Abstract: An inductive electroacoustic transducer which includes a yoke, a magnetic circuit system disposing in the yoke, a vibration membrane which is driven by the magnetic circuit system, a cover coupled on one side of the yoke and it has a plurality of sound holes, and a circuit board which has a positive pole and a negative pole for importing acoustic electrical signals. The circuit board also has an inductive soldering disc and it is coupled to another side of the yoke. A portion of the yoke is connected to the inductive soldering disc with which it is conducted.

Abstract: An inductive electroacoustic transducer which includes a yoke, a magnetic circuit system disposing in the yoke, a vibration membrane which is driven by the magnetic circuit system, a cover coupled on one side of the yoke and it has a plurality of sound holes, and a circuit board which has a positive pole and a negative pole for importing acoustic electrical signals. The circuit board also has an inductive soldering disc and it is coupled to another side of the yoke. A portion of the yoke is connected to the inductive soldering disc with which it is conducted.

Abstract: An earphone set includes a main device having a digital signal processor, and an earplug has an external microphone and a speaker electrically connected with the digital signal processor respectively. The external microphone converts an external sound wave into an electronic signal and transmits the electronic signal to the digital signal processor for processing. The speaker converts the electronic signal processed by the digital signal processor into a sound wave for output.

Abstract: An earpiece device includes a housing having a sound output portion, a speaker and a microphone. The speaker disposed in the housing includes a diaphragm and a sound transmitting hole. The diaphragm is located between the sound output portion and the sound transmitting hole. The microphone is disposed in the housing and covers the sound transmitting hole. A sound wave generated within an ear canal would be received by the speaker and delivered through the sound transmitting hole to the microphone for pickup.

Abstract: An acoustic transducer device is provided. The device includes a body, a speaker, a microphone, and a processor. The body has a cavity, a sound exit, and a sound entrance. The cavity interflows with the sound exit and accommodates the speaker. The microphone is disposed within the body beside the speaker. The microphone interflows selectively with the cavity or the sound entrance. The processor is electrically connected to the speaker and the microphone. When the microphone interflows with the cavity, the microphone receives a sound signal generated from the cavity and transmits the sound signal to the processor for cancelling noise in the cavity. When the microphone interflows with the sound exit, the microphone receives an external sound signal and transmits the external sound signal to the processor for cancelling noise from the external.

Abstract: An exemplary magnetic diaphragm is applied to an electro-acoustic transducer. The magnetic diaphragm has a base formed with a magnetic layer thereon by a film deposition method. The base with the magnetic layer thus has magnetism to interference with a magnetic circuit of the electro-acoustic transducer. A manufacture method of the magnetic diaphragm is also disclosed.

Abstract: A diaphragm of an electro-acoustic transducer is provided. The diaphragm of the electro-acoustic transducer includes a central portion and a peripheral portion. The rigidity of the central portion is greater than the peripheral portion, such that the diaphragm has different rigidity characteristics, and thus gets better high-frequency performance and better sensitivity.

Abstract: An acoustic transducer device is provided. The device includes a body, a speaker, a microphone, and a processor. The body has a cavity, a sound exit, and a sound entrance. The cavity interflows with the sound exit and accommodates the speaker. The microphone is disposed within the body beside the speaker. The microphone interflows selectively with the cavity or the sound entrance. The processor is electrically connected to the speaker and the microphone. When the microphone interflows with the cavity, the microphone receives a sound signal generated from the cavity and transmits the sound signal to the processor for cancelling noise in the cavity. When the microphone interflows with the sound exit, the microphone receives an external sound signal and transmits the external sound signal to the processor for cancelling noise from the external.

Abstract: A noise reducing earphone includes a body, a speaker, a microphone and a signal processor. The body includes a cavity and a sound tunnel. The speaker and the microphone are both disposed in the cavity. The speaker is configured for outputting audio signals through the sound tunnel. The microphone is disposed besides the speaker and configured for receiving the audio signals in the cavity. The signal processer is electrically connected to the speaker and the microphone and configured for providing an electrical signal to the speaker so that the electrical signal is converted to an audio signal by the speaker. The microphone is configured for converting the received audio signals to an electrical signal, and sending the electrical signal to the signal processor. The signal processor is configured for outputting to the speaker an anti-phase signal with respect to the noise component defined by the signal processor in the audio signal.

Abstract: An earphone set includes a main device having a digital signal processor, and an earplug has an external microphone and a speaker electrically connected with the digital signal processor respectively. The external microphone converts an external sound wave into an electronic signal and transmits the electronic signal to the digital signal processor for processing. The speaker converts the electronic signal processed by the digital signal processor into a sound wave for output.

Abstract: A wireless earphone system includes a main device and two ear-hang devices. The main device having a digital signal processor, a server-end wireless transmitting module and a server-end wireless receiving module electrically connected with the digital signal processor respectively. Each ear-hang device has a microphone, a speaker, a client-end wireless transmitting module electrically connected to the microphone and a client-end wireless receiving module electrically connected to the speaker. The microphone collects an external sound wave and converts the external sound wave into an electronic signal for transmission to the digital signal processor by the client-end wireless transmitting module and the server-end wireless receiving module, and the processed electronic signal is transmitted by the server-end wireless transmitting module and the client-end wireless receiving module to the microphone for converting into a sound wave.

Abstract: An earpiece device includes a housing having a sound output portion, a speaker and a microphone. The speaker disposed in the housing includes a diaphragm and a sound transmitting hole. The diaphragm is located between the sound output portion and the sound transmitting hole. The microphone is disposed in the housing and covers the sound transmitting hole. A sound wave generated within an ear canal would be received by the speaker and delivered through the sound transmitting hole to the microphone for pickup.

Abstract: A micro-electromechanical system package includes a substrate, a set of components, at least one solder pad, a frame, a peripheral shield and a top shield. The set is provided on the substrate. At least one solder pad is attached to the substrate opposite to the set. A frame is provided on the substrate. A peripheral shield is provided on the substrate around the set. The isolative stuff seals the set. The isolative stuff defines a tunnel. The top shield is provided on the isolative stuff for shielding the set from electromagnetic interference. The top shield includes a column inserted through the tunnel and connected to the solder pad.

Abstract: A micro-electromechanical system package includes a substrate, a group of components, isolative stuff and a conductive shield. The substrate is made with an upper face and a lower face. The group is mounted on the upper face of the substrate. The isolative stuff seals the group and the upper face of the substrate, thus protecting the group from moisture. The conductive shield covers the isolative stuff, thus protecting the group from electromagnetic interference.

Abstract: A silicon condenser microphone includes a silicon substrate defining an air chamber, a back plate mounted on the silicon substrate, a diaphragm arranged between the silicon substrate and the back plate and a suspension device arranged between the diaphragm and the silicon substrate. The back plate includes at least one acoustic aperture defined therein and a support device formed thereon. The diaphragm is arranged between the silicon substrate and the back plate so that an effective area thereof is determined by the support device. The suspension device is arranged between the diaphragm and the silicon substrate so that lateral movement of the diaphragm is prevented while vertical movement of the diaphragm is allowed. An edge of the diaphragm is abutted against the support device when the diaphragm is moved towards the back plate.

Abstract: A microelectromechanical system package includes a substrate, a microelectromechanical system transducer mounted on the substrate by a plurality of metal bumps, a non-conductive polymer ring provided around the microelectromechanical transducer for avoiding the leakage of sound pressure from the microelectromechanical transducer, an integrated circuit mounted on the substrate by a plurality of metal bumps for matching the impedance of the microelectromechanical system transducer or amplifying the electric signals and an electrically conductive bridge for electrically connecting the integrate circuit to the substrate.