Patents by Inventor Hong G Lee

Hong G Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9061363
    Abstract: The present method creates a relatively thin in situ brazing alloy layer upon first and second component edges which are brought together in order to create a component joint. This in situ brazing alloy layer is created by deposition of brazing elements, such as copper or nickel, from an electrical discharge cutting process electrode depletion utilized in order to cut the component edges, and then a subsequent brazing technique creates through interstitial migration between that brazing alloy layer and the underlying material substrate of the components a robust component joint wherein the in situ brazing alloy layer penetrates the respective component cut edge surface to only a limited depth such that the geometric effect is similarly limited, and the properties of the underlying component material structure are maintained.
    Type: Grant
    Filed: July 3, 2006
    Date of Patent: June 23, 2015
    Assignee: ROLLS- ROYCE PLC
    Inventors: Wayne E Voice, Richard C Dewes, Martin R Bache, Stephen J Tuppen, Hong G Lee, David K Aspinwall