Patents by Inventor Hong C. Kim

Hong C. Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal or plastic-clad polyvinyl resin laminates
    Patent number: 4916016
    Abstract: A metal foil or plastic film clad reinforced resin susbstrate which is made by the process of injection molding a polymerizing resin solution under pressure in a closed heated mold cavity having at least one surface covered by a metal foil or plastic film. These laminates are useful as electrical circuit board and EMI/RFI shielding components.
    Type: Grant
    Filed: February 18, 1987
    Date of Patent: April 10, 1990
    Assignee: ICI Americas Inc.
    Inventors: William W. Bristowe, Hong C. Kim
  • Polyimide/polyetherimide resin blends
    Patent number: 4816526
    Abstract: Polyimide copolymers which are reaction products of active methylene compounds and N,N'-bismaleimide derivatives are improved by incorporating them with 2-20% by weight of a polyetherimide polymer having arylimide bonds, arylene bonds and ether bonds. The polymer blend is useful in films, moldings, prepregs, laminates and filled composites which are particularly useful in structural components which have stability at high temperatures.
    Type: Grant
    Filed: December 8, 1986
    Date of Patent: March 28, 1989
    Assignee: ICI Americas Inc.
    Inventors: William W. Bristowe, Hong C. Kim
  • Polyimide/aromatic sulfone resin blends and prepegs coated therewith
    Patent number: 4757120
    Abstract: Polyimide polymers which are reaction products of active methylene compounds and N,N'-bismaleimide derivatives are improved by incorporating them with 2 to 15% by weight of a polyethersulfone polymer. The polymer blend is useful in producing films, moldings, prepegs, laminates and filled composites which are particularly useful in structural components which have stability at high temperatures.
    Type: Grant
    Filed: October 3, 1986
    Date of Patent: July 12, 1988
    Assignee: ICI Americas Inc.
    Inventors: William W. Bristowe, Hong C. Kim