Patents by Inventor Hong-Chyi Lee

Hong-Chyi Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible multi-layered probe for measuring a signal from an object
    Patent number: 6930497
    Abstract: A flexible probe, applicable for measuring signals from the object with an uneven surface, includes at least a probe tip, a flexible multi-layered dielectric substrate, a planar transmission structure and a coaxial transmission structure. The probe tip is connected to the planar transmission structure and extends beyond the flexible dielectric substrate. The planar transmission structure is attached to and supported by the flexible dielectric substrate and then connected to the coaxial transmission structure.
    Type: Grant
    Filed: April 5, 2004
    Date of Patent: August 16, 2005
    Assignee: Chung Shan Institute of Science and Technology Armaments Bureau, M.N.D.
    Inventors: Joseph D. S. Deng, Hong-Chyi Lee
  • Flexible multi-layered probe
    Publication number: 20040189334
    Abstract: A flexible probe, applicable for measuring signals from the object with an uneven surface, includes at least a probe tip, a flexible multi-layered dielectric substrate, a planar transmission structure and a coaxial transmission structure. The probe tip is connected to the planar transmission structure and extends beyond the flexible dielectric substrate. The planar transmission structure is attached to and supported by the flexible dielectric substrate and then connected to the coaxial transmission structure.
    Type: Application
    Filed: April 5, 2004
    Publication date: September 30, 2004
    Inventors: Joseph D. S. Deng, Hong-Chyi Lee
  • Resilient and rugged multi-layered probe
    Patent number: 6759859
    Abstract: A resilient and rugged probe, used to measure an on-wafer signal. The probe has a metal probe tip, a resilient soft multi-layered dielectric substrate, a planar transmission structure and a fixed end. The probe tip is connected to the planar transmission structure. The planar transmission structure is attached to and supported by the resilient soft multi-layered dielectric substrate and then connected to the fixed end.
    Type: Grant
    Filed: December 19, 2001
    Date of Patent: July 6, 2004
    Assignee: Chung-Shan Institute of Science and Technology
    Inventors: Joseph D. S. Deng, Hong-Chyi Lee
  • Resilient and rugged probe
    Publication number: 20030112024
    Abstract: A resilient and rugged probe, used to measure an on-wafer signal. The probe has a metal probe tip, a resilient soft multi-layered dielectric substrate, a planar transmission structure and a fixed end. The probe tip is connected to the planar transmission structure. The planar transmission structure is attached to and supported by the resilient soft multi-layered dielectric substrate and then connected to the fixed end.
    Type: Application
    Filed: December 19, 2001
    Publication date: June 19, 2003
    Inventors: Joseph D. S. Deng, Hong-Chyi Lee