Patents by Inventor Hong-Geun Chang

Hong-Geun Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12065073
    Abstract: A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.
    Type: Grant
    Filed: April 27, 2023
    Date of Patent: August 20, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, BS TECHNICS CO., LTD., NIFCO KOREA INC., HYUNDAI MOBIS CO., LTD., ALPS ELECTRIC KOREA CO., LTD.
    Inventors: Jun Sik Kim, Jung Sik Choi, Young Do Kim, Tae Kyoung Jung, Seung-Sik Han, Hong-Sik Chang, Kwang-Pyo Cho, Young-Ju Lee, Jong-Hyun Park, Jin-Won Lee, Jun-Geun Oh, Cheon-Ho Kim, Young-Jai Im, Sun-Mi Oh, Kang-Sun Lee, Sae-Ah Kim, Jong-Eun Park, Kwan-Woo Lee, Jong-Chae Lee, Jun-Hyun Park, Won-Il Lee, Dae-Woo Park
  • Patent number: 7479313
    Abstract: Systems and methods consistent with the present invention provide a thermoplastic resin-laminated structure having an exterior layer, a base layer, and a binding layer that is placed between the exterior layer and the base layer. The exterior, base and binding layers include at least one material selected from a group consisting of electric resistance-heat generating materials and heat-conductive materials, and has at least one connection terminal at a certain region for supplying at least one of electricity or heat. The resin-laminated structure has excellent properties such as adhesive strength between a base layer and an exterior layer, and recycling utility as well as surface quality in feeling, thermal durability, acoustic absorptivity, heat-shielding property, and impulse-durability.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: January 20, 2009
    Inventors: Hong-Geun Chang, Jung-Sook Kang, Mi-Hyang La
  • Publication number: 20080063847
    Abstract: Systems and methods consistent with the present invention provide a thermoplastic resin-laminated structure having an exterior layer, a base layer, and a binding layer that is placed between the exterior layer and the base layer. The exterior, base and binding layers include at least one material selected from a group consisting of electric resistance-heat generating materials and heat-conductive materials, and has at least one connection terminal at a certain region for supplying at least one of electricity or heat. The resin-laminated structure has excellent properties such as adhesive strength between a base layer and an exterior layer, and recycling utility as well as surface quality in feeling, thermal durability, acoustic absorptivity, heat-shielding property, and impulse-durability.
    Type: Application
    Filed: October 31, 2007
    Publication date: March 13, 2008
    Inventors: Hong-Geun Chang, Jung-Sook Kang, Mi-Hyang La
  • Publication number: 20050205203
    Abstract: Systems and methods consistent with the present invention provide a thermoplastic resin-laminated structure having an exterior layer, a base layer, and a binding layer that is placed between the exterior layer and the base layer. The exterior, base and binding layers include at least one material selected from a group consisting of electric resistance-heat generating materials and heat-conductive materials, and has at least one connection terminal at a certain region for supplying at least one of electricity or heat. The resin-laminated structure has excellent properties such as adhesive strength between a base layer and an exterior layer, and recycling utility as well as surface quality in feeling, thermal durability, acoustic absorptivity, heat-shielding property, and impulse-durability.
    Type: Application
    Filed: May 6, 2005
    Publication date: September 22, 2005
    Inventors: Hong-Geun Chang, Jung-Sook Kang, Mi-Hyang La
  • Publication number: 20030003317
    Abstract: Systems and methods consistent with the present invention provide a thermoplastic resin-laminated structure having an exterior layer, a base layer, and a binding layer that is placed between the exterior layer and the base layer. The exterior, base and binding layers include at least one material selected from a group consisting of electric resistance-heat generating materials and heat-conductive materials, and has at least one connection terminal at a certain region for supplying at least one of electricity or heat. The resin-laminated structure has excellent properties such as adhesive strength between a base layer and an exterior layer, and recycling utility as well as surface quality in feeling, thermal durability, acoustic absorptivity, heat-shielding property, and impulse-durability.
    Type: Application
    Filed: June 20, 2002
    Publication date: January 2, 2003
    Inventors: Hong-Geun Chang, Jung-Sook Kang, Mi-Hyang La