Patents by Inventor Holger Halplik

Holger Halplik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT PACKAGE
    Publication number: 20110018623
    Abstract: An integrated circuit combination, comprising first and second integrated circuit dies with respective first and second control register banks, and a path for external control data, within said combination, coupling a first data interface on said first die, which receives the external control data, to the first and second control register banks.
    Type: Application
    Filed: July 22, 2010
    Publication date: January 27, 2011
    Inventors: Grant M. More, Holger Halplik, Abhay Kejriwal