Patents by Inventor HOLGER KUEHNLEIN

HOLGER KUEHNLEIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method For Texturing A Surface Of A Semiconductor Material And Device For Carrying Out The Method
    Publication number: 20200044100
    Abstract: A method textures at least one portion of a surface of a semiconductor material, according to which the at least one portion of the surface is brought into contact with an etching solution. The portion of the surface is electrically conductively connected to a plus pole of a current source and is used as a positive electrode. A negative electrode located in the etching solution is electrically conductively connected to a minus pole of the current source and electric current is carried from the plus pole to the minus pole and the at least one portion of the surface is thus electrochemically etched. A device is provided for carrying out the method.
    Type: Application
    Filed: February 8, 2018
    Publication date: February 6, 2020
    Inventors: BENEDIKT STRAUB, JOHN BURSCHIK, WOLFGANG DUEMPELFELD, HOLGER KUEHNLEIN
  • CONTINUOUS DEPOSITION INSTALLATION AND ASSEMBLY FOR SAME
    Publication number: 20190338439
    Abstract: A continuous separation installation for the galvanic deposition of a substance on objects includes contacting devices having at least one electrically conductive contact arm. The contacting devices are arranged in areas of the continuous separation installation which are free from an electrolyte used for the galvanic deposition of the substance. There is also described an assembly for a continuous separation installation.
    Type: Application
    Filed: December 8, 2017
    Publication date: November 7, 2019
    Inventors: MICHAEL PASSIG, MARKUS SIEBER, NORBERT BAY, JOHN BURSCHIK, DAMIAN PYSCH, WOLFGANG DUEMPELFELD, MARKUS UIHLEIN, HOLGER KUEHNLEIN, THOMAS HIRT, ANDREAS KETTERER
  • Metal plating composition and method for the deposition of copper—zinc—tin suitable for manufacturing thin film solar cell
    Patent number: 9263609
    Abstract: To be able to form a copper-zinc-tin alloy which optionally comprises at least one chalcogenide and thus forms a semiconductor without the use of toxic substances a metal plating composition for the deposition of a copper-zinc-tin alloy is disclosed, wherein said metal plating composition comprises at least one copper plating species, at lease one zinc plating species, at least one tin plating species and at least one complexing agent and further, if the alloy contains at least one chalcogen, at least one chalcogen plating species.
    Type: Grant
    Filed: May 15, 2007
    Date of Patent: February 16, 2016
    Assignee: Atotech Deutschland GmbH
    Inventors: Holger Kühnlein, Jörg Schulze, Torsten Voss
  • Metal Plating Composition and Method for the Deposition of Copper-Zinc-Tin Suitable for Manufacturing Thin Film Solar Cell
    Publication number: 20090205714
    Abstract: To be able to form a copper-zinc-tin alloy which optionally comprises at least one chalcogenide and thus forms a semiconductor without the use of toxic substances a metal plating composition for the deposition of a copper-zinc-tin alloy is disclosed, wherein said metal plating composition comprises at least one copper plating species, at lease one zinc plating species, at least one tin plating species and at least one complexing agent and further, if the alloy contains at least one chalcogen, at least one chalcogen plating species.
    Type: Application
    Filed: May 15, 2007
    Publication date: August 20, 2009
    Inventors: Holger Kühnlein, Jörg Schulze, Torsten Voss