Abstract: Circuitry includes a terminal for a high-frequency signal, at least two signal lines, a switching unit for connecting the terminal to a signal line, and a primary protection device for protecting against electrostatic discharges. The primary protection device is between the terminal and the switching unit. The primary protection device includes a first element that diverts voltages having a pulse height greater than 200V relative to a reference potential.

Abstract: An electrical multi-layer component includes a body having a stack of ceramic layers, with a top and a bottom. First and second connection surfaces are on the bottom of the body. Electrode surfaces are in metallization layers among the ceramic layers. Via contacts are between metallization layers. At least one of the via contacts is connected electrically to an electrode surface or to a connection surface. An electrode surface connected to one of the connection surfaces, through a corresponding via contact, is a first electrode structure or a second electrode structure. At least one of the first or second electrode structures includes a via contact that has a blind end. A shortest distance between the first and second electrode structures is a vertical distance from the blind end to: (i) a metallization layer above or below the blind end, or (ii) a blind end of another electrode structure.

Abstract: Circuitry includes a voltage-controlled switch having a transmitter input, a receiver input, and an output that connects to one of the transmitter input and the receiver input. Passive components form a low-pass filter that is electrically connected to the transmitter input. The passive components are part of a multilayer ceramic passive module that includes a base body made of superimposed dielectric layers and electrically conductive layers. The voltage-controlled switch is on an upper portion or a lower portion of the base body.

Abstract: An electrical multi-layer component includes a body having a stack of ceramic layers, with a top and a bottom. First and second connection surfaces are on the bottom of the body. Electrode surfaces are in metallization layers among the ceramic layers. Via contacts are between metallization layers. At least one of the via contacts is connected electrically to an electrode surface or to a connection surface. An electrode surface connected to one of the connection surfaces, through a corresponding via contact, is a first electrode structure or a second electrode structure. At least one of the first or second electrode structures includes a via contact that has a blind end. A shortest distance between the first and second electrode structures is a vertical distance from the blind end to: (i) a metallization layer above or below the blind end, or (ii) a blind end of another electrode structure.

Abstract: An electrical component includes an amplifier that includes an output stage, and a power-supply path for powering the output stage. The power supply path includes a line that includes conductor track sections in parallel. The electrical component also includes a carrier substrate containing the amplifier and the line with the conductor tracks.

Abstract: A circuit array includes an antenna input, a signal input, a signal output, and a switch unit. The switch unit connects the antenna to either the signal input or the signal output. The antenna input is connected to a first productive device. The first protective device is a band-pass filter in a T configuration.

Abstract: A transmitter module of a wireless transmission system with at least one transmission path having a power amplifier disposed at the input side includes a low-pass filter disposed at the output side and an impedance converter disposed therebetween. The power amplifier and the low-pass filter are, thereby, disposed on the top surface of a multi-layer carrier substrate. Preferably, the impedance converter is disposed in metallization planes of the carrier substrate. The inventive integration of all of these components in one module especially allows for a step-wise impedance adaptation between the low-impedance amplifier output and the output of the transmitter module having a defined output impedance (e.g. 50 ohm), whereby the impedance adaptation is partially carried out by the low-pass filter. A multistage impedance adaptation allows for a reduction of, e.g., the length of the line sections used in the impedance converter and the signal losses involved.

Abstract: A functional block of a front-end circuit for a communication device, which is employed for multi-band and/or multi-mode operation, is proposed. By positioning, according to this invention, a pin diode switch in one of the parallel signal paths instead of positioning it on the input side before separating the signal paths, it is possible to do without an impedance transformation network on the input side and to thus reduce the signal loss and the space requirement of the circuit. In a further configuration, the signal paths preferably associated with the adjacent frequency bands are combined on the output side, whereby the further processing of the signals corresponding to the different frequency bands takes place in one path. This for example allows a chip set designed for (n?1) frequency bands to be used in a transmission system designed for n bands. Another embodiment of this invention enables monitoring of the received signal of a system even during operation of the other mode in a multi-mode system.

Abstract: The invention relates to a circuit comprising an antenna input (1), a signal input (2) and a signal output (3), and a switching unit (4), wherein the antenna input (1) is connected to a first protection device (6) against electrostatic discharges, said first protection device (6) being a band-pass filter in a ?-configuration. The advantage of the first protection device (6) is that it eliminates the need for a band-pass filter in the front end module, when used in a mobile telephone. Furthermore, the band-pass filter has a very good filtering characteristic, enabling ESD-related disturbances to be effectively suppressed. The invention also relates to a switching module and to the use of the same.

Abstract: A functional block of a front-end circuit for a communication device, which is employed for multi-band and/or multi-mode operation, is proposed. By positioning, according to this invention, a pin diode switch in one of the parallel signal paths instead of positioning it on the input side before separating the signal paths, it is possible to do without an impedance transformation network on the input side and to thus reduce the signal loss and the space requirement of the circuit. In a further configuration, the signal paths preferably associated with the adjacent frequency bands are combined on the output side, whereby the further processing of the signals corresponding to the different frequency bands takes place in one path. This for example allows a chip set designed for (n?1) frequency bands to be used in a transmission system designed for n bands. Another embodiment of this invention enables monitoring of the received signal of a system even during operation of the other mode in a multi-mode system.

Abstract: The invention relates to an electrical switching module with a current-controlled switch (1), which has a transmitter (2) and a receiver (3) input and an output (4) and which electrically connects one of the inputs (2, 3) to the output (4), as desired, and with passive components which form a low-pass filter (5, 6), which is electrically connected to a transmitter input (2) of the switch, where the passive components are part of a multi-layer ceramic passive module, which includes a main casting (7) made of superimposed dielelectric layers (8) and electrically conductive layers (9), and where the switch (1) is configured on the upper or lower side of the main casting (7). In addition, the invention relates to a switching module configuration and the use of the switching module and the switching module configuration. Due to the current-controlled switch (1) a switching module can be achieved using very little power.