Patents by Inventor Ho Kyoon LEE

Ho Kyoon LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240160574
    Abstract: A computer system may include a processor; a first memory device; a second memory device; a cache memory including a plurality of cache entries and a cache controller. The cache controller is configured to manage a source indicating whether a caching data is provided from the first memory device or the second memory device, and determine a cache entry to be evicted from the cache entries based on a cache miss ratio of request data by the source which the request data is read when the request data of the processor do not exist in the cache memory and a cache occupancy ratio by the source.
    Type: Application
    Filed: May 4, 2023
    Publication date: May 16, 2024
    Inventors: Yun Jeong MUN, Rak Kie KIM, Ho Kyoon LEE
  • Publication number: 20240126469
    Abstract: A pooled memory device includes plural memory devices and a controller. The plural memory devices include a first memory and a second memory with at least one power supply configured to control power supplied to each of the plural memory devices. The controller is coupled to an interconnect device which is configured to provide the plural memory devices to at least one external device as a logical device. The controller is configured to track available storage capacities of the first memory and the second memory and cut off power supplied to an unused memory among the first memory and the second memory.
    Type: Application
    Filed: February 23, 2023
    Publication date: April 18, 2024
    Inventors: Ho Kyoon LEE, Kwang Jin KO, Jun Hee RYU
  • Patent number: 10402325
    Abstract: A memory system may include a first cache memory including a plurality of regions, which are accessed using a first address, and in each of which an indication of whether cached data is present and a second address are stored. A memory system may also include a second cache memory configured to be accessed using the second address stored in an accessed region of the first cache memory when, as a result of an access of the first cache memory, cached data is present. Still further, a memory system may include a main memory configured to be accessed using the first address when, as the result of the access of the first cache memory, cached data is not present.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: September 3, 2019
    Assignees: SK hynix Inc., Korea University Research and Business Foundation
    Inventors: Ho-Kyoon Lee, Il Park, Seon-Wook Kim
  • Patent number: 10061642
    Abstract: An on-chip logic block may include a host ECC circuit configured to correct an error based on host parity. The on-chip logic block may include a memory ECC circuit configured to correct an error based on memory parity.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: August 28, 2018
    Assignee: SK hynix Inc.
    Inventors: Jin Ho Baek, Jang Ryul Kim, Il Park, Ho Kyoon Lee
  • Patent number: 9875995
    Abstract: A stack chip package may include a plurality of stacked semiconductor chips. Each of the semiconductor chips may have a first node, a second node, a third node and a fourth node corresponding to corners of the semiconductor chip. The plurality of semiconductor chips may be sequentially stacked such that, when a semiconductor chip is disposed directly on another semiconductor chip, the first node of the semiconductor chip is positioned over a side between the first node and the second node of the another semiconductor chip.
    Type: Grant
    Filed: June 6, 2016
    Date of Patent: January 23, 2018
    Assignee: SK hynix Inc.
    Inventors: Jin Ho Baek, Il Park, Ho Kyoon Lee, Young Pyo Joo
  • Patent number: 9824029
    Abstract: A memory device includes: a main block that includes a plurality of first pages that are accessible based on a multi-bit address; and a sub-block that includes a plurality of second pages that are accessible based on a portion of bits of the multi-bit address, and stores a replacement data for replacing entire or a portion of the data of an accessed first page among the plurality of the first pages in a second page that stores the same tags as the other bits of the multi-bit address among the accessed second pages.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: November 21, 2017
    Assignees: SK Hynix Inc., Korea University Research and Business Foundation
    Inventors: Ho-Kyoon Lee, Il Park, Seon-Wook Kim
  • Publication number: 20170271308
    Abstract: A stack chip package may include a plurality of stacked semiconductor chips. Each of the semiconductor chips may have a first node, a second node, a third node and a fourth node corresponding to corners of the semiconductor chip. The plurality of semiconductor chips may be sequentially stacked such that, when a semiconductor chip is disposed directly on another semiconductor chip, the first node of the semiconductor chip is positioned over a side between the first node and the second node of the another semiconductor chip.
    Type: Application
    Filed: June 6, 2016
    Publication date: September 21, 2017
    Inventors: Jin Ho BAEK, Il PARK, Ho Kyoon LEE, Young Pyo JOO
  • Publication number: 20170270054
    Abstract: A memory device includes: a main block that includes a plurality of first pages that are accessible based on a multi-bit address; and a sub-block that includes a plurality of second pages that are accessible based on a portion of bits of the multi-bit address, and stores a replacement data for replacing entire or a portion of the data of an accessed first page among the plurality of the first pages in a second page that stores the same tags as the other bits of the multi-bit address among the accessed second pages.
    Type: Application
    Filed: October 25, 2016
    Publication date: September 21, 2017
    Inventors: Ho-Kyoon LEE, Il PARK, Seon-Wook KIM
  • Publication number: 20170185513
    Abstract: A memory system may include a first cache memory including a plurality of regions, which are accessed using a first address, and in each of which an indication of whether cached data is present and a second address are stored. A memory system may also include a second cache memory configured to be accessed using the second address stored in an accessed region of the first cache memory when, as a result of an access of the first cache memory, cached data is present. Still further, a memory system may include a main memory configured to be accessed using the first address when, as the result of the access of the first cache memory, cached data is not present.
    Type: Application
    Filed: November 4, 2016
    Publication date: June 29, 2017
    Inventors: Ho-Kyoon LEE, Il PARK, Seon-Wook KIM
  • Publication number: 20170123896
    Abstract: An on-chip logic block may include a host ECC circuit configured to correct an error based on host parity. The on-chip logic block may include a memory ECC circuit configured to correct an error based on memory parity.
    Type: Application
    Filed: March 4, 2016
    Publication date: May 4, 2017
    Inventors: Jin Ho BAEK, Jang Ryul KIM, Il PARK, Ho Kyoon LEE