Abstract: An electrolytic capacitor includes a capacitor element. The capacitor element includes an anode part, a cathode part, and an intermediate part. The anode part includes a first portion that is a part of an anode body having a porous region, and a first dielectric layer. The intermediate part includes a second portion of the anode body, a second dielectric layer, and a first insulating member containing a first resin component. The cathode part includes a third portion of the anode body, a third dielectric layer, a solid electrolyte layer covering at least a part of the third dielectric layer, and a cathode lead-out layer covering at least a part of the solid electrolyte layer. The first resin component contains a curing product of a first reactive compound. At least a part of the first insulating member is disposed in pores of the porous region in the intermediate part.

Abstract: An electrolytic capacitor includes a capacitor element, a case housing the capacitor element, and a first heat radiation layer having an insulating property. The first heat radiation layer covers at least part of the capacitor element. A thermal conductivity ?C of the case in a thickness direction is greater than or equal to 1 W/m·K. A thermal emissivity ?1 of the first heat radiation layer is greater than or equal to 0.7.

Abstract: A resin composition having excellent heat dissipation can be used in an electronic component and an electronic device. The resin composition includes a silicone resin, an inorganic filler, and an inorganic pigment particle. The inorganic filler includes a first filler having thermal emissivity, and a second filler having thermal conductivity. The second filler is contained in a volume ratio of 2.5 or more and 4.0 or less with respect to the first filler. The inorganic filler is contained in a proportion of 46.8 volume % or more and 76.3 volume % or less with respect to the combined volume of the silicone resin, the inorganic filler, and the inorganic pigment particle.

Abstract: A resin composition having excellent heat dissipation can be used in an electronic component and an electronic device. The resin composition includes a silicone resin, an inorganic filler, and an inorganic pigment particle. The inorganic filler includes a first filler having thermal emissivity, and a second filler having thermal conductivity. The second filler is contained in a volume ratio of 2.5 or more and 4.0 or less with respect to the first filler. The inorganic filler is contained in a proportion of 46.8 volume % or more and 76.3 volume % or less with respect to the combined volume of the silicone resin, the inorganic filler, and the inorganic pigment particle.