Abstract: Disclosed are a curable polysiloxane composition for an optical device including at least one kind of a first siloxane compound represented by Chemical Formula 1, at least one kind of a second siloxane compound having hydrogen bound to silicon (Si—H) at the terminal end, and at least one kind of a third siloxane compound having an alkenyl group bound to silicon (Si-Vi) at the terminal end, an encapsulating material obtained by curing the curable polysiloxane composition for an optical device, and an optical device including the encapsulating material. (R1R2R3SiO1/2)M1(R4R5SiO2/2)D1(L1-O)D2(L2-O)D3(R6R7SiO2/2)D4(L3-O-L4-O)D5(R8SiO2/2—Y1—SiO2/2R9)D6(R10R11Si—Y2)D7(R12SiO3/2)T1(R13SiO3/2)T2(SiO3/2—Y3—SiO3/2)T3(SiO4/2)Q1??[Chemical Formula 1] In Chemical Formula 1, R1 to R13, Y1 to Y3, M1, D1 to D7, T1 to T3 and Q1 are the same as defined in the specification.

Abstract: Provided are a composition for an encapsulant having a viscosity of about 4,000 to about 9,500 mPa·s when measured using a Brookfield (DV-II+pro) spindle No. 52 at a torque of about 90% under atmospheric pressure at about 23° C., whereby maintaining a phosphor precipitation degree within about 18% when including a phosphor and allowed to stand at about 23° C. for greater than or equal to about 2 hours, and including at least one first siloxane compound having a silicon-bonded hydrogen (Si—H) and at least one second siloxane compound having a silicon-bonded alkenyl group (Si-Vi), an encapsulant obtained by curing the composition, and an electronic device including the encapsulant.

Abstract: A curable organo polysiloxane composition, an encapsulant, and an electronic device, the composition including at least one compound represented by the following Chemical Formula 1 and having a number average molecular weight of less than about 4,000, at least one first siloxane compound including a silicon-bonded hydrogen; and at least one second siloxane compound including a silicon-bonded alkenyl group:

Abstract: Disclosed are a curable polysiloxane composition for an optical device includes at least one of a first siloxane compound represented by the following Chemical Formula 1, at least one of a second siloxane compound having silicon-bonded hydrogen (Si—H) at the terminal end, and at least one of a third siloxane compound having a silicon-bonded alkenyl group (Si-Vi) at the terminal end, an encapsulant obtained by curing the curable polysiloxane composition for an optical device, and an optical device including the encapsulant. (R1R2R3SiO1/2)M1(R4R5SiO2/2)D1(R6R7SiO2/2)D2(R8SiO2/2—Y1—SiO2/2R9)D3(R10SiO3/2)T1(R11SiO3/2)T2(R12SiO3/2)T3(SiO3/2—Y2—SiO3/2)T4(SiO4/2)Q1??[Chemical Formula 1] In the above Chemical Formula 1, R1 to R12, Y1, Y2, M1, D1, D2, D3, T1, T2, T3, T4 and Q1 are the same as defined in the specification.

Abstract: A curable organo polysiloxane composition, an encapsulant, and an electronic device, the composition including at least one compound represented by the following Chemical Formula 1 and having a number average molecular weight of less than about 4,000, at least one first siloxane compound including a silicon-bonded hydrogen; and at least one second siloxane compound including a silicon-bonded alkenyl group:

Abstract: A curable organic polysiloxane composition includes (A) an amide compound represented by Chemical Formula 1, (B) at least one first siloxane compound including a silicon-bonded alkenyl group (Si-Vi) and including a moiety represented by Chemical Formula 2, and (C) at least one second siloxane compound having a silicon-bonded hydrogen (Si—H): where R, R1, R2, l, m, and n are as defined in the specification.

Abstract: Disclosed are a curable polysiloxane composition for an optical device including at least one kind of a first siloxane compound represented by Chemical Formula 1, at least one kind of a second siloxane compound having hydrogen bound to silicon (Si—H) at the terminal end, and at least one kind of a third siloxane compound having an alkenyl group bound to silicon (Si-Vi) at the terminal end, an encapsulating material obtained by curing the curable polysiloxane composition for an optical device, and an optical device including the encapsulating material. (R1R2R3SiO1/2)M1(R4R5SiO2/2)D1(L1-O)D2(L2-O)D3(R6R7SiO2/2)D4(L3-O-L4-O)D5(R8SiO2/2—Y1—SiO2/2R9)D6(R10R11Si—Y2)D7(R12SiO3/2)T1(R13SiO3/2)T2(SiO3/2—Y3—SiO3/2)T3(SiO4/2)Q1 ??[Chemical Formula 1] In Chemical Formula 1, R1 to R13, Y1 to Y3, M1, D1 to D7, T1 to T3 and Q1 are the same as defined in the specification.

Abstract: Disclosed are a curable polysiloxane composition for an optical device includes at least one of a first siloxane compound represented by the following Chemical Formula 1, at least one of a second siloxane compound having silicon-bonded hydrogen (Si—H) at the terminal end, and at least one of a third siloxane compound having a silicon-bonded alkenyl group (Si-Vi) at the terminal end, an encapsulant obtained by curing the curable polysiloxane composition for an optical device, and an optical device including the encapsulant. (R1R2R3SiO1/2)M1(R4R5SiO2/2)D1(R6R7SiO2/2)D2(R8SiO2/2—Y1—SiO2/2R9)D3(R10SiO3/2)T1(R11SiO3/2)T2(R12SiO3/2)T3(SiO3/2—Y2—SiO3/2)T4(SiO4/2)Q1??[Chemical Formula 1] In the above Chemical Formula 1, R1 to R12, Y1, Y2, M1, D1, D2, D3, T1, T2, T3, T4 and Q1 are the same as defined in the specification.

Abstract: A composition for an encapsulant, an encapsulant, and an electronic device, the composition including an adhesion-promoting agent, the adhesion-promoting agent including an epoxy group in an amount of about 2.0 to about 5.0 mmol/g, at least one first polysiloxane that includes a hydrogen bound to a silicon at a terminal end thereof, and at least one second polysiloxane that includes an alkenyl group bound to a silicon at a terminal end thereof.

Abstract: Provided are a composition for an encapsulant having a viscosity of about 4,000 to about 9,500 mPa·s when measured using a Brookfield (DV-II+pro) spindle No. 52 at a torque of about 90% under atmospheric pressure at about 23° C., whereby maintaining a phosphor precipitation degree within about 18% when including a phosphor and allowed to stand at about 23° C. for greater than or equal to about 2 hours, and including at least one first siloxane compound having a silicon-bonded hydrogen (Si—H) and at least one second siloxane compound having a silicon-bonded alkenyl group (Si-Vi), an encapsulant obtained by curing the composition, and an electronic device including the encapsulant.

Abstract: A composition for an encapsulant, an encapsulant, and an electronic device, the composition including an adhesion-promoting agent, the adhesion-promoting agent including an epoxy group in an amount of about 2.0 to about 5.0 mmol/g, at least one first polysiloxane that includes a hydrogen bound to a silicon at a terminal end thereof, and at least one second polysiloxane that includes an alkenyl group bound to a silicon at a terminal end thereof.