Abstract: The present invention relates to an integrated circuit package component with ball conducting joints, includes a substrate and a plurality of solder joints. The solder joints are installed on one surface of the substrate. The solder joints are arranged to form a concentric array having a first zone and a second zone, the second zone encircles the first zone. The soldering area of any solder joint in the first zone of the concentric array is smaller than that of any solder joint in the second zone of the concentric array.

Abstract: An integrated circuit package component with lateral conductive pins includes a package body having a middle conductive pin, an initial conductive pin and a final conductive pin. The middle conductive pin, the initial conductive pin and the final conductive pin are all disposed on a lateral side of the package body and respectively have a first soldering portion, a second soldering portion, and a third soldering portion, in which the middle conductive pin is arranged between the initial conductive pin and the final conductive pin, and an area of the middle conductive pin is smaller than that of the second soldering portion area and the third soldering portion in size.