Abstract: A semiconductor structure including a substrate, an insulating layer, a composite pad structure, a passivation layer, and a bump is provided. A circuit structure is disposed on the substrate. The insulating layer covers the substrate and has a first opening exposing the circuit structure. The composite pad structure includes a first conductive layer, a barrier layer, and a second conductive layer which are sequentially disposed. The composite pad structure is disposed on the insulating layer and fills the first opening to electrically connect to the circuit structure. The passivation layer covers the composite pad structure and has a second opening exposing the composite pad structure. The bump fills the second opening and electrically connects to the composite pad structure.

Abstract: A semiconductor structure including a substrate, an insulating layer, a composite pad structure, a passivation layer, and a bump is provided. A circuit structure is disposed on the substrate. The insulating layer covers the substrate and has a first opening exposing the circuit structure. The composite pad structure includes a first conductive layer, a barrier layer, and a second conductive layer which are sequentially disposed. The composite pad structure is disposed on the insulating layer and fills the first opening to electrically connect to the circuit structure. The passivation layer covers the composite pad structure and has a second opening exposing the composite pad structure. The bump fills the second opening and electrically connects to the composite pad structure.

Abstract: A method of fabricating a trench capacitor includes forming a trench in a substrate; forming a conductive diffusion region in the substrate surrounding a lower portion of the trench; forming a dielectric layer along an inner surface of the trench; and filling the trench with a first doped polysilicon layer. A first recess is formed to expose an upper portion of the inner sidewall of the trench. A collar dielectric layer is formed on the exposed inner sidewall. The first recess is filled with a second doped polysilicon layer. A second recess is formed to expose a part of the upper portion of the inner sidewall. A gap is formed between the exposed inner sidewall and the second doped polysilicon layer, and filled with a doped polysilicon layer converted from an undoped polysilicon layer.

Abstract: A method of fabricating a trench capacitor. A substrate is provided. A patterned mask layer to expose a portion of the substrate where a trench is to be formed. The exposed portion of the substrate is etched to form a trench. A conductive diffusion region is formed in the substrate surrounding a lower portion of the trench. A dielectric layer along an inner surface of the trench. The trench is filled with a first doped polysilicon layer. The first doped polysilicon layer and the dielectric layer are etched back to a first depth, so that a first recess is formed on the first doped polysilicon layer to expose an upper portion of the inner sidewall of the trench. A collar dielectric layer is formed on the exposed inner sidewall of the trench. The first recess is filled with a second doped polysilicon layer.

Abstract: A method of manufacturing DRAM capacitor. An active region is formed above a substrate. A plurality of parallel word lines is formed above the substrate. A first plug and a second plug are formed between the word lines in locations for forming the desired bit line contact and node contact, respectively. Insulation material is deposited into the remaining space between the word lines. A bit line contact is formed above the first plug. A plurality of parallel bit lines is formed above the substrate. The bit lines are perpendicular to the word lines. The bit line is electrically connected to the substrate through the bit line contact and the first plug. The bit lines are electrically insulated from each other. Furthermore, each bit line is covered on top by a hard material layer. Finally, a node contact is formed over the second plug.

Abstract: A multilevel DRAM sensing structure to detect the level of charge and interpret the digital data from a DRAM cell is disclosed. The multi-level sense amplifier structure has a first and second bit line each having a first and second section. A pair of isolation switch transistors separate the first section of the first bit line from the second section of the first bit line. The first section of the second bit line is separated from the second section of the second bit line by a second pair of isolation switch transistors. A latching sense amplifier has a first input connected to one of the pairs of isolation switch transistors, a second input connected to the other pair of isolation switch transistors, and an output connected to external circuitry. The output will have the digital data represented by the charge in the DRAM cell.

Abstract: A method of creating a deep pocket, capacitor over bit line structure, used for high density, DRAM designs, has been developed. The process consists of creating silicon nitride covered, polysilicon bit line structures, on an insulator layer, contacting an underlying source and drain region. A series of layers are next deposited, and patterned, to form the initial phase of a storage node contact hole, terminating at the surface of the silicon nitride covered polysilicon bit line structures. After formation of insulator spacers, protecting the silicon nitride covered, polysilicon bit line structures, the final phase of the storage node contact hole is formed, between polysilicon bit line structures, using RIE procedures. A storage node structure, featuring an HSG silicon layer, is formed on the inside surface of the storage node contact hole, followed by the creation of a capacitor dielectric layer, and an upper electrode structure, resulting in a deep pocket, capacitor over bit line structure.

Abstract: A low capacitance input/output integrated circuit and a method by which the low capacitance input/output integrated circuit is formed. Formed upon a semiconductor substrate is an input/output integrated circuit which contains a minimum of one integrated circuit device. The integrated circuit device, in turn, possesses at minimum a source electrode and a drain electrode of the same polarity. Coincident with the source electrode and the drain electrode are normally at least one ion implant of polarity opposite to the source electrode and the drain electrode. At least a portion of the drain electrode is masked when the ion implant(s) of polarity opposite to the source electrode and the drain electrode are provided into the source electrode region and the drain electrode region of the integrated circuit device(s).