Patents by Inventor Hong Hock Tay

Hong Hock Tay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package having a filled conductive cavity
    Patent number: 10770399
    Abstract: A semiconductor package includes a frame having an insulative body with a first main surface and a second main surface opposite the first main surface, a first plurality of metal traces at the first main surface, and a first cavity in the insulative body. A thermally and/or electrically conductive material filling the first cavity in the insulative body and having a different composition than the first plurality of metal traces. The thermally and/or electrically conductive material provides a thermally and/or electrically conductive path between the first and the second main surfaces of the insulative body. A semiconductor die attached to the frame at the first main surface of the insulative body is electrically connected to the first plurality of metal traces and to the thermally and/or electrically conductive material filling the first cavity in the insulative body. A corresponding method of manufacture is also described.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: September 8, 2020
    Assignee: Infineon Technologies AG
    Inventors: Chee Yang Ng, Hock Siang Chua, Stefan Macheiner, Josef Maerz, Nurfarena Othman, Joseph Victor Soosai Prakasam, Hong Hock Tay
  • Semiconductor Package Having a Filled Conductive Cavity
    Publication number: 20200258842
    Abstract: A semiconductor package includes a frame having an insulative body with a first main surface and a second main surface opposite the first main surface, a first plurality of metal traces at the first main surface, and a first cavity in the insulative body. A thermally and/or electrically conductive material filling the first cavity in the insulative body and having a different composition than the first plurality of metal traces. The thermally and/or electrically conductive material provides a thermally and/or electrically conductive path between the first and the second main surfaces of the insulative body. A semiconductor die attached to the frame at the first main surface of the insulative body is electrically connected to the first plurality of metal traces and to the thermally and/or electrically conductive material filling the first cavity in the insulative body. A corresponding method of manufacture is also described.
    Type: Application
    Filed: February 13, 2019
    Publication date: August 13, 2020
    Inventors: Chee Yang Ng, Hock Siang Chua, Stefan Macheiner, Josef Maerz, Nurfarena Othman, Joseph Victor Soosai Prakasam, Hong Hock Tay