Abstract: Circuitry includes a terminal for a high-frequency signal, at least two signal lines, a switching unit for connecting the terminal to a signal line, and a primary protection device for protecting against electrostatic discharges. The primary protection device is between the terminal and the switching unit. The primary protection device includes a first element that diverts voltages having a pulse height greater than 200V relative to a reference potential.

Abstract: An electrical multi-layer component includes a body having a stack of ceramic layers, with a top and a bottom. First and second connection surfaces are on the bottom of the body. Electrode surfaces are in metallization layers among the ceramic layers. Via contacts are between metallization layers. At least one of the via contacts is connected electrically to an electrode surface or to a connection surface. An electrode surface connected to one of the connection surfaces, through a corresponding via contact, is a first electrode structure or a second electrode structure. At least one of the first or second electrode structures includes a via contact that has a blind end. A shortest distance between the first and second electrode structures is a vertical distance from the blind end to: (i) a metallization layer above or below the blind end, or (ii) a blind end of another electrode structure.

Abstract: An electrical multi-layer component includes a body having a stack of ceramic layers, with a top and a bottom. First and second connection surfaces are on the bottom of the body. Electrode surfaces are in metallization layers among the ceramic layers. Via contacts are between metallization layers. At least one of the via contacts is connected electrically to an electrode surface or to a connection surface. An electrode surface connected to one of the connection surfaces, through a corresponding via contact, is a first electrode structure or a second electrode structure. At least one of the first or second electrode structures includes a via contact that has a blind end. A shortest distance between the first and second electrode structures is a vertical distance from the blind end to: (i) a metallization layer above or below the blind end, or (ii) a blind end of another electrode structure.

Abstract: A radio frequency (RF) module includes a multilayer substrate having dielectric layers and metallization layers that include one or more circuit elements. The metallization layers are located between the dielectric layers. The RF module also includes a symmetric transmission input associated with the multilayer substrate, an RF element on the multilayer substrate to provide RF functionality, and a balun integrated in the substrate behind the symmetric transmission input.

Abstract: An electrical component includes an amplifier that includes an output stage, and a power-supply path for powering the output stage. The power supply path includes a line that includes conductor track sections in parallel. The electrical component also includes a carrier substrate containing the amplifier and the line with the conductor tracks.

Abstract: A circuit array includes an antenna input, a signal input, a signal output, and a switch unit. The switch unit connects the antenna to either the signal input or the signal output. The antenna input is connected to a first productive device. The first protective device is a band-pass filter in a T configuration.

Abstract: An electrical component includes an amplifier that includes an output stage, and a power-supply path for powering the output stage. The power supply path includes a line that includes conductor track sections in parallel. The electrical component also includes a carrier substrate containing the amplifier and the line with the conductor tracks.

Abstract: A transmitter module of a wireless transmission system with at least one transmission path having a power amplifier disposed at the input side includes a low-pass filter disposed at the output side and an impedance converter disposed therebetween. The power amplifier and the low-pass filter are, thereby, disposed on the top surface of a multi-layer carrier substrate. Preferably, the impedance converter is disposed in metallization planes of the carrier substrate. The inventive integration of all of these components in one module especially allows for a step-wise impedance adaptation between the low-impedance amplifier output and the output of the transmitter module having a defined output impedance (e.g. 50 ohm), whereby the impedance adaptation is partially carried out by the low-pass filter. A multistage impedance adaptation allows for a reduction of, e.g., the length of the line sections used in the impedance converter and the signal losses involved.

Abstract: The invention relates to a circuit comprising an antenna input (1), a signal input (2) and a signal output (3), and a switching unit (4), wherein the antenna input (1) is connected to a first protection device (6) against electrostatic discharges, said first protection device (6) being a band-pass filter in a ?-configuration. The advantage of the first protection device (6) is that it eliminates the need for a band-pass filter in the front end module, when used in a mobile telephone. Furthermore, the band-pass filter has a very good filtering characteristic, enabling ESD-related disturbances to be effectively suppressed. The invention also relates to a switching module and to the use of the same.

Abstract: A transmitter module for mobile radio applications includes a multilayer module substrate with levels of metallization and intervening dielectric stacks in which a circuit is implemented by structuring the levels of metallization. In or on the module substrate, at least one HF filter or adjustment network is implemented. On the underside of the module substrate, a cutout, in which a chip element is soldered in a flip-chip-arrangement, is provided. The rear of the chip element pointing to the outside displays a metallization that makes a good thermal contact of the chip element with extrinsic circuit surroundings possible.

Abstract: A transmitter module of a wireless transmission system with at least one transmission path having a power amplifier disposed at the input side includes a low-pass filter disposed at the output side and an impedance converter disposed therebetween. The power amplifier and the low-pass filter are, thereby, disposed on the top surface of a multi-layer carrier substrate. Preferably, the impedance converter is disposed in metallization planes of the carrier substrate. The inventive integration of all of these components in one module especially allows for a step-wise impedance adaptation between the low-impedance amplifier output and the output of the transmitter module having a defined output impedance (e.g. 50 ohm), whereby the impedance adaptation is partially carried out by the low-pass filter. A multistage impedance adaptation allows for a reduction of, e.g., the length of the line sections used in the impedance converter and the signal losses involved.

Abstract: A radio frequency (RF) module includes a multilayer substrate having dielectric layers and metallization layers that include one or more circuit elements. The metallization layers are located between the dielectric layers. The RF module also includes a symmetric transmission input associated with the multilayer substrate, an RF element on the multilayer substrate to provide RF functionality, and a balun integrated in the substrate behind the symmetric transmission input.

Abstract: A circuit arrangement is described having a terminal (1) for a high-frequency signal, having at least two additional signal leads (21a, 21b, 21c, 22a, 22b), having a switching unit (3) for connecting the terminal (1) to a signal lead (21a, 21b, 21c, 22a, 22b), having a primary protection device (41) against electrostatic discharges, which is connected between the terminal (1) and the switching unit (3), the protection device (41) containing a first voltage limitation element (51), which diverts voltage pulses that exceed a switching voltage of 200 V to a reference potential (7). The use of a gallium arsenide double diode makes it possible to attain the advantage of a low insertion loss coupled with a low switching voltage.

Abstract: The invention relates to a circuit array with an antenna input (1), a signal input (2) and a signal output (3), a switch unit (4), in which the antenna input (1) is connected to a first protective device (6) against electrostatic discharges, wherein the first5 protective device (6) is a band-pass filter in a ? configuration. An advantage of the first protective device (6) is that when it is used in a mobile telephone, a band-pass filter in the front-end module can be omitted. In addition, the band-pass filter has very favorable filtering characteristics, so that ESD-related interference can be effectively suppressed. The invention also relates to a circuit module and the use of the circuit module.

Abstract: The invention relates to a circuit array with an antenna input (1), a signal input (2) and a signal output (3), a switch unit (4), in which the antenna input (1) is connected to a first protective device (6) against electrostatic discharges, wherein the first protective device (6) has an antenna input (111) and a switch output (112), which are connected to one another by a line (113), and in which a voltage-limiting element (114) is connected to a ground (8) in parallel to the line (113). The advantage of the circuit array of the invention is that the protective device (6) has a low insertion loss. The invention also relates to a circuit module as well as the use of the circuit module as a front-end module.

Abstract: Circuit array, circuit module with the circuit array, and use of the circuit module The invention relates to a circuit array with an antenna input (1), a signal input (2) and a signal output (3), a switch unit (4), in which the antenna input (1) is connected to a first protective device (6) against electrostatic discharges, wherein the first protective device (6) is a band-pass filter in a T configuration. An advantage of the first protective device (6) is that when it is used in a mobile telephone, a band-pass filter in the front-end module can be omitted. In addition, the band-pass filter has very favorable filtering characteristics, so that ESD-related interference can be effectively suppressed. The invention also relates to a circuit module and use of the circuit module.

Abstract: The invention relates to a circuit array with an antenna input (1), a signal input (2) and a signal output (3), and having a switch unit (4) which has a control line (5), with which the optional connecting of the antenna input (1) to the signal input (2) or the signal output (3) can be controlled, in which the antenna input (1) is connected to a first protective device (6) against electrostatic discharges and the control line (5) to a second protective device (7) against electrostatic discharges. As a result of the protective device in the control line, the ESD safety of the circuit array can be improved. The invention also relates to a circuit module and its use as a front-end module in a mobile telephone.