Abstract: A positive electrode active material for a secondary battery includes a lithium composite transition metal oxide including nickel (Ni), cobalt (Co), and manganese (Mn), wherein the lithium composite transition metal oxide has a layered crystal structure of space group R3m, includes the nickel (Ni) in an amount of 60 mol % or less based on a total amount of transition metals, includes the cobalt (Co) in an amount greater than an amount of the manganese (Mn), and is composed of single particles.

Abstract: A positive electrode active material precursor having a uniform particle size distribution and represented by Formula 1, wherein a percentage of fine powder with an average particle diameter (D50) of 1 ?m or less is generated when the positive electrode active material precursor is rolled at 2.5 kgf/cm2 is less than 1%, and an aspect ratio is 0.93 or more, and a method of preparing the positive electrode active material precursor [NixCoyM1zM2w](OH)2 ??[Formula 1] in Formula 1, 0.5?x<1, 0<y?0.5, 0<z?0.5, and 0?w?0.1, M1 includes at least one selected from the group consisting of Mn and Al, and M2 includes at least one selected from the group consisting of Zr, B, W, Mo, Cr, Nb, Mg, Hf, Ta, La, Ti, Sr, Ba, Ce, F, P, S, and Y. A method of preparing the positive electrode active material precursor is also provided.

Abstract: A field emission assembly and an electromagnetic wave generator are provided, the field emission assembly includes a linear emitter which includes carbon nanotube (CNT) fibers and emits electrons and a holder configured to fix the emitter, both ends of the emitter are fixed to the holder, and the emitter includes at least one of a curved portion so as to form a peak in an electron emission direction and a bent portion so as to form a peak in the electron emission direction.

Abstract: An emitter, a field emission assembly, and an electromagnetic wave generator are provided, and the emitter is an emitter for emitting electrons in an electromagnetic wave generator and is in the form of a sheet in which a plurality of yarns including carbon nanotube (CNT) fibers are weaved.

Abstract: The present invention related to a cooking device having a cooking glass bowl, wherein the cooking glass bowl has a large weight to improve the safety of the cooling device during operation of the cooling device equipped with a high-speed motor.

Abstract: The present invention related to a cooking device having a cooking glass bowl, wherein the cooking glass bowl has a large weight to improve the safety of the cooling device during operation of the cooling device equipped with a high-speed motor.

Abstract: A semiconductor package or device includes a leadframe defining a plurality of leads which are arranged and partially etched in a manner facilitating a substantial reduction in burr formation resulting from a saw singulation process used to complete the fabrication of the semiconductor device. In one embodiment, the semiconductor device includes a die pad defining multiple peripheral edge segments. In addition, the semiconductor device includes a plurality of leads that are provided in a prescribed arrangement. At least one semiconductor die is connected to the top surface of the die pad and further electrically connected to at least some of the leads. At least portions of the die pad, the leads, the lands, and the semiconductor die are encapsulated by the package body, with at least portions of the bottom surfaces of the die pad and the leads being exposed in a common exterior surface of the package body.

Abstract: Disclosed is a food processing and cooking apparatus comprising: a container module having a rotary blade for crushing a food material contained in an inner space; a housing module formed by the coupling of an upper housing for supporting the container module and a lower housing coupled to the upper housing; and a power module mounted by a base bracket on the inner space of the housing module and transmitting power generated by the motor to a power-transmitting unit to rotate the rotating blade, wherein the container module is detachably mounted while preventing from being shaken by a mounting groove of the upper housing, the power module is configured such that vibration and noise are reduced by the anti-vibration member, and the food material is cooked using a heater provided in the container module or the housing module.

Abstract: A semiconductor package or device including a uniquely configured leadframe defining a plurality of leads which are arranged and partially etched in a manner facilitating a substantial reduction in burr formation resulting from a saw singulation process used to complete the fabrication of the semiconductor device. The semiconductor device includes a die pad defining multiple peripheral edge segments. In addition, the semiconductor device includes a plurality of leads which are provided in a prescribed arrangement. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads. At least portions of the die pad, the leads, the lands, and the semiconductor die are encapsulated by the package body, with at least portions of the bottom surfaces of the die pad and the leads being exposed in a common exterior surface of the package body.

Abstract: In one embodiment, a micro lead frame structure includes one or more stiffness reinforcing structures formed on leads and/or connecting structures. The stiffness reinforcing structures can be formed by leaving predetermined portions of the micro lead frame at full thickness including, for example, portions of an inner lead, portions of an outer lead, and portions of a connecting bar, combinations thereof, and other structures. The stiffness reinforcing structures are configured to reduce deformation defects and electrical short defects caused by assembly processes.

Abstract: The memory system includes at least one volatile memory configured to store data. The memory system also includes a non-volatile memory controller configured to provide a control signal to allow the data to be stored in a non-volatile memory during a power interruption mode. In addition, the memory system includes a termination resistor (TER) configured to control a data path in response to a power interruption signal.

Abstract: In one embodiment, a micro lead frame structure includes one or more stiffness reinforcing structures formed on leads and/or connecting structures. The stiffness reinforcing structures can be formed by leaving predetermined portions of the micro lead frame at full thickness including, for example, portions of an inner lead, portions of an outer lead, and portions of a connecting bar, combinations thereof, and other structures. The stiffness reinforcing structures are configured to reduce deformation defects and electrical short defects caused by assembly processes.

Abstract: In one embodiment, a micro lead frame structure includes one or more stiffness reinforcing structures formed on leads and/or connecting structures. The stiffness reinforcing structures can be formed by leaving predetermined portions of the micro lead frame at full thickness including, for example, portions of an inner lead, portions of an outer lead, and portions of a connecting bar, combinations thereof, and other structures. The stiffness reinforcing structures are configured to reduce deformation defects and electrical short defects caused by assembly processes.

Abstract: The memory system includes at least one volatile memory configured to store data. The memory system also includes a non-volatile memory controller configured to provide a control signal to allow the data to be stored in a non-volatile memory during a power interruption mode. In addition, the memory system includes a termination resistor (TER) configured to control a data path in response to a power interruption signal.

Abstract: A latency control circuit includes: a delay locked loop (DLL) configured to generate a DLL clock signal by delaying a clock signal by a delay time varied according to any one of dual locking points, and generate a loop change signal according to a locking point change; a control unit configured to generate a latency control signal in response to a reset signal, a delay signal generated by delaying the reset signal by a first delay time, and the loop change signal; and a latency signal generation unit configured to adjust a latency of a command signal in response to the latency control signal and output a latency signal.

Abstract: In one embodiment, a micro lead frame structure includes one or more stiffness reinforcing structures formed on leads and/or connecting structures. The stiffness reinforcing structures can be formed by leaving predetermined portions of the micro lead frame at full thickness including, for example, portions of an inner lead, portions of an outer lead, and portions of a connecting bar, combinations thereof, and other structures. The stiffness reinforcing structures are configured to reduce deformation defects and electrical short defects caused by assembly processes.

Abstract: A mobile communication device includes a body, a first QWERTY key unit having a plurality of QWERTY keys to input alphabets, numbers, and symbols, and a second QWERTY key unit having a plurality of the QWERTY keys to input alphabets, numbers, and symbols. The first QWERTY key unit is fitted on a first end of the body to be pivotally folded backward and forward with respect to the body. The second QWERTY key unit is fitted on a second end of the body to be pivotally folded backward and forward with respect to the body.

Abstract: A mobile terminal including an input device using a piezoelectric sensor and a method of operating the mobile terminal are provided. The mobile terminal includes: a body; and a piezoelectric sensor unit including a first piezoelectric sensor positioned at a first side surface of the body and to which at least one function key for performing a first specific function corresponding to a user function of the mobile terminal is set and a second piezoelectric sensor positioned at a second side surface of the body and to which at least one function key for performing a second specific function different to the first specific function is set.

Abstract: A mobile terminal having a rear keypad is provided. The mobile terminal includes: a main body having a front surface and a rear surface opposite to the front surface; a touch screen disposed at the front surface of the main body; and a key input device having a keypad disposed at the rear surface of the main body and extendable outwards to sides of the touch screen.

Abstract: A semiconductor memory apparatus includes a first data selection section inputted with the first data and second data and output one of the first data and the second data as first selection data in response to an address signal, a second data selection section inputted with the second data and the first selection data and output one of the second data and the first selection data as second selection data depending upon an input and output mode, and a data output section configured to be inputted with the first and second selection data and output first and second output data.