Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.

Abstract: A chip package which includes a glass fiber substrate made of FR-4 fiberglass is provided. The chip package further includes a substrate pad which is a stacked metal structure with a certain thickness and composed of a nickel layer, a palladium layer, and a gold layer, or a nickel layer and a gold layer stacked over at least one first circuit layer in turn. A total thickness of the substrate pad is 3.15-5.4 ?m. The glass fiber substrate and the substrate pad can bear positive pressure generated during wire bonding. Thereby at least one solder joint is formed on the substrate pad precisely and integrally. This helps reduction in material cost for manufacturers.

Abstract: A chip package having die pads with protective layers is provided. At least one protective layer is covering and arranged at a peripheral zone of at least one die pad for minimizing area of the die pad exposed outside as well as shielding and protecting the peripheral zone of the die pad. A weld zone of the die pad is not covered by the protective layer so that the weld zone of the die pad is exposed. In a crossed-over state, one of bonding wires crossing one of the die pads with a corresponding connection pad of a carrier plate will not get across a second upper space defined by the weld zone of the rest of the die pads. Thereby the one of the bonding wires can be more isolated by the protective layers on the peripheral zones of the rest of the die pads.

Abstract: A chip package with at least one electromagnetic interference (EMI) shielding layer and at least one ground wire and a method of manufacturing the same are provided. The chip package includes a chip package unit, at least one EMI shielding layer, and at least one ground wire. The ground wire which consists of a first end and a second end opposite to the first end is inserted through the EMI shielding layer and a first insulating layer of the chip package unit. The first end is electrically connected with the EMI shielding layer while the second end of the ground wire is electrically connected with at least one grounding end of at least one first circuit layer of the chip package unit for protection against static electricity. Thereby malfunction of an electronic system with semiconductor chips due to static electricity can be avoided.

Abstract: A universal serial bus (USB) hub supporting multiple hosts and an automobile head unit using the same are provided. A USB hub circuit is set in the USB hub, which is coupled to external connectors through a bus matrix. Herein, an upstream port connector of the USB hub is coupled to the automobile head unit. When one device is coupled to a downstream port requests to serve as a host, the bus matrix couples the downstream port, coupled to the requesting device, to an upstream port of the USB hub circuit, and couples the downstream port to the automobile head unit to make the automobile head unit serve as the device.

Abstract: A universal serial bus (USB) hub supporting multiple hosts and an automobile head unit using the same are provided. A USB hub circuit is set in the USB hub, which is coupled to external connectors through a bus matrix. Herein, an upstream port connector of the USB hub is coupled to the automobile head unit. When one device is coupled to a downstream port requests to serve as a host, the bus matrix couples the downstream port, coupled to the requesting device, to an upstream port of the USB hub circuit, and couples the downstream port to the automobile head unit to make the automobile head unit serve as the device.

Abstract: A computer system unaffected by memory module instability. The computer system writes data to a plurality of memory modules. If non-recoverable errors occur in one memory module or the number of errors in one memory module reaches a preset value, the computer system reads data from another memory module. Also, a method of controlling the memory modules is disclosed.

Abstract: A computer system unaffected by memory module instability. The computer system writes data to a plurality of memory modules. If non-recoverable errors occur in one memory module or the number of errors in one memory module reaches a preset value, the computer system reads data from another memory module. Also, a method of controlling the memory modules is disclosed.

Abstract: The present invention relates to a hands free microphone and earphone comprising an ear-hook device and an earpiece. One end of the ear-hook device is provided with a ball-like protruded section, and the circumferential edge thereof has a recessed T-shaped slot, and the circumferential edge of the earpiece is appropriately provided with a mounting section with a protruded peg mounted at the inner wall such that the protruded peg can slide within the T-shaped slot. Thus, when the protruded section and the mounting section are formed integrally as one unit, the earpiece can be rotated or swing in an indefinite angle. Due to the restriction of the protruded peg, the signal wire will not be broken because of excessive winding. Thus in application, the user can be comfortably used the earpiece and an excellent reception quality is obtained.