Patents by Inventor Hong-Ching Lin
Hong-Ching Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11921543Abstract: A system and method of docking an information handling system to an intelligent wireless fan dock comprising a docking sensor to detect a docking event, a wireless module to establish a wireless link of the intelligent wireless fan dock with the docked information handling system upon detection of a docking event and to receive a dynamic fan speed request command to adjust extended fan cooling airflow from fan dock control system operating at the docked information handling system, where the fan dock control system has determined that the docked information handling system and the intelligent wireless fan dock pairing enables an increased performance mode and altered power draw limitations for the docked information handling system relative to the information handling system in an undocked state, and increasing the extended fan cooling airflow of a cooling fan based on the dynamic fan speed request command from the docked information handling system.Type: GrantFiled: April 28, 2022Date of Patent: March 5, 2024Assignee: Dell Products, LPInventors: Lee-Ching Kuo, Hong Ling Chen, Hou Chun Wang, En-Yu Jen, Chen-Yu Lin
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Patent number: 11812663Abstract: A flexible thermoelectric structure is provided, which includes a porous thermoelectric pattern having a first surface and a second surface opposite to the first surface, and a polymer film covering the first surface of the porous thermoelectric pattern. The polymer film fills pores of the porous thermoelectric pattern. The polymer film has a first surface and a second surface opposite to the first surface. The second surface of the polymer film is coplanar with the second surface of the porous thermoelectric pattern.Type: GrantFiled: April 30, 2020Date of Patent: November 7, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ying-Jung Chiang, Ren-Der Jean, Hong-Ching Lin, Hsu-Shen Chu
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Patent number: 10840578Abstract: An antenna array module is provided, which includes a circuit layer, an antenna dielectric layer, a metal plate and a chip. The circuit layer includes a signal line, a ground layer and a first dielectric material; the ground layer includes a coupling slot, and the signal line is connected to the chip. The antenna dielectric layer is disposed on the circuit layer and the antenna dielectric layer includes a second dielectric material; the thermal conductivity coefficient of the second dielectric material is lower than the thermal conductivity coefficient of the first dielectric material. The metal plate is disposed on the antenna dielectric layer; the signal line is coupled to the metal plate via the coupling slot.Type: GrantFiled: July 22, 2019Date of Patent: November 17, 2020Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jiun-Jang Yu, Chun-An Lu, Hong-Ching Lin
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Publication number: 20200259063Abstract: A flexible thermoelectric structure is provided, which includes a porous thermoelectric pattern having a first surface and a second surface opposite to the first surface, and a polymer film covering the first surface of the porous thermoelectric pattern. The polymer film fills pores of the porous thermoelectric pattern. The polymer film has a first surface and a second surface opposite to the first surface. The second surface of the polymer film is coplanar with the second surface of the porous thermoelectric pattern.Type: ApplicationFiled: April 30, 2020Publication date: August 13, 2020Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ying-Jung CHIANG, Ren-Der JEAN, Hong-Ching LIN, Hsu-Shen CHU
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Publication number: 20200052362Abstract: An antenna array module is provided, which includes a circuit layer, an antenna dielectric layer, a metal plate and a chip. The circuit layer includes a signal line, a ground layer and a first dielectric material; the ground layer includes a coupling slot, and the signal line is connected to the chip. The antenna dielectric layer is disposed on the circuit layer and the antenna dielectric layer includes a second dielectric material; the thermal conductivity coefficient of the second dielectric material is lower than the thermal conductivity coefficient of the first dielectric material. The metal plate is disposed on the antenna dielectric layer; the signal line is coupled to the metal plate via the coupling slot.Type: ApplicationFiled: July 22, 2019Publication date: February 13, 2020Inventors: JIUN-JANG YU, CHUN-AN LU, HONG-CHING LIN
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Patent number: 10173928Abstract: A dielectric ceramic composition includes a first inorganic component having a trigonal ditrigonal pyramidal crystal structure, a second inorganic component having a hexoctahedral crystal structure, and a solid solution portion of the trigonal ditrigonal pyramidal crystal structure and the hexoctahedral crystal structure is formed between the first inorganic component and the second inorganic component.Type: GrantFiled: December 19, 2017Date of Patent: January 8, 2019Assignee: Industrial Technology Research InstituteInventors: Chun-An Lu, Hong-Ching Lin, Chiung-Hsiung Chen, Yuan-Ling Tsai
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Publication number: 20180251405Abstract: A dielectric ceramic composition includes a first inorganic component having a trigonal ditrigonal pyramidal crystal structure, a second inorganic component having a hexoctahedral crystal structure, and a solid solution portion of the trigonal ditrigonal pyramidal crystal structure and the hexoctahedral crystal structure is formed between the first inorganic component and the second inorganic component.Type: ApplicationFiled: December 19, 2017Publication date: September 6, 2018Applicant: Industrial Technology Research InstituteInventors: Chun-An Lu, Hong-Ching Lin, Chiung-Hsiung Chen, Yuan-Ling Tsai
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Publication number: 20180159014Abstract: A flexible thermoelectric structure is provided, which includes a porous thermoelectric pattern having a first surface and a second surface opposite to the first surface, and a polymer film covering the first surface of the porous thermoelectric pattern. The polymer film fills pores of the porous thermoelectric pattern. The polymer film has a first surface and a second surface opposite to the first surface. The second surface of the polymer film is coplanar with the second surface of the porous thermoelectric pattern.Type: ApplicationFiled: December 29, 2016Publication date: June 7, 2018Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ying-Jung CHIANG, Ren-Der JEAN, Hong-Ching LIN, Hsu-Shen CHU
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Patent number: 9724675Abstract: The disclosure provides a photocatalyst material and a method for fabricating the same. The photocatalyst material includes a zinc oxide material doped with metal, wherein the zinc oxide material has a lattice structure including a plurality of defects. A part of the defects are filled with a metal.Type: GrantFiled: November 1, 2013Date of Patent: August 8, 2017Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jyh Ming Wu, Lu-Chih Wang, Hong-Ching Lin, Hsin-Hsien Yeh, Wei-Tsung Kao
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Patent number: 9707706Abstract: A flexible substrate embedded with wires includes a flexible substrate constituted by a polymer material, and a continuous wire pattern containing a plurality of pores embedded in the flexible substrate, wherein the polymer material fills the pores. A method for fabricating a flexible substrate embedded with wires providing a carrier; forming a continuous wire pattern on the carrier, the continuous wire pattern containing a plurality of pores; covering a polymer material over the continuous wire pattern and the carrier and to fill into the pores; and separating the polymer material and the carrier to form a flexible substrate embedded with the continuous wire pattern” where the only change is the addition of wires.Type: GrantFiled: February 20, 2015Date of Patent: July 18, 2017Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chun-Wei Su, Chyi-Ming Leu, Yu-Ju Kuo, Hong-Ching Lin, Chun-An Lu, Chiung-Hsiung Chen
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Patent number: 9160054Abstract: A radio frequency (RF) identification tag including a substrate, a planar antenna, an RF chip, a plurality of signal conductors and a plurality of ground conductors is provided. The RF chip receives an RF signal from the planar antenna to generate an identification code. The signal conductors are coupled to the planar antenna. The ground conductors, interlaced on two opposite sides of the signal conductors, and the signal conductors are adjacent to each other and disposed on the substrate to form a coplanar waveguide structure which includes an impedance match portion and a transmission portion. The impedance match portion has an input end coupled to the signal conductors and a ground plane coupled to the ground conductors. The RF chip is disposed between the input end and the ground plane. The transmission portion is connected between the impedance match portion and the planar antenna.Type: GrantFiled: June 15, 2012Date of Patent: October 13, 2015Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jiun-Jang Yu, Chiung-Hsiung Chen, Chun-An Lu, Hong-Ching Lin
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Publication number: 20150245470Abstract: A flexible substrate embedded with wires is provided. The flexible substrate embedded with wires includes a flexible substrate constituted by a polymer material, and a continuous wire pattern containing a plurality of pores embedded in the flexible substrate, wherein the polymer material fills the pores. A method for fabricating a flexible substrate embedded with wires is also provided.Type: ApplicationFiled: February 20, 2015Publication date: August 27, 2015Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chun-Wei SU, Chyi-Ming LEU, Yu-Ju KUO, Hong-Ching LIN, Chun-An LU, Chiung-Hsiung CHEN
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Patent number: 9019678Abstract: A protection component includes: a package substrate; a first fuse unit disposed in the package substrate, having a first fusing region; a second fuse unit disposed in the package substrate, having a second fusing region which is close to the first fusing region; and a first buried cave disposed in the package substrate corresponding to the first and second fusing regions. When one of the first and second fusing regions is blown out, the first buried cave assists energy of fuse melting to break the other of the first and second fusing regions.Type: GrantFiled: August 16, 2012Date of Patent: April 28, 2015Assignee: Industrial Technology Research InstituteInventors: Hsin-Hsien Yeh, Hong-Ching Lin, Tsung-Wen Chen, Wen-Hao Deng
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Patent number: 8911821Abstract: A method for forming nanometer scale dot-shaped materials is provided. The method includes providing a sub-micrometer scale material and a metallo-organic compound. The sub-micrometer scale material and the metallo-organic compound are mixed in a solvent. Then, the metallo-organic compound is decomposed by thermal decomposition process and reduced to form a plurality of nanometer scale dot-shaped materials on the sub-micrometer scale material, wherein the sub-micrometer scale material and the nanometer-scale dot-shaped materials are heterologous materials. Then, the plurality of nanometer scale dot-shaped materials is melted, such that a plurality of the adjacent sub-micrometer scale materials is connected to each other to form a continuous interface between the sub-micrometer scale materials.Type: GrantFiled: September 21, 2009Date of Patent: December 16, 2014Assignee: Industrial Technology Research InstituteInventors: Chun-An Lu, Hong-Ching Lin, Kuo-Chan Chiou, Szu-Po Huang
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Publication number: 20140318414Abstract: A nano-metal solution, nano-metal complex grains, and a manufacturing method of a metal film are provided. The nano-metal solution includes metal grains having an amount of 0.1˜30 wt %, metallic-organic self-decomposition molecules having an amount of 0.1˜50 wt % and having formula 1, and a solvent having an amount of 20˜99.8 wt %: wherein M represents a metal ion. The metallic-organic self-decomposition molecules and the metal grains are evenly mixed in the solvent, and the metallic-organic self-decomposition molecules are adsorbed on surfaces of the metal grains.Type: ApplicationFiled: June 4, 2014Publication date: October 30, 2014Applicant: Industrial Technology Research InstituteInventors: Kuo-Chan Chiou, Hong-Ching Lin, Szu-Po Huang, Chun-An Lu
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Publication number: 20140141968Abstract: The disclosure provides a photocatalyst material and a method for fabricating the same. The photocatalyst material includes a zinc oxide material doped with metal, wherein the zinc oxide material has a lattice structure including a plurality of defects.Type: ApplicationFiled: November 1, 2013Publication date: May 22, 2014Applicant: Industrial Technology Research InstituteInventors: Jyh Ming WU, Lu-Chih WANG, Hong-Ching LIN, Wei-Tsung KAO, Hsin-Hsien YEH
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Patent number: 8582307Abstract: A wireless communication apparatus in one embodiment includes a bag body and a radio frequency device. The bag body has at least a first slot, which extends to an edge of the bag body. The radio frequency device including a wireless integrated circuit chip is for radio-frequency signal transmission or receiving, and is disposed across a portion of the first slot and coupled to two connection ends of the bag body so that the bag body between the two connection ends serves as an inductance circuit. The inductance circuit of the two connection ends of the bag body is based on metallic material. An impedance of the inductance circuit is for conjugate matching with that of the radio frequency device and is determined according to a plurality of geometric parameters including: a distance from the edge to the wireless integrated circuit chip, and size of the first slot.Type: GrantFiled: November 17, 2010Date of Patent: November 12, 2013Assignee: Industrial Technology Research InstituteInventors: Jiun-Jang Yu, Hsin-Hsien Yeh, Hong-Ching Lin
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Patent number: 8465677Abstract: An electrically conductive composition and a fabrication method thereof are provided. The electrically conductive structure includes a major conductive material and an electrically conductive filler of an energy delivery character dispersed around the major conductive material. The method includes mixing a major conductive material with an electrically conductive filler of an energy delivery character to form a mixture, coating the mixture on a substrate, applying a second energy source to the mixture while simultaneously applying a first energy source for sintering the major conductive material to form an electrically conductive composition with a resistivity smaller than 10×10?3?·cm.Type: GrantFiled: June 11, 2010Date of Patent: June 18, 2013Assignee: Industrial Technology Research InstituteInventors: Chun-An Lu, Hong-Ching Lin
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Publication number: 20130123726Abstract: A radio frequency (RF) identification tag including a substrate, a planar antenna, an RF chip, a plurality of signal conductors and a plurality of ground conductors is provided. The RF chip receives an RF signal from the planar antenna to generate an identification code. The signal conductors are coupled to the planar antenna. The ground conductors, interlaced on two opposite sides of the signal conductors, and the signal conductors are adjacent to each other and disposed on the substrate to form a coplanar waveguide structure which includes an impedance match portion and a transmission portion. The impedance match portion has an input end coupled to the signal conductors and a ground plane coupled to the ground conductors. The RF chip is disposed between the input end and the ground plane. The transmission portion is connected between the impedance match portion and the planar antenna.Type: ApplicationFiled: June 15, 2012Publication date: May 16, 2013Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jiun-Jang Yu, Chiung-Hsiung Chen, Chun-An Lu, Hong-Ching Lin
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Publication number: 20130044401Abstract: A protection component includes: a package substrate; a first fuse unit disposed in the package substrate, having a first fusing region; a second fuse unit disposed in the package substrate, having a second fusing region which is close to the first fusing region; and a first buried cave disposed in the package substrate corresponding to the first and second fusing regions. When one of the first and second fusing regions is blown out, the first buried cave assists energy of fuse melting to break the other of the first and second fusing regions.Type: ApplicationFiled: August 16, 2012Publication date: February 21, 2013Inventors: Hsin-Hsien Yeh, Hong-Ching Lin, Tsung-Wen Chen, Wen-Hao Deng