Patents by Inventor Hong-Ching Lin

Hong-Ching Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200259063
    Abstract: A flexible thermoelectric structure is provided, which includes a porous thermoelectric pattern having a first surface and a second surface opposite to the first surface, and a polymer film covering the first surface of the porous thermoelectric pattern. The polymer film fills pores of the porous thermoelectric pattern. The polymer film has a first surface and a second surface opposite to the first surface. The second surface of the polymer film is coplanar with the second surface of the porous thermoelectric pattern.
    Type: Application
    Filed: April 30, 2020
    Publication date: August 13, 2020
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ying-Jung CHIANG, Ren-Der JEAN, Hong-Ching LIN, Hsu-Shen CHU
  • Publication number: 20200135664
    Abstract: A semiconductor package includes a first die having a first substrate, an interconnect structure overlying the first substrate and having multiple metal layers with vias connecting the multiple metal layers, a seal ring structure overlying the first substrate and along a periphery of the first substrate, the seal ring structure having multiple metal layers with vias connecting the multiple metal layers, the seal ring structure having a topmost metal layer, the topmost metal layer being the metal layer of the seal ring structure that is furthest from the first substrate, the topmost metal layer of the seal ring structure having an inner metal structure and an outer metal structure, and a polymer layer over the seal ring structure, the polymer layer having an outermost edge that is over and aligned with a top surface of the outer metal structure of the seal ring structure.
    Type: Application
    Filed: October 10, 2019
    Publication date: April 30, 2020
    Inventors: Chih-Hsiang Tseng, Yu-Feng Chen, Cheng Jen Lin, Wen-Hsiung Lu, Ming-Da Cheng, Kuo-Ching Hsu, Hong-Seng Shue, Ming-Hong Cha, Chao-Yi Wang, Mirng-Ji Lii
  • Publication number: 20200052362
    Abstract: An antenna array module is provided, which includes a circuit layer, an antenna dielectric layer, a metal plate and a chip. The circuit layer includes a signal line, a ground layer and a first dielectric material; the ground layer includes a coupling slot, and the signal line is connected to the chip. The antenna dielectric layer is disposed on the circuit layer and the antenna dielectric layer includes a second dielectric material; the thermal conductivity coefficient of the second dielectric material is lower than the thermal conductivity coefficient of the first dielectric material. The metal plate is disposed on the antenna dielectric layer; the signal line is coupled to the metal plate via the coupling slot.
    Type: Application
    Filed: July 22, 2019
    Publication date: February 13, 2020
    Inventors: JIUN-JANG YU, CHUN-AN LU, HONG-CHING LIN
  • Patent number: 10173928
    Abstract: A dielectric ceramic composition includes a first inorganic component having a trigonal ditrigonal pyramidal crystal structure, a second inorganic component having a hexoctahedral crystal structure, and a solid solution portion of the trigonal ditrigonal pyramidal crystal structure and the hexoctahedral crystal structure is formed between the first inorganic component and the second inorganic component.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: January 8, 2019
    Assignee: Industrial Technology Research Institute
    Inventors: Chun-An Lu, Hong-Ching Lin, Chiung-Hsiung Chen, Yuan-Ling Tsai
  • Publication number: 20180251405
    Abstract: A dielectric ceramic composition includes a first inorganic component having a trigonal ditrigonal pyramidal crystal structure, a second inorganic component having a hexoctahedral crystal structure, and a solid solution portion of the trigonal ditrigonal pyramidal crystal structure and the hexoctahedral crystal structure is formed between the first inorganic component and the second inorganic component.
    Type: Application
    Filed: December 19, 2017
    Publication date: September 6, 2018
    Applicant: Industrial Technology Research Institute
    Inventors: Chun-An Lu, Hong-Ching Lin, Chiung-Hsiung Chen, Yuan-Ling Tsai
  • Publication number: 20180159014
    Abstract: A flexible thermoelectric structure is provided, which includes a porous thermoelectric pattern having a first surface and a second surface opposite to the first surface, and a polymer film covering the first surface of the porous thermoelectric pattern. The polymer film fills pores of the porous thermoelectric pattern. The polymer film has a first surface and a second surface opposite to the first surface. The second surface of the polymer film is coplanar with the second surface of the porous thermoelectric pattern.
    Type: Application
    Filed: December 29, 2016
    Publication date: June 7, 2018
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ying-Jung CHIANG, Ren-Der JEAN, Hong-Ching LIN, Hsu-Shen CHU
  • Patent number: 9724675
    Abstract: The disclosure provides a photocatalyst material and a method for fabricating the same. The photocatalyst material includes a zinc oxide material doped with metal, wherein the zinc oxide material has a lattice structure including a plurality of defects. A part of the defects are filled with a metal.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: August 8, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jyh Ming Wu, Lu-Chih Wang, Hong-Ching Lin, Hsin-Hsien Yeh, Wei-Tsung Kao
  • Patent number: 9707706
    Abstract: A flexible substrate embedded with wires includes a flexible substrate constituted by a polymer material, and a continuous wire pattern containing a plurality of pores embedded in the flexible substrate, wherein the polymer material fills the pores. A method for fabricating a flexible substrate embedded with wires providing a carrier; forming a continuous wire pattern on the carrier, the continuous wire pattern containing a plurality of pores; covering a polymer material over the continuous wire pattern and the carrier and to fill into the pores; and separating the polymer material and the carrier to form a flexible substrate embedded with the continuous wire pattern” where the only change is the addition of wires.
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: July 18, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chun-Wei Su, Chyi-Ming Leu, Yu-Ju Kuo, Hong-Ching Lin, Chun-An Lu, Chiung-Hsiung Chen
  • Patent number: 9160054
    Abstract: A radio frequency (RF) identification tag including a substrate, a planar antenna, an RF chip, a plurality of signal conductors and a plurality of ground conductors is provided. The RF chip receives an RF signal from the planar antenna to generate an identification code. The signal conductors are coupled to the planar antenna. The ground conductors, interlaced on two opposite sides of the signal conductors, and the signal conductors are adjacent to each other and disposed on the substrate to form a coplanar waveguide structure which includes an impedance match portion and a transmission portion. The impedance match portion has an input end coupled to the signal conductors and a ground plane coupled to the ground conductors. The RF chip is disposed between the input end and the ground plane. The transmission portion is connected between the impedance match portion and the planar antenna.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: October 13, 2015
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jiun-Jang Yu, Chiung-Hsiung Chen, Chun-An Lu, Hong-Ching Lin
  • Publication number: 20150245470
    Abstract: A flexible substrate embedded with wires is provided. The flexible substrate embedded with wires includes a flexible substrate constituted by a polymer material, and a continuous wire pattern containing a plurality of pores embedded in the flexible substrate, wherein the polymer material fills the pores. A method for fabricating a flexible substrate embedded with wires is also provided.
    Type: Application
    Filed: February 20, 2015
    Publication date: August 27, 2015
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chun-Wei SU, Chyi-Ming LEU, Yu-Ju KUO, Hong-Ching LIN, Chun-An LU, Chiung-Hsiung CHEN
  • Patent number: 9019678
    Abstract: A protection component includes: a package substrate; a first fuse unit disposed in the package substrate, having a first fusing region; a second fuse unit disposed in the package substrate, having a second fusing region which is close to the first fusing region; and a first buried cave disposed in the package substrate corresponding to the first and second fusing regions. When one of the first and second fusing regions is blown out, the first buried cave assists energy of fuse melting to break the other of the first and second fusing regions.
    Type: Grant
    Filed: August 16, 2012
    Date of Patent: April 28, 2015
    Assignee: Industrial Technology Research Institute
    Inventors: Hsin-Hsien Yeh, Hong-Ching Lin, Tsung-Wen Chen, Wen-Hao Deng
  • Patent number: 8911821
    Abstract: A method for forming nanometer scale dot-shaped materials is provided. The method includes providing a sub-micrometer scale material and a metallo-organic compound. The sub-micrometer scale material and the metallo-organic compound are mixed in a solvent. Then, the metallo-organic compound is decomposed by thermal decomposition process and reduced to form a plurality of nanometer scale dot-shaped materials on the sub-micrometer scale material, wherein the sub-micrometer scale material and the nanometer-scale dot-shaped materials are heterologous materials. Then, the plurality of nanometer scale dot-shaped materials is melted, such that a plurality of the adjacent sub-micrometer scale materials is connected to each other to form a continuous interface between the sub-micrometer scale materials.
    Type: Grant
    Filed: September 21, 2009
    Date of Patent: December 16, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Chun-An Lu, Hong-Ching Lin, Kuo-Chan Chiou, Szu-Po Huang
  • Publication number: 20140318414
    Abstract: A nano-metal solution, nano-metal complex grains, and a manufacturing method of a metal film are provided. The nano-metal solution includes metal grains having an amount of 0.1˜30 wt %, metallic-organic self-decomposition molecules having an amount of 0.1˜50 wt % and having formula 1, and a solvent having an amount of 20˜99.8 wt %: wherein M represents a metal ion. The metallic-organic self-decomposition molecules and the metal grains are evenly mixed in the solvent, and the metallic-organic self-decomposition molecules are adsorbed on surfaces of the metal grains.
    Type: Application
    Filed: June 4, 2014
    Publication date: October 30, 2014
    Applicant: Industrial Technology Research Institute
    Inventors: Kuo-Chan Chiou, Hong-Ching Lin, Szu-Po Huang, Chun-An Lu
  • Publication number: 20140141968
    Abstract: The disclosure provides a photocatalyst material and a method for fabricating the same. The photocatalyst material includes a zinc oxide material doped with metal, wherein the zinc oxide material has a lattice structure including a plurality of defects.
    Type: Application
    Filed: November 1, 2013
    Publication date: May 22, 2014
    Applicant: Industrial Technology Research Institute
    Inventors: Jyh Ming WU, Lu-Chih WANG, Hong-Ching LIN, Wei-Tsung KAO, Hsin-Hsien YEH
  • Patent number: 8582307
    Abstract: A wireless communication apparatus in one embodiment includes a bag body and a radio frequency device. The bag body has at least a first slot, which extends to an edge of the bag body. The radio frequency device including a wireless integrated circuit chip is for radio-frequency signal transmission or receiving, and is disposed across a portion of the first slot and coupled to two connection ends of the bag body so that the bag body between the two connection ends serves as an inductance circuit. The inductance circuit of the two connection ends of the bag body is based on metallic material. An impedance of the inductance circuit is for conjugate matching with that of the radio frequency device and is determined according to a plurality of geometric parameters including: a distance from the edge to the wireless integrated circuit chip, and size of the first slot.
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: November 12, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Jiun-Jang Yu, Hsin-Hsien Yeh, Hong-Ching Lin
  • Patent number: 8465677
    Abstract: An electrically conductive composition and a fabrication method thereof are provided. The electrically conductive structure includes a major conductive material and an electrically conductive filler of an energy delivery character dispersed around the major conductive material. The method includes mixing a major conductive material with an electrically conductive filler of an energy delivery character to form a mixture, coating the mixture on a substrate, applying a second energy source to the mixture while simultaneously applying a first energy source for sintering the major conductive material to form an electrically conductive composition with a resistivity smaller than 10×10?3?·cm.
    Type: Grant
    Filed: June 11, 2010
    Date of Patent: June 18, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Chun-An Lu, Hong-Ching Lin
  • Publication number: 20130123726
    Abstract: A radio frequency (RF) identification tag including a substrate, a planar antenna, an RF chip, a plurality of signal conductors and a plurality of ground conductors is provided. The RF chip receives an RF signal from the planar antenna to generate an identification code. The signal conductors are coupled to the planar antenna. The ground conductors, interlaced on two opposite sides of the signal conductors, and the signal conductors are adjacent to each other and disposed on the substrate to form a coplanar waveguide structure which includes an impedance match portion and a transmission portion. The impedance match portion has an input end coupled to the signal conductors and a ground plane coupled to the ground conductors. The RF chip is disposed between the input end and the ground plane. The transmission portion is connected between the impedance match portion and the planar antenna.
    Type: Application
    Filed: June 15, 2012
    Publication date: May 16, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jiun-Jang Yu, Chiung-Hsiung Chen, Chun-An Lu, Hong-Ching Lin
  • Publication number: 20130044401
    Abstract: A protection component includes: a package substrate; a first fuse unit disposed in the package substrate, having a first fusing region; a second fuse unit disposed in the package substrate, having a second fusing region which is close to the first fusing region; and a first buried cave disposed in the package substrate corresponding to the first and second fusing regions. When one of the first and second fusing regions is blown out, the first buried cave assists energy of fuse melting to break the other of the first and second fusing regions.
    Type: Application
    Filed: August 16, 2012
    Publication date: February 21, 2013
    Inventors: Hsin-Hsien Yeh, Hong-Ching Lin, Tsung-Wen Chen, Wen-Hao Deng
  • Publication number: 20120168211
    Abstract: A substrate assembly containing a conductive film and a fabrication method thereof are provided. The substrate assembly includes a polymer substrate, a surface treatment layer formed on the polymer substrate and a conductive film formed on the surface treatment layer, wherein the conductive film is formed by sintering a metal conductive ink and the surface treatment layer is formed from a composite material of an auxiliary filler and a polymer. The auxiliary filler in the surface treatment layer can deliver energy into the metal conductive ink for sintering the conductive metal ink.
    Type: Application
    Filed: August 30, 2011
    Publication date: July 5, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chun-An LU, Hong-Ching LIN, Shih-Ming CHEN, Wen-Pin TING
  • Publication number: 20120138565
    Abstract: A bottled structure includes a bottle, a liquid substance and an electrical tag. The bottle has a body. The body has a bottle opening. The liquid substance is contained in the body and has a dielectric constant. The electrical tag is disposed on the body. The electrical tag has a radiator, wherein the radiation power of the radiator is stronger on the top or the bottom of the bottle opening than that on a plane perpendicular to the body according to the dielectric constant of the liquid substance.
    Type: Application
    Filed: April 28, 2011
    Publication date: June 7, 2012
    Inventors: Jiun-Jang YU, Hong-Ching LIN