Patents by Inventor Hong Hyun Shin

Hong Hyun Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11963439
    Abstract: The present disclosure relates to an organic electroluminescent compound and an organic electroluminescent device comprising the same. By comprising the compound according to the present disclosure, it is possible to produce an organic electroluminescent device having improved driving voltage, power efficiency, and/or lifetime properties compared to the conventional organic electroluminescent devices.
    Type: Grant
    Filed: August 24, 2022
    Date of Patent: April 16, 2024
    Assignee: Rohm and Haas Electronic Materials Korea Ltd.
    Inventors: Eun-Joung Choi, Young-Kwang Kim, Su-Hyun Lee, So-Young Jung, YeJin Jeon, Hong-Se Oh, Dong-Hyung Lee, Jin-Man Kim, Hyun-Woo Kang, Mi-Ja Lee, Hee-Ryong Kang, Hyo-Nim Shin, Jeong-Hwan Jeon, Sang-Hee Cho
  • Patent number: 11110540
    Abstract: An extruder for a metal material includes a cylinder having a receiving space in which a solid metal material is provided, a nozzle extending from a lower end of the cylinder, an upper coil provided on an outer surface of the cylinder and melting the solid metal material to form a liquid metal material, and a first lower coil provided on an outer surface of the nozzle to control an extruded shape of the liquid metal material.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: September 7, 2021
    Assignees: Electronics and Telecommunications Research Institute, Daelim Chemical Co., Ltd.
    Inventors: Yong Suk Yang, hong hyun Shin, Bonjin Koo, In-Kyu You, sunghoon Hong
  • Patent number: 10612112
    Abstract: Provided is a noble metal material for 3D printing, the noble metal material including an alloy that contains gold (Au) and a first metal that is different from the gold, wherein the alloy contains about 50 wt % to about 100 wt % of the gold and contains more than about 0 wt % and at most about 50 wt % of the first metal, and the melting point of the alloy is at most 400° C.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: April 7, 2020
    Assignees: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, DAELIM CHEMICAL CO., LTD.
    Inventors: Yong Suk Yang, Hong Hyun Shin, In-Kyu You, Sunghoon Hong
  • Patent number: 10563292
    Abstract: Provided is a metal material for 3D printing, the metal material including an alloy that includes a eutectic metal, and a metal particle, wherein the melting point of the alloy is about 100° C. to about 300° C., and the melting point of the metal particle exceeds about 300° C.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: February 18, 2020
    Assignees: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, DAELIM CHEMICAL CO., LTD.
    Inventors: Yong Suk Yang, Hong Hyun Shin, In-Kyu You, Sunghoon Hong
  • Publication number: 20170312849
    Abstract: An extruder for a metal material includes a cylinder having a receiving space in which a solid metal material is provided, a nozzle extending from a lower end of the cylinder, an upper coil provided on an outer surface of the cylinder and melting the solid metal material to form a liquid metal material, and a first lower coil provided on an outer surface of the nozzle to control an extruded shape of the liquid metal material.
    Type: Application
    Filed: May 1, 2017
    Publication date: November 2, 2017
    Applicants: Electronics and Telecommunications Research Institute, Daelim Chemical Co., Ltd.
    Inventors: Yong Suk YANG, hong hyun SHIN, Bonjin KOO, In-Kyu YOU, sunghoon HONG
  • Publication number: 20160298215
    Abstract: Provided is a metal material for 3D printing, the metal material including an alloy that includes a eutectic metal, and a metal particle, wherein the melting point of the alloy is about 100° C. to about 300° C., and the melting point of the metal particle exceeds about 300° C.
    Type: Application
    Filed: April 8, 2016
    Publication date: October 13, 2016
    Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, Daelim Chemical Co., Ltd.
    Inventors: Yong Suk YANG, Hong Hyun SHIN, In-Kyu YOU, Sunghoon HONG
  • Publication number: 20160298213
    Abstract: Provided is a noble metal material for 3D printing, the noble metal material including an alloy that contains gold (Au) and a first metal that is different from the gold, wherein the alloy contains about 50 wt % to about 100 wt % of the gold and contains more than about 0 wt % and at most about 50 wt % of the first metal, and the melting point of the alloy is at most 400° C.
    Type: Application
    Filed: April 8, 2016
    Publication date: October 13, 2016
    Applicants: Electronics and Telecommunications Research Institute, Daelim Chemical Co., Ltd.
    Inventors: Yong Suk YANG, Hong Hyun SHIN, In-Kyu YOU, Sunghoon HONG
  • Patent number: 9416122
    Abstract: Provided are a high refractive (meth)acrylate derivative and a method or preparing the same, and more particularly, a novel high refractive (meth)acrylate derivative having a high refractive index, capable of being used in a display component material such as an optical film, and a method for preparing the same.
    Type: Grant
    Filed: July 23, 2013
    Date of Patent: August 16, 2016
    Assignee: DAELIM CHEMICAL CO., LTD.
    Inventors: Hong Hyun Shin, Ssang Soo Han, Chun Ho Kong, Gyeong Hyeon Gim
  • Publication number: 20150225364
    Abstract: Provided are a high refractive (meth) acrylate derivative and a method for preparing the same, and more particularly, a novel high refractive (meth) acrylate derivative having a high refractive index, capable of being used in a display component material such as an optical film, and a method for preparing the same.
    Type: Application
    Filed: July 23, 2013
    Publication date: August 13, 2015
    Applicant: Daelim Chemical Co., Ltd
    Inventors: Hong Hyun Shin, Ssang Soo Han, Chun Ho Kong, Gyeong Hyeon Gim