Abstract: An antenna device with high component-density but enhanced means of dissipating working heat includes a metal substrate of a wireless device, a coupler, a filter, a conductive layer, and an antenna element. The coupler is disposed on one side of the metal substrate, the metal substrate serving as a heat sink. The filter is disposed on the coupler. The conductive layer covers the coupler and is electrically connected to the filter and ground. The antenna element is disposed on the other side of the metal substrate relative to the coupler, passes through the metal substrate and is electrically connected to the coupler and the filter. A method for manufacturing the antenna device is also disclosed.

Abstract: An antenna device with high component-density but enhanced means of dissipating working heat includes a metal substrate of a wireless device, a coupler, a filter, a conductive layer, and an antenna element. The coupler is disposed on one side of the metal substrate, the metal substrate serving as a heat sink. The filter is disposed on the coupler. The conductive layer covers the coupler and is electrically connected to the filter and ground. The antenna element is disposed on the other side of the metal substrate relative to the coupler, passes through the metal substrate and is electrically connected to the coupler and the filter. A method for manufacturing the antenna device is also disclosed.

Abstract: A MEMS microphone device greatly reduced in size includes a metallic substrate, a printed circuit including an audio sensor, and a processing chip. The metallic substrate includes a first bent portion and a second bent portion. The printed circuit is directly formed by thick film printing on the metal substrate which is then punched and shaped into the first and second bent portions. The audio sensor receives sounds and functions as a microphone. The processing chip is coupled to the printed circuit and processes the electrical signal. A method for manufacturing such microphone device is also disclosed.

Abstract: A linear vibrator includes a shell, a first elastic member, a second elastic member, a weight, a magnet, and a coil. The shell has a receiving space, and first and second internal surfaces. The first elastic member and the second elastic member respectively contact the first internal surface and the second internal surface. The weight is mounted between the first elastic member and the second elastic member and has a receiving chamber. The magnet is mounted in the receiving chamber. The coil is located in the receiving chamber to cover the magnet and mounted on the shell. The linear vibrator is used for amplitude control and is compensated for by a printed circuit on the shell. The linear vibrator is small size, of simple structure, and has better performance.

Abstract: A linear vibrator includes a shell, a first elastic member, a second elastic member, a weight, a magnet, and a coil. The shell has a receiving space, and first and second internal surfaces. The first elastic member and the second elastic member respectively contact the first internal surface and the second internal surface. The weight is mounted between the first elastic member and the second elastic member and has a receiving chamber. The magnet is mounted in the receiving chamber. The coil is located in the receiving chamber to cover the magnet and mounted on the shell. The linear vibrator is used for amplitude control and is compensated for by a printed circuit on the shell. The linear vibrator is small size, of simple structure, and has better performance.

Abstract: A double-sided printed circuit board and method for manufacturing requires a ceramic substrate, two circuit layers, and conductive paste. The ceramic substrate includes two opposite surfaces, and at least one through hole passing through the two opposite surfaces. The two circuit layers can be plated on the two opposite surfaces. The conductive paste is infilled into the full extent of the through hole and thermo-cured, the ingress of electroplating materials into the hole is thus prevented. The method has low process requirement and high reliability in use.

Abstract: A heat channeling and dispersing structure includes a substrate, a printed circuit board, and a heat-producing electronic element on the printed circuit board. The printed circuit board is mounted on the substrate, which defines a through hole filled with filler. The electronic element covers the hole infilled with filler. The heat generated by the electronic element is conducted through the filler directly to the substrate for heat dissipation.

Abstract: A thick-film hybrid circuit structure includes a first thick-film substrate, a second thick-film substrate stacked on the first thick-film substrate and electrically connected to the first thick-film substrate, a chip and an encapsulation body. The second thick-film substrate defines a receiving area, and the chip is fixed in the receiving area and electrically connected to the first thick-film substrate.