Patents by Inventor Hong Hak Teo

Hong Hak Teo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor workpiece carriers and methods for processing semiconductor workpieces
    Patent number: 8476109
    Abstract: Semiconductor workpiece carriers and methods for processing semiconductor workpieces are disclosed herein. In one embodiment, a semiconductor workpiece carrier assembly includes (a) a support structure having an opening sized to receive at least a portion of a semiconductor workpiece, and (b) a replaceable carrier positioned at the opening. The replaceable carrier includes a base and an adhesive layer on the base. The base has a surface, and the adhesive layer covers only a section of the surface of the base. The adhesive layer releasably attaches the replaceable carrier to the support structure.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: July 2, 2013
    Assignee: Micron Technology, Inc.
    Inventors: Chee Peng Neo, Hong Hak Teo, Jamilon Bin Sukami
  • SEMICONDUCTOR WORKPIECE CARRIERS AND METHODS FOR PROCESSING SEMICONDUCTOR WORKPIECES
    Publication number: 20110287581
    Abstract: Semiconductor workpiece carriers and methods for processing semiconductor workpieces are disclosed herein. In one embodiment, a semiconductor workpiece carrier assembly includes (a) a support structure having an opening sized to receive at least a portion of a semiconductor workpiece, and (b) a replaceable carrier positioned at the opening. The replaceable carrier includes a base and an adhesive layer on the base. The base has a surface, and the adhesive layer covers only a section of the surface of the base. The adhesive layer releasably attaches the replaceable carrier to the support structure.
    Type: Application
    Filed: April 26, 2011
    Publication date: November 24, 2011
    Applicant: Micron Technology, Inc.
    Inventors: Chee Peng Neo, Hong Hak Teo, Jamilon Bin Sukami
  • Semiconductor workpiece carriers and methods for processing semiconductor workpieces
    Patent number: 8011513
    Abstract: Semiconductor workpiece carriers and methods for processing semiconductor workpieces are disclosed herein. In one embodiment, a semiconductor workpiece carrier assembly includes (a) a support structure having an opening sized to receive at least a portion of a semiconductor workpiece, and (b) a replaceable carrier positioned at the opening. The replaceable carrier includes a base and an adhesive layer on the base. The base has a surface, and the adhesive layer covers only a section of the surface of the base. The adhesive layer releasably attaches the replaceable carrier to the support structure.
    Type: Grant
    Filed: April 30, 2007
    Date of Patent: September 6, 2011
    Assignee: Micron Technology, Inc.
    Inventors: Chee Peng Neo, Hong Hak Teo, Jamilon Bin Sukami
  • SEMICONDUCTOR WORKPIECE CARRIERS AND METHODS FOR PROCESSING SEMICONDUCTOR WORKPIECES
    Publication number: 20080261383
    Abstract: Semiconductor workpiece carriers and methods for processing semiconductor workpieces are disclosed herein. In one embodiment, a semiconductor workpiece carrier assembly includes (a) a support structure having an opening sized to receive at least a portion of a semiconductor workpiece, and (b) a replaceable carrier positioned at the opening. The replaceable carrier includes a base and an adhesive layer on the base. The base has a surface, and the adhesive layer covers only a section of the surface of the base. The adhesive layer releasably attaches the replaceable carrier to the support structure.
    Type: Application
    Filed: April 30, 2007
    Publication date: October 23, 2008
    Applicant: Micron Technology, Inc.
    Inventors: Chee Peng Neo, Hong Hak Teo, Jamilon Bin Sukami