Patents by Inventor Holger Hoehnemann

Holger Hoehnemann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090160009
    Abstract: Semiconductor array and method for manufacturing a semiconductor array, wherein a conductive substrate (100), an element region (400), and an insulation layer (200), isolating the element region (400) from the conductive substrate (100), are formed, a trench (700) is etched in the element region (400) as far as the insulation layer (200), the trench (700) is etched further in the insulation layer (200) as far as the conductive substrate (100), and within the trench (700), the conductive substrate (100) is at least partially etched to form conductive substrate regions (141, 142, 143, 144, 145, 146), isolated from one another.
    Type: Application
    Filed: September 28, 2006
    Publication date: June 25, 2009
    Applicant: ATMEL Germany GmbH
    Inventors: Franz Dietz, Volker Dudek, Tobias Florian, Holger Hoehnemann, Stefan Schwantes