Abstract: The present invention relates to a flame-retarding thermosetting resin composition, which comprises at least one silicate-copolymerized composite as filler and can be used as mechanical, electrical and electronic parts, molded and/or packaging resin for semiconductor and so on, etc. By adding such silicate-copolymerized composite, the resin composition of the present invention has improved flam retardance and heat resistance and has an excellent moldability and reliance under circumstances without adding any other flame-retarding material.

Abstract: The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound. Also, the present invention relates to a flame-retardant resin composition, which comprises: (1) the phosphorus-containing epoxy resin, (2) a halogen-free hardener having a reactive hydrogen capable of reacting with the epoxy group in epoxy resin, and (3) a hardener promoter. The flame-retardant resin composition described above has improved excellent heat resistance and flame retardant property, and is especially suitable for adhesive laminates, composite materials, printed circuit boards, adhesive material for copper foils, and is suitable for IC packaging materials.

Abstract: The present invention relates to a flame retarded epoxy resin composition, which is characterized by that said flame retarded epoxy resin composition comprising: (A) at least one type of epoxy resin; (B) a phosphorus-and-nitrogen-containing heterocyclic compound, said compound having a moiety which can react with the epoxy group of the epoxy resin, usedful as a hardening agent, and having a structure as shown by formula (I): wherein m is an integer of from 0 to 2, n is an integer of from 3 to 7, but at least one m is not 2. The epoxy resin composition consisting of the above components (A) and (B) has improved flame retarded property and thus is suitably used as the flame retarded material required for the parts of composite material, laminated plates, printed circuit boards, electronic products, electrical products, and the like.

Abstract: The present invention discloses a phosphorus- and nitrogen-containing resin hardener, which has a structure represented by the following formula: 1

Abstract: The present invention relates to a flame retarded epoxy resin composition, which is characterized by that said flame retarded epoxy resin composition comprising:

Abstract: The present invention relates to a flame retarded epoxy resin composition, which is characterized by that said flame retarded epoxy resin composition comprising: (A) at least one type of epoxy resin; (B) a phosphorus-and-nitrogen-containing heterocyclic compound, said compound having a moiety which can react with the epoxy group of the epoxy resin, usedful as a hardening agent, and having a structure as shown by formula (I):  wherein m is an integer of from 0 to 2, n is an integer of from 3 to 7, but at least one m is not 2. The epoxy resin composition consisting of the above components (A) and (B) has improved flame retarded property and thus is suitably used as the flame retarded material required for the parts of composite material, laminated plates, printed circuit boards, electronic products, electrical products, and the like.

Abstract: The present invention relates to a nitrogen-containing epoxy resin of the following formula: wherein R's are the same or different and each represents a hydrogen atom or —R13—C6-10 aryl-(OR14)p, and the aryl group is optionally substituted with C1-6 alkyl group, in which R13 represents a C1-6 alkylene group or a phenylene —CH2— group optionally substituted with a hydroxy group, R14 represents a glycidyl group, and p is an integer of 1 or 2, provided that at least one R group is not a hydrogen atom; R1 represents a phenyl group or —N(R)2 group in which R is defined as above. The resin is produced from sequentially reacting melamine derivatives with aldehydes, phenolic compounds, and epihalohydrin.

Abstract: The present invention discloses a phosphorus- and nitrogen-containing resin hardener, which has a structure represented by the following formula: wherein R2 represents a hydrogen atom or a group represented by the following formula: wherein n is an integer of from 0 to 20, and R represents phenylene, naphthylene or a group represented by the following formula: wherein A represents —O—, —S—, —SO2—, —CO—, —CH2—, —C(CH3)2— or a group represented by the following formula: provided that at least one R2 is not a hydrogen atom; and R1 represents NHR2, C1-6alkyl or phenyl; in the above groups represented by R and A, the aromatic group can be substituted by one or more substituents selected from the group consisting of hydroxy, amino, carboxy and C1-6alkyl. The present invention also discloses a flame retarding composition containing said hardener.

Abstract: The present invention relates to a phosphorous-containing flame retarding epoxy resin and their composition comprising the nitrogen-containing flame retarding epoxy resin. More specifically, the present invention relates to a flame retarding epoxy resin having a pendent phosphorous-containing functional group and their composition comprising the nitrogen-containing flame retarding epoxy resin. The flame retarding phosphorous-containing epoxy resin and the epoxy resin composition containing the same of the present invention possess excellent flame retarding property and heat resistance without containing halogen and diantimony trioxide. Therefore they are useful as an encapsulating material in the semiconductor industry and the cured article prepared from the composition exhibits excellent molding ability and excellent reliance.

Abstract: The present invention relates to a nitrogen-containing epoxy resin of the following formula: 1

Abstract: A phosphorus-containing resin and a flame retardant resin composition containing the same are proposed. The flame retardant resin composition includes a phosphorus-containing resin, a nitrogen-containing resin hardener and a hardening promoter. Since the flame retardant resin composition has an excellent flame retardant property and heat resistance with no halogens contained and no additional flame retardant additives added therein, it can be used for producing prepregs, composite materials, laminates, printed circuit boards, copper foil adhesives, and packaging materials for semiconductors.

Abstract: This invention discloses a novel phosphorus-containing polymer having phenolic units.

Abstract: A phosphorus-containing polymer having phenolic units and an epoxy rein composition are provided. The epoxy resin composition suitably comprises an epoxy resin and a hardener, wherein the epoxy resin may be obtained by reacting the polymer with epihalohydrin, and the polymer may further act as the hardener.

Abstract: The present invention relates to a flame retarded epoxy resin composition, which is characterized by that said flame retarded epoxy resin composition comprising:

Abstract: The present invention provides an amino resin composition for cleaning molds, that said composition is made of a thermosetting resin to which is a semi-cured amino resin composition or a semi-cured mixture thereof is added. The amino resin composition has decreased viscosity and increased tablet ability. When used to remove the soil on the surface of molds, the amino resin composition possesses good forming ability and good mold-cleaning effect so that the time needed for mold cleaning is efficiently decreased and the problem of a powder composition that can not be easily tabletted is overcome due to its excellent tablet ability.

Abstract: This invention discloses a flame retarding thermoplastic resin composition, which is comprised of (i) a thermoplastic resin and (ii) a phenolic resin compound as a flame retardant, wherein the phenolic resin compound contains a nitrogen-containing heterocycle and phosphorus. Since the flame retarding thermoplastic resin composition of this invention does not contain halogen, and has excellent flame retardant properties and high heat resistance, it is useful in producing parts and products in the fields of electronics, electricity and automobile.

Abstract: The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound.

Abstract: This invention relates to an epoxy resin composition which comprises polyalkyl phenol resins or polyalkyl phenol epoxy resins or both, wherein the polyalkyl phenol resins are represented by formula (I): ##STR1## wherein Ra, Rb and Rc may be the same or different from each other and stand for C.sub.1-5 alkyl styryl or halogen respectively;n is an integer of 0 to 4;k is an integer of 0 to 3;l is an integer of 0 to 4; andm is an integer of 1 to 10;and the polyalkyl phenol epoxy resins, which are obtained by reacting polyalkyl phenol resins of formula (I) with epihalohydrins, are represented by formula (II): ##STR2## wherein G stands for ##STR3## while the other symbols are the same as those defined above. The epoxy resin composition of this invention is able to provide a reactivity at lower temperatures and provide lower viscosity when used as hardener resins, as compared with traditional phenolic novolacs.

Abstract: This invention relates to a process for preparing a high purity epoxy resin comprising reacting an aromatic compound containing hyroxyl or amino group with an excess amount of an epihalohydrin in the presence of hydroxides of alkali metal or alkali earth metal in one or more low-boiling aprotic cosolvents under normal or reduced pressure with dewatering to obtain a high purity epoxy resin with low level of hydrolyzable halides.