Abstract: A method for generating software for a hardware component of a measuring, control, or regulating system having a processor, an FPGA, and a plurality of I/O channels. The I/O channels are connected to the FPGA and the FPGA is connected to the processor via a communications interface. The method includes the steps of selecting a first subset of the I/O channels for operation by the FPGA, generating a first application for execution in the FPGA, selecting a second subset of the I/O channels for operation by the processor, and generating a second application for execution on the processor. The step of generating a first application comprises generating code for connecting the second subset of I/O channels to the communications interface. The invention relates in addition to a method for operating a hardware component.

Abstract: A method for generating software for a hardware component of a measuring, control, or regulating system having a processor, an FPGA, and a plurality of I/O channels. The I/O channels are connected to the FPGA and the FPGA is connected to the processor via a communications interface. The method includes the steps of selecting a first subset of the I/O channels for operation by the FPGA, generating a first application for execution in the FPGA, selecting a second subset of the I/O channels for operation by the processor, and generating a second application for execution on the processor. The step of generating a first application comprises generating code for connecting the second subset of I/O channels to the communications interface. The invention relates in addition to a method for operating a hardware component.

Abstract: In the measurement of sensor elements in a wafer composite, whereby non-electric stimuli are to be applied to the sensor elements, a semiconductor wafer having a multitude of sensor elements, each sensor element having a voltage supply connection, a grounded connection, and at least one sensor signal output, is configured such that a bus system is integrated in the semiconductor wafer, to which bus system at least the grounded connections of the sensor elements are connected and via which a supply voltage may be applied to the sensor elements, and that each sensor element is equipped with at least one controllable switching element for selecting the sensor element, so that only a selected sensor element supplies a sensor signal to a diagnosis device.

Abstract: In the measurement of sensor elements in a wafer composite, whereby non-electric stimuli are to be applied to the sensor elements, a semiconductor wafer having a multitude of sensor elements, each sensor element having a voltage supply connection, a grounded connection, and at least one sensor signal output, is configured such that a bus system is integrated in the semiconductor wafer, to which bus system at least the grounded connections of the sensor elements are connected and via which a supply voltage may be applied to the sensor elements, and that each sensor element is equipped with at least one controllable switching element for selecting the sensor element, so that only a selected sensor element supplies a sensor signal to a diagnosis device.