Abstract: The invention refers to a process for loading a socket and/or adapter device with a corresponding semi-conductor component, a socket and/or adapter device, a precision alignment device, as well as a mechanism for loading a socket and/or adapter device with a corresponding semi-conductor component, whereby the mechanism comprises a device, especially a mechanical device for aligning the mechanism in relation to the socket and/or adapter device.

Abstract: A process, device and a mechanism for loading a socket and/or adapter device with a semiconductor component is disclosed. The mechanism has a device, in particular a mechanical device, for instance an appropriate attachment, for opening the socket and/or adapter device.

Abstract: The present invention is directed to SiOy flakes with 0.70?y?1.95, especially 0.70?y?1.80, very especially 1.0?y?1.8, comprising reactive centres, a process for their production, and their use for providing chemically modified SiOy flakes.

Abstract: The present invention relates to SiOz flakes, especially porous SiOz flakes, wherein 0.70?z?2.0, especially 0.95?z?2.0, comprising a polymer additive in the pores, which provides enhanced (long term) efficacy. Further aspects of the invention are a process for their preparation and a polymer composition containing such SiOz flakes.

Abstract: A front-loading machine for treating laundry includes a loading opening, a hinged door, a locking mechanism and an operating device. The loading opening is disposed on a front wall of the machine. The hinged door is receivable by a receiving area on the front wall so as to close the loading opening. The locking mechanism is configured to hold the door in a closed position. The operating device is configured to activate and deactivate the locking mechanism. The operating device includes a sensor configured to detect a contact or a contact-free incursion into a detection zone thereof. The sensor is disposed on at least one of the door and the receiving area on the front wall.

Abstract: A porthole door for a front-loading laundry appliance includes a door glass, a frame and a centering device. The door glass is curved inward toward an inside of the appliance. The frame includes an inner ring and a cover ring. The centering device is disposed on the frame and configured to bear resiliently against a peripheral edge of the door glass so as to provide a radial force acting on the door glass via the peripheral edge at various locations. The radial force brings the door glass into a centered position within the frame.

Abstract: The present invention relates to SiOz flakes, especially porous SiOz flakes, wherein 0.70?z?2.0, especially 0.95?z?2.0, comprising an organic, or inorganic antimicrobial compound, or composition, which provide enhanced (long term) antimicrobial efficacy.

Abstract: The present invention relates to luminescent SiOz, flakes, especially porous luminescent SiOz flakes, wherein 0.70?z?2.0, especially 0.95?z?2.0, comprising an organic, or inorganic luminescent compound, or composition, which can provide enhanced (long term) luminescent efficacy.

Abstract: A housing for a front-loading laundry appliance includes a front wall including a first surface and a first and a second lateral edge each having a respective second flange extending substantially parallel to the first surface. A first lateral load-bearing member abuts the first lateral edge of the front wall and a second lateral load-bearing member abuts the second lateral edge of the front wall. A supporting element is disposed in a lower portion of the housing. A respective forwardly projecting positioning element is disposed above the first supporting element at a front end of each of the first and second lateral load bearing members and has a form of a sleeve. Each of the respective second flanges of the front wall includes a respective opening configured to receive a respective one of the positioning elements.

Abstract: In a method and apparatus for loading a socket or adapter device with a semiconductor component, the semiconductor component is guided by at least one first guide element of the apparatus to the socket or adapter device in such a way that contact is made with the semiconductor component by means of the contact elements, and to an apparatus for loading a first socket or adapter device with a semiconductor component, the apparatus having one or more guide elements for producing an electrical contact between the semiconductor component and the contact elements of the first socket or adapter device.

Abstract: An adapter or socket device is disclosed. In one embodiment, the device includes contact legs or contact arms with at least two contact tips that are adapted to be alternatively contacted with the contact pins or contact balls of the semiconductor device. In a further embodiment, when loading the adapter or socket device, a specific adaptation of variable mechanism for positioning the semiconductor device to be tested is performed to a predetermined position in which the contact balls or contact pins of the device are contacted by a first group of contact tips of the adapter or socket device only. Thus, a second group of contact tips may remain unused and be spared for a later use. This way, the replacement cycles of the inventive adapter or socket devices are extended, and thus the costs for testing semiconductor devices are reduced altogether.

Abstract: The invention involves a process for loading a socket and/or adapter device with a corresponding semi-conductor component, a socket and/or adapter device, as well as a mechanism for loading a socket and/or adapter device with a corresponding semi-conductor component, where the mechanism has a device, in particular a mechanical device, for instance an appropriate attachment for opening the socket and/or adapter device.

Abstract: The invention refers to a process for loading a socket and/or adapter device with a corresponding semi-conductor component, a socket and/or adapter device, a precision alignment device, as well as a mechanism for loading a socket and/or adapter device with a corresponding semi-conductor component, whereby the mechanism comprises a device, especially a mechanical device for aligning the mechanism in relation to the socket and/or adapter device.

Abstract: The invention relates to a method for testing semiconductor devices, to a system including at least one socket or adapter device, and to a socket or adapter device, in particular for semiconductor devices, including at least one connection pin which is designed to be adapted to be connected to a corresponding contact device of a device, wherein the connection pin is designed such that it can be connected to the contact device by surface mounting, in particular by solderless surface mounting.

Abstract: The invention relates to a method for testing semiconductor devices, to a system including at least one socket or adapter device, and to a socket or adapter device, in particular for semiconductor devices, having at least one connection pin which is designed such that it is adapted to be introduced into a corresponding contact device of a device to which the socket or adapter device is to be connected, wherein the connection pin is designed such that a clamping connection is provided between the contact device and the connection pin when the connection pin is introduced into the contact device.

Abstract: The invention relates to a testing apparatus, a testing system and a testing method, in particular for testing the contacting between a semiconductor device and a carrier. The invention includes loading of a carrier with a semiconductor device, such that the contacting between the carrier and the semiconductor device is tested immediately after the loading of the carrier with the semiconductor device.