Abstract: A method for adjusting an inertial sensor component using a calibration device. The calibration device includes a base device or the base device is connected to the calibration device. The method includes: in a first step for adjusting the inertial sensor component, its housing is positioned and/or aligned relative to the base device that is arranged in the calibration device and connected thereto, in a second step following the first step, the base device and the inertial sensor component are adjusted and/or calibrated using the calibration device by applying a defined acceleration in at least one spatial direction and/or a defined rotation rate in at least one spatial direction.

Abstract: A method for producing a micromechanical device having a damper structure. The method includes: (A) providing a micromechanical wafer having a rear side; (B) applying a liquid damper material onto the rear side; (C) pressing a matrix against the rear side in order to form at least one damper structure in the damper material; (D) curing the damper material; and (E) removing the matrix.

Abstract: A method for producing a micromechanical device having a damper structure. The method includes: (A) providing a micromechanical wafer having a rear side; (B) applying a liquid damper material onto the rear side; (C) pressing a matrix against the rear side in order to form at least one damper structure in the damper material; (D) curing the damper material; and (E) removing the matrix.

Abstract: A sensor and/or sound detection device having a sensing device having a sensitive surface, an access channel being designed in such a way that air and/or a gas is transferable through the open access channel between a spatial surroundings of the sensor/detection device and the sensitive surface, and an at least partially water-impermeable membrane having respectively an inner side of the membrane facing the associated access channel being designed in such a way that a contact surface on the respective inner side of the respective membrane is pressed against an associated membrane contact surface on the associated access channel in such a way that the associated access channel is sealed in a liquid-tight manner when an outer side of the respective membrane or a covering layer on the respective outer side of the membrane is wetted with at least a minimum quantity of liquid and the respective membrane is deformed.

Abstract: A method for producing thin MEMS chips on SOI substrate including: providing an SOI substrate having a silicon layer on a front side and having an oxide intermediate layer, producing a layer structure on the front side of the SOI substrate and producing a MEMS structure from this layer structure, capping the MEMS structure and producing a cavity, and etching a back side of the SOI substrate down to the oxide intermediate layer. Also described is a micromechanical component having a substrate, a MEMS layer structure having a MEMS structure in a cavity and a cap element, the MEMS structure and its cavity being enclosed by the substrate underneath and the cap element above, the substrate being made of polycrystalline silicon.

Abstract: A method for producing thin MEMS chips on SOI substrate including: providing an SOI substrate having a silicon layer on a front side and having an oxide intermediate layer, producing a layer structure on the front side of the SOI substrate and producing a MEMS structure from this layer structure, capping the MEMS structure and producing a cavity, and etching a back side of the SOI substrate down to the oxide intermediate layer. Also described is a micromechanical component having a substrate, a MEMS layer structure having a MEMS structure in a cavity and a cap element, the MEMS structure and its cavity being enclosed by the substrate underneath and the cap element above, the substrate being made of polycrystalline silicon.

Abstract: A sensor and/or sound detection device having a sensing device having a sensitive surface, an access channel being designed in such a way that air and/or a gas is transferable through the open access channel between a spatial surroundings of the sensor/detection device and the sensitive surface, and an at least partially water-impermeable membrane having respectively an inner side of the membrane facing the associated access channel being designed in such a way that a contact surface on the respective inner side of the respective membrane is pressed against an associated membrane contact surface on the associated access channel in such a way that the associated access channel is sealed in a liquid-tight manner when an outer side of the respective membrane or a covering layer on the respective outer side of the membrane is wetted with at least a minimum quantity of liquid and the respective membrane is deformed.

Abstract: A damping device for a micromechanical sensor device, having at least one first intermediate layer having at least two sections, a second section being situated around a first section, a lateral distance being provided between the first and the second section, and an elastic device being provided between the first section and the second section as an integral part of the first intermediate layer.

Abstract: An integrated circuit includes an electronic circuit in a housing and a first contacting device for soldering the circuit to a corresponding second contacting device of a circuit board. The first and second contacting devices are each divided into a first section and a second section, the sections of one of the contacting devices being fixedly electrically connected to each other, and the sections of the other contacting device being selectively connectable to a device for resistance determination.

Abstract: A sensor system includes a supporting element and a sensor element attached to the supporting element and having a main plane of extension. The supporting element has (i) at least one contact element for electrical contacting of the sensor system and (ii) at least one relief structure for stress decoupling, the at least one relief structure being situated in a plane parallel to the main plane of extension essentially between the at least one contact element and the sensor element.

Abstract: A damping device for a micromechanical sensor device, having at least one first intermediate layer having at least two sections, a second section being situated around a first section, a lateral distance being provided between the first and the second section, and an elastic device being provided between the first section and the second section as an integral part of the first intermediate layer.

Abstract: An integrated component having a substrate, the substrate having a cavity which surrounds a mechanical structure. The cavity is filled by a fluid of a specific composition under a specific pressure, and the mechanical properties of the mechanical structure are influenced by the fluid.

Abstract: An integrated circuit includes an electronic circuit in a housing and a first contacting device for soldering the circuit to a corresponding second contacting device of a circuit board. The first and second contacting devices are each divided into a first section and a second section, the sections of one of the contacting devices being fixedly electrically connected to each other, and the sections of the other contacting device being selectively connectable to a device for resistance determination.

Abstract: A sensor system includes a supporting element and a sensor element attached to the supporting element and having a main plane of extension. The supporting element has (i) at least one contact element for electrical contacting of the sensor system and (ii) at least one relief structure for stress decoupling, the at least one relief structure being situated in a plane parallel to the main plane of extension essentially between the at least one contact element and the sensor element.

Abstract: A device includes a first semiconductor chip and a second semiconductor chip which are connected to each other in an electrically conductive manner via a bonding wire, the bonding wire having a contact to the first semiconductor chip at a first contact point and having a contact to the second semiconductor chip at a second contact point, and the device including a further bonding wire which has a further first contact point and a further second contact point, a maximum distance between the bonding wire and a direct connecting line between the first and second contact points perpendicular to the connecting line being greater than a further maximum distance between the further bonding wire and a further connecting line between the further first contact point and the further second contact point perpendicular to the further connecting line.

Abstract: The invention relates to a microstructured sensor, having at least one measurement chip in which there is formed a first measurement area having a first measurement structure and a second measurement area having a second measurement structure, the measurement areas being offset to one another in a lateral direction, one cap chip that is fastened in vacuum-tight fashion to the measurement chip in a connecting area, one intermediate space, formed between the measurement chip and the cap chip, that is sealed outwardly by the connecting area and in which the measurement areas are situated, and at least one contact area, formed on the measurement chip, and left exposed by the cap chip, for the contacting of the measurement chip. The sensor can be in particular a gas sensor for measuring a gas concentration, or an acceleration sensor.

Abstract: An integrated component having a substrate, the substrate having a cavity which surrounds a mechanical structure. The cavity is filled by a fluid of a specific composition under a specific pressure, and the mechanical properties of the mechanical structure are influenced by the fluid.

Abstract: A micromechanical structure, a temperature and/or radiation sensor, and a method for manufacturing a micromechanical structure are suggested, the micromechanical structure including a substrate and a thermoelement having a reference contact and a measuring contact, the substrate having a main substrate plane), the thermoelement having a first material between the reference contact and the measuring contact and a second material between the measuring contact and a further reference contact, either the first material being situated over the second material or the second material being situated over the first material between the reference contact and the measuring contact in a direction perpendicular to the main substrate plane.

Abstract: An infrared sensor having at least one measuring structure, which has, for example, a sensor chip having a measuring structure and a cap chip which is attached to the sensor chip and, together with the sensor chip, defines a sensor space; a screen having an internal screen area and an external screen area surrounding the internal screen area being formed on the top side of the cap chip; the internal screen area which is transparent to the infrared radiation to be detected being formed above the measuring structure, and the external screen area being at least partly non-transparent for the incident infrared radiation. The external screen area may be designed in particular as a reflective coating of metal or a dielectric layer, as reflective structuring formed by trenches having oblique surfaces, or as absorbing structuring.

Abstract: The invention relates to a microstructured sensor, having at least one measurement chip in which there is formed a first measurement area having a first measurement structure and a second measurement area having a second measurement structure, the measurement areas being offset to one another in a lateral direction, one cap chip that is fastened in vacuum-tight fashion to the measurement chip in a connecting area, one intermediate space, formed between the measurement chip and the cap chip, that is sealed outwardly by the connecting area and in which the measurement areas are situated, and at least one contact area, formed on the measurement chip, and left exposed by the cap chip, for the contacting of the measurement chip. The sensor can be in particular a gas sensor for measuring a gas concentration, or an acceleration sensor.