Patents by Inventor Holli A. Gonder-Jones

Holli A. Gonder-Jones has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COATED SUBSTRATES AND METHODS OF PREPARING THE SAME
    Publication number: 20230167311
    Abstract: The present invention relates to a substrate having (a) a first material applied to at least a portion of the substrate, and (b) a coating layer deposited from a powder coating composition including a film-forming resin, and optionally a thermally conductive, electrically insulative filler material and/or a crosslinker that is reactive with the film-forming resin, in direct contact with at least a portion of the substrate to which the first material has been applied. The first material is (i) a catalyst that catalyzes cure of the powder coating composition, (ii) a component reactive with the film-forming resin and/or the crosslinker of the powder coating composition, and/or (iii) a rheology modifier.
    Type: Application
    Filed: February 26, 2021
    Publication date: June 1, 2023
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Brian E. Woodworth, John R. Schneider, Anthony M. Chasser, Liang Ma, Calum H. Munro, Marvin M. Pollum, Jr., Maria S. French, Allison G. Condie, Holli A. Gonder-Jones, Daniel K. Dei, Christopher Apanius, Cassandra Noelle Bancroft
  • TWO-LAYER DIELECTRIC COATING
    Publication number: 20230143426
    Abstract: The present invention is directed towards a system for coating a substrate comprising an electrodepositable coating composition and a powder coating composition. Also disclosed are coated substrates comprising a first coating layer comprising an electrodepositable coating layer, and a second coating layer comprising a powder coating layer on at least a portion of the first coating layer, as well as methods of coating substrates.
    Type: Application
    Filed: February 26, 2021
    Publication date: May 11, 2023
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Sijmen J. Visser, Brian E. Woodworth, Holli A. Gonder-Jones, John R. Schneider, Kelly L. Moore, Mark L. Follet, Liang Ma, Calum H. Munro, Marvin M. Pollum, JR., Maria S. French, Allison G. Condie, Amy E. Harrison, Irina G. Schwendeman, Daniel K. Dei, Cassandra Noelle Bancroft, Christopher Apanius, Kevin T. Sylvester, Corey J. Dedomenic, Egle Puodziukynaite
  • THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATING POWDER COATING COMPOSITIONS
    Publication number: 20230115050
    Abstract: The present invention is directed towards a powder coating composition comprising a binder; a thermally conductive, electrically insulative filler material; and, optionally, a thermoplastic material and/or a core-shell polymer. The present invention is also directed to a substrate comprising a coating layer deposited from the powder coating composition of the present invention, as well as methods of coating a substrate.
    Type: Application
    Filed: February 26, 2021
    Publication date: April 13, 2023
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Liang Ma, Calum H. Munro, Marvin M. Pollum, JR., Daniel K. Dei, Brian E. Woodworth, John R. Schneider, Maria S. French, Allison G. Condie, Holli A. Gonder-Jones, Christopher Apanius, Cassandra Noelle Bancroft