Abstract: A photosensitive resin composition includes: (A) a binder resin; (B) a photopolymerizable monomer; (C) a photopolymerization initiator; (D) a quantum dot surface-modified with a compound having a thiol group at one terminal end and an alkoxy group, a cycloalkyl group, a carboxyl group, or a hydroxy group at the other terminal end; and (E) a solvent. A curable composition includes: (A?) a resin; (B?) a quantum dot surface-modified with a compound represented by Chemical Formula 1 or Chemical Formula 2; and (C?) a solvent. A method of manufacturing the surface-modified quantum dot, and a color filter manufactured using the photosensitive resin composition or the curable composition are also disclosed.

Abstract: A photosensitive resin composition includes: (A) a binder resin; (B) a photopolymerizable monomer; (C) a photopolymerization initiator; (D) a quantum dot surface-modified with a compound having a thiol group at one terminal end and an alkoxy group, a cycloalkyl group, a carboxyl group, or a hydroxy group at the other terminal end; and (E) a solvent. A curable composition includes: (A?) a resin; (B?) a quantum dot surface-modified with a compound represented by Chemical Formula 1 or Chemical Formula 2; and (C?) a solvent. A method of manufacturing the surface-modified quantum dot, and a color filter manufactured using the photosensitive resin composition or the curable composition are also disclosed.

Abstract: Provided are a low temperature curing composition, a cured film obtained by curing the composition, and an electronic device comprising the cured film, wherein the composition comprises: (A) an epoxy group-containing siloxane compound represented by Chemical Formula 1: (R1R2R3SiO1/2)M(R4R5SiO2/2)D1(R6SiO3/2)T1(R7R8SiO2/2)D2(R9SiO3/2)T2??[Chemical Formula 1] (In Chemical Formula 1, each of R1 to R9 is an organic group independently selected from a substituted or unsubstituted monovalent aliphatic hydrocarbon group of C1 to C6, a substituted or unsubstituted monovalent cycloaliphatic hydrocarbon group of C6 to C20, a substituted or unsubstituted monovalent aromatic hydrocarbon group of C6 to C20, and an epoxy-substituted monovalent organic group, at least one of R1 to R6 is an epoxy-substituted monovalent organic group, 0?M<1, 0?D1<1, 0<T?1, 0?D2<1, 0?T2<1, and M+D1+T1+D2+T2=1, wherein each of the structural units represented by M, D1, T1, D2, and T2 can include one or more types of different s

Abstract: A photosensitive resin composition includes: (A) a binder resin; (B) a photopolymerizable monomer; (C) a photopolymerization initiator; (D) a quantum dot surface-modified with a compound having a thiol group at one terminal end and an alkoxy group, a cycloalkyl group, a carboxyl group, or a hydroxy group at the other terminal end; and (E) a solvent. A curable composition includes: (A?) a resin; (B?) a quantum dot surface-modified with a compound represented by Chemical Formula 1 or Chemical Formula 2; and (C?) a solvent. A method of manufacturing the surface-modified quantum dot, and a color filter manufactured using the photosensitive resin composition or the curable composition are also disclosed.

Abstract: Provided are a low temperature curing composition, a cured film obtained by curing the composition, and an electronic device comprising the cured film, wherein the composition comprises: (A) an epoxy group-containing siloxane compound represented by Chemical Formula 1: (R1R2R3SiO1/2)M(R4R5SiO2/2)D1(R6SiO3/2)T1(R7R8SiO2/2)D2(R9SiO3/2)T2 ??[Chemical Formula 1] (In Chemical Formula 1, each of R1 to R9 is an organic group independently selected from a substituted or unsubstituted monovalent aliphatic hydrocarbon group of C1 to C6, a substituted or unsubstituted monovalent cycloaliphatic hydrocarbon group of C6 to C20, a substituted or unsubstituted monovalent aromatic hydrocarbon group of C6 to C20, and an epoxy-substituted monovalent organic group, at least one of R1 to R6 is an epoxy-substituted monovalent organic group, 0?M<1, 0?D1<1, 0<T?1, 0?D2<1, 0?T2<1, and M+D1+T1+D2+T2=1, wherein each of the structural units represented by M, D1, T1, D2, and T2 can include one or more types of different