Patents by Inventor Hong Bean PARK

Hong Bean PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPONENT GROUNDING SYSTEM
    Publication number: 20230292477
    Abstract: A component grounding system according to one embodiment includes a case for accommodating a plurality of components, a direct current (DC) capacitor disposed on one side of the case and electrically connected to the case, and a bus bar, disposed between the case and the DC capacitor, for connecting the case and the DC capacitor, the bus bar representing an electrode, wherein each of the plurality of components may be connected to the bus bar.
    Type: Application
    Filed: August 12, 2021
    Publication date: September 14, 2023
    Inventors: Yong Hee PARK, Hong Bean PARK, Hong Ju JUNG