Abstract: An optoelectronic device includes a semiconductor die that includes a substrate layer, a laser diode, first and second conducting pads, a cathode pad, an anode pad, and a passivation layer. The laser diode and the conducting pads are formed on the substrate layer. The formation of the conducting pads directly on the substrate layer offers an increased area for heat dissipation. The cathode pad is formed on the first conducting pad whereas the anode pad is formed above the second conducting pad. The passivation layer is formed above the laser diode. The attachment of the semiconductor die to a submount of the optoelectronic device occurs by way of the cathode pad and the anode pad. After the attachment, a free space is created directly between the passivation layer and the submount to reduce the impact of solder bonding stress on the laser diode.

Abstract: An optoelectronic device includes a semiconductor die that includes a substrate layer, a laser diode, first and second conducting pads, a cathode pad, an anode pad, and a passivation layer. The laser diode and the conducting pads are formed on the substrate layer. The formation of the conducting pads directly on the substrate layer offers an increased area for heat dissipation. The cathode pad is formed on the first conducting pad whereas the anode pad is formed above the second conducting pad. The passivation layer is formed above the laser diode. The attachment of the semiconductor die to a submount of the optoelectronic device occurs by way of the cathode pad and the anode pad. After the attachment, a free space is created directly between the passivation layer and the submount to reduce the impact of solder bonding stress on the laser diode.

Abstract: A photonic integrated circuit (PIC) includes various mode field adapters (MFAs), a waveguide, and various contact pads. All the MFAs are on a same facet of the PIC. One MFA of the PIC outputs a first optical signal that is an amplified version of a second optical signal. The waveguide is divided into two waveguide arms and a bend portion to join the two waveguide arms. The waveguide extends between the MFAs such that the second optical signal propagates through the waveguide. Further, each waveguide arm is formed between the contact pads. The second optical signal propagating through the waveguide is amplified based on a current that is injected in the PIC by way of the contact pads.