA, Shigeki SATO
  • Patent number: 10468184
    Abstract: In a coil component 1 and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: November 5, 2019
    Assignee: TDK CORPORATION
    Inventors: Hitoshi Ohkubo, Masazumi Arata, Manabu Ohta, Shou Kawadahara, Yoshihiro Maeda, Takahiro Kawahara, Hokuto Eda, Shigeki Sato
  • Patent number: 10210974
    Abstract: In a coil component (planar coil element), at least part of a third metal magnetic powder constituting a metal magnetic powder and having a minimum average grain diameter is uncoated, which suppresses a reduction in magnetic permeability. On the other hand, the remaining metal powders are coated with glass, which improves the insulating properties of a metal magnetic powder-containing resin and reduces core loss.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: February 19, 2019
    Assignee: TDK CORPORATION
    Inventors: Hitoshi Ohkubo, Masazumi Arata, Manabu Ohta, Shou Kawadahara, Yoshihiro Maeda, Takahiro Kawahara, Hokuto Eda, Shigeki Sato
  • Publication number: 20190013148
    Abstract: In a planar coil element, since an overlapping portion of a fourth resin wall of a first conductor pattern protrudes from an end surface of a main body portion, restriction on a width of the overlapping portion is relaxed, and the wide overlapping portion is realized. Therefore, an improvement in a withstand voltage between the second external terminal electrode formed on the end surface and an outermost turn of the first conductor pattern is realized. Similarly, regarding the second conductor pattern, the improvement in the withstand voltage between the first external terminal electrode formed on the end surface and an outermost turn of the second conductor pattern is realized.
    Type: Application
    Filed: July 5, 2018
    Publication date: January 10, 2019
    Applicant: TDK CORPORATION
    Inventors: Hitoshi OHKUBO, Masazumi ARATA, Takahiro KAWAHARA, Hokuto EDA, Hiroki TSUJIAI