Abstract: An image capturing method and apparatus for pattern recognition of an electronic device are provided in which an electronic device is moved relative to a vision system for positioning the vision system over a target position on the electronic device, and when the vision system is positioned to view the target position, the vision system is operative to capture an image of the target position while the electronic device is undergoing relative motion with respect to the vision system without stopping. Thus, the time taken for pattern recognition can be significantly reduced.

Abstract: An image capturing method and apparatus for pattern recognition of an electronic device are provided in which an electronic device is moved relative to a vision system for positioning the vision system over a target position on the electronic device, and when the vision system is positioned to view the target position, the vision system is operative to capture an image of the target position while the electronic device is undergoing relative motion with respect to the vision system without stopping. Thus, the time taken for pattern recognition can be significantly reduced.

Abstract: A wire bonding method and apparatus are provided for electronic components to enable PR processing and wire bonding to be carried out substantially concurrently. The apparatus comprises a bond head carrying a bonding tool for performing wire bonding and a rotary motor coupled to the bond head that is configured to change an angular orientation of the bonding tool relative to an electronic component to be bonded. There are first and second carriers for respectively mounting electronic components for wire bonding, and an optical system is arranged and configured to view bonding points on an electronic component mounted on the first carrier when the bonding tool is located over an electronic component mounted on the second carrier to perform wire bonding.

Abstract: Wedge wire bonding apparatus are disclosed with an improved configuration in which the transducer axis lies on a line that bisects the XY axes, and the operator views the bonding process by looking directly along the axis of the transducer. The result is a shorter bonding cycle time as time is saved as the bonding head moves from a first to a second bonding position while at the same time the operator is placed in the best possible position for viewing the bonding operation, which facilitates in particular any necessary alignment and set-up steps.