Patents by Inventor Hon Wah Chew

Hon Wah Chew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE WITH EMBEDDED CAPACITORS
    Publication number: 20230411385
    Abstract: An apparatus is provided which comprises: one or more dielectric layers forming a substrate, one or more first conductive contacts on a top surface of the substrate, one or more second conductive contacts on a bottom surface of the substrate opposite of the top surface, and one or more discrete capacitors conductively coupled with one or more of the first and second conductive contacts, the one or more discrete capacitors embedded within the substrate between the top surface and the bottom surface. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: September 5, 2023
    Publication date: December 21, 2023
    Applicant: Intel Corporation
    Inventors: Seok Ling LIM, Jenny Shio Yin ONG, Tin Poay CHUAH, Hon Wah CHEW
  • PACKAGE WITH EMBEDDED CAPACITORS
    Publication number: 20190006356
    Abstract: An apparatus is provided which comprises: one or more dielectric layers forming a substrate, one or more first conductive contacts on a top surface of the substrate, one or more second conductive contacts on a bottom surface of the substrate opposite of the top surface, and one or more discrete capacitors conductively coupled with one or more of the first and second conductive contacts, the one or more discrete capacitors embedded within the substrate between the top surface and the bottom surface. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: May 24, 2018
    Publication date: January 3, 2019
    Applicant: Intel Corporation
    Inventors: Seok Ling Lim, Jenny Shio Yin Ong, Tin Poay Chuah, Hon Wah Chew