Patents by Inventor Holger N. Klein
Holger N. Klein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11522339Abstract: A method or apparatus for narrowing the linewidth of a single mode laser is provided. The linewidth of a single mode laser is narrowed by injecting an optical feedback simultaneously into the first laser cavity mirror and the second laser cavity mirror of the single mode laser.Type: GrantFiled: August 16, 2020Date of Patent: December 6, 2022Assignee: OE Solutions America, Inc.Inventors: Holger N. Klein, Nicolas Volet
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Publication number: 20210050709Abstract: A method or apparatus for narrowing the linewidth of a single mode laser is provided. The linewidth of a single mode laser is narrowed by injecting an optical feedback simultaneously into the first laser cavity mirror and the second laser cavity mirror of the single mode laser.Type: ApplicationFiled: August 16, 2020Publication date: February 18, 2021Applicant: OE Solutions America, Inc.Inventors: Holger N. KLEIN, Nicolas VOLET
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Patent number: 10678005Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.Type: GrantFiled: January 16, 2019Date of Patent: June 9, 2020Assignee: Elenion Technologies, LLCInventors: David Henry Kinghorn, Ari Jason Novack, Holger N. Klein, Nathan A. Nuttall, Kishor V. Desai, Daniel J. Blumenthal, Michael J. Hochberg, Ruizhi Shi
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Publication number: 20200057216Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.Type: ApplicationFiled: October 28, 2019Publication date: February 20, 2020Inventors: Nathan A. Nuttall, Daniel J. Blumenthal, Ari Novack, Holger N. Klein
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Patent number: 10495830Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.Type: GrantFiled: June 20, 2018Date of Patent: December 3, 2019Assignee: Elenion Technologies, LLCInventors: Nathan A. Nuttall, Daniel J. Blumenthal, Ari Novack, Holger N. Klein
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Publication number: 20190179091Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.Type: ApplicationFiled: January 16, 2019Publication date: June 13, 2019Inventors: David Henry Kinghorn, Ari Jason Novack, Holger N. Klein, Nathan A. Nuttall, Kishor V. Desai, Daniel J. Blumenthal, Michael J. Hochberg, Ruizhi Shi
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Patent number: 10222565Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.Type: GrantFiled: October 13, 2017Date of Patent: March 5, 2019Assignee: Elenion Technologies, LLCInventors: David Henry Kinghorn, Ari Jason Novack, Holger N. Klein, Nathan A. Nuttall, Kishor V. Desai, Daniel J. Blumenthal, Michael J. Hochberg, Ruizhi Shi
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Publication number: 20180314017Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.Type: ApplicationFiled: June 20, 2018Publication date: November 1, 2018Inventors: Nathan A. Nuttall, Daniel J. Blumenthal, Ari Novack, Holger N. Klein
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Patent number: 10025045Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.Type: GrantFiled: March 23, 2017Date of Patent: July 17, 2018Assignee: Elenion Technologies, LLCInventors: Nathan A. Nuttall, Daniel J. Blumenthal, Ari Novack, Holger N. Klein
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Publication number: 20180052290Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.Type: ApplicationFiled: October 13, 2017Publication date: February 22, 2018Inventors: David Henry Kinghorn, Ari Jason Novack, Holger N. Klein, Nathan A. Nuttall, Kishor V. Desai, Daniel J. Blumenthal, Michael J. Hochberg, Ruizhi Shi
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Patent number: 9817197Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.Type: GrantFiled: March 31, 2016Date of Patent: November 14, 2017Assignee: Elenion Technologies, LLCInventors: David Henry Kinghorn, Ari Jason Novack, Holger N. Klein, Nathan A. Nuttall, Kishor V. Desai, Daniel J. Blumenthal, Michael J. Hochberg, Ruizhi Shi
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Publication number: 20170205594Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.Type: ApplicationFiled: March 23, 2017Publication date: July 20, 2017Inventors: Nathan A. Nuttall, Daniel J. Blumenthal, Ari Novack, Holger N. Klein
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Patent number: 9638859Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.Type: GrantFiled: January 12, 2016Date of Patent: May 2, 2017Assignee: Elenion Technologies, LLCInventors: Nathan A. Nuttall, Daniel J. Blumenthal, Ari Novack, Holger N. Klein
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Publication number: 20160291265Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.Type: ApplicationFiled: March 31, 2016Publication date: October 6, 2016Inventors: David Henry Kinghorn, Ari Jason Novack, Holger N. Klein, Nathan A. Nuttall, Kishor V. Desai, Daniel J. Blumenthal, Michael J. Hochberg, Ruizhi Shi