Abstract: In the specification and drawing a flat panel display with a front cover, a rear cover, a printed circuit board and a display module is disclosed. The rear cover is fixed on the front cover, wherein the rear cover has a printed circuit board region and a panel region. The printed circuit board is locked on the rear cover and corresponding to the printed circuit board region. The display module is fixed on the front cover and corresponding to the panel region, wherein the display module comprise an liquid crystal panel facing the front cover and a back plate facing the rear cover. Moreover, a method for fabricating the flat panel display is also disclosed in the specification and drawing.

Abstract: A flat panel display structure and a manufacturing method thereof are provided. The flat panel display structure includes a light guide plate made of optical glass, an optical film disposed on the light guide plate and glued thereon through a first glue layer, a display panel having a light incident surface facing the optical film and a display surface with an active area located at the central portion thereof, a second glue layer gluing the optical film and the display panel so as to cover the light incident surface including the projection of the display area thereon, and a light module emitting lights toward the light guide plate. The refractive indices of the first glue layer and the second glue layer are smaller than or equal to that of the light guide plate and the optical film.

Abstract: A backlight module includes fluorescent lamps, an inverter for supplying power for the lamps, dimming circuits each connecting the lamp in series, a signal processor for converting a video signal into a dimming signal, and a control unit. The lamps are disposed as an array having more than two columns and two rows on a substrate. The control unit electrically connects the signal processor and the dimming circuit and changes the luminance of the lamps by adjusting the dimming circuit according to the dimming signal.

Abstract: In the specification and drawing a flat panel display with a front cover, a rear cover, a printed circuit board and a display module is disclosed. The rear cover is fixed on the front cover, wherein the rear cover has a printed circuit board region and a panel region. The printed circuit board is locked on the rear cover and corresponding to the printed circuit board region. The display module is fixed on the front cover and corresponding to the panel region, wherein the display module comprise an liquid crystal panel facing the front cover and a back plate facing the rear cover. Moreover, a method for fabricating the flat panel display is also disclosed in the specification and drawing.

Abstract: A backlight module including a plurality of lamps, a first circuit board, and a second circuit board is provided. Each lamp has a first electrode and a second electrode. The first circuit board has a plurality of first openings and first conductive clips. The first electrode is disposed to extend through the first opening and to be clamped by the first conductive clip. Furthermore, a plurality of current adjustment devices is disposed on the first circuit board. The current adjustment device is electrically coupled to the first electrode through the first conductive clips. In the backlight module, the conductive clips or clamping pins of the current adjustment devices are used to hold the electrodes of lamps, thereby facilitating the assembly process of backlight module.

Abstract: A protecting structure for ESD is formed on a substrate of a TFT-LCD. A display area of the TFT-LCD is formed by a pixel array comprising lots of pixel units, scan lines and data lines. The protecting structure comprises a first rake metal and an ?-Si layer. The first rake metal is formed outside the display area and each short end of the first rake metal faces the data line by a spacing. Further, all tips of the short end and the data lines are sharp in shape so as to accumulate electrostatic charges. The ?-Si layer is formed directly under the predetermined short end of first rake metal and the corresponding data line. The ?-Si layer is used to serve as a discharging path for performing through breakdown to the ?-Si layer so as to eliminate electrostatic charges.

Abstract: A backlight module includes fluorescent lamps, an inverter for supplying power for the lamps, dimming circuits each connecting the lamp in series, a signal processor for converting a video signal into a dimming signal, and a control unit. The lamps are disposed as an array having more than two columns and two rows on a substrate. The control unit electrically connects the signal processor and the dimming circuit and changes the luminance of the lamps by adjusting the dimming circuit according to the dimming signal.

Abstract: A backlight module including a plurality of lamps, a first circuit board, and a second circuit board is provided. Each lamp has a first electrode and a second electrode. The first circuit board has a plurality of first openings and first conductive clips. The first electrode is disposed to extend through the first opening and to be clamped by the first conductive clip. Furthermore, a plurality of current adjustment devices is disposed on the first circuit board. The current adjustment device is electrically coupled to the first electrode through the first conductive clips. In the backlight module, the conductive clips or clamping pins of the current adjustment devices are used to hold the electrodes of lamps, thereby facilitating the assembly process of backlight module.

Abstract: A process for repairing defects applied in producing a liquid crystal display, wherein the liquid crystal display includes a pixel array formed by a plurality of scanning lines crossing with a plurality of data lines. The process includes steps of providing an essential repair line located on one side of the pixel array, welding a first intersection point of a defecting data line and the essential repair line and a second intersection point of a normal data line adjacent to the defecting data line and the essential repair line by a first laser to achieve electrical connection, and cutting a first breaking point and a second breaking point of the essential repair line by a second laser to achieve a broken circuit, wherein the first and second intersection points are located two sides of a line segment constructed by the first and second intersection points respectively.

Abstract: A protecting structure for ESD is formed on a substrate of a TFT-LCD. A display area of the TFT-LCD is formed by a pixel array comprising lots of pixel units, scan lines and data lines. The protecting structure comprises a first rake metal and an ?-Si layer. The first rake metal is formed outside the display area and each short end of the first rake metal faces the data line by a spacing. Further, all tips of the short end and the data lines are sharp in shape so as to accumulate electrostatic charges. The ?-Si layer is formed directly under the predetermined short end of first rake metal and the corresponding data line. The ?-Si layer is used to serve as a discharging path for performing through breakdown to the ?-Si layer so as to eliminate electrostatic charges.

Abstract: A protecting structure for ESD is formed on a substrate of a TFT-LCD. A display area of the TFT-LCD is formed by a pixel array comprising lots of pixel units, scan lines and data lines. The protecting structure comprises a first rake metal and an ?-Si layer. The first rake metal is formed outside the display area and each short end of the first rake metal faces the data line by a spacing. Further, all tips of the short end and the data lines are sharp in shape so as to accumulate electrostatic charges. The ?-Si layer is formed directly under the predetermined short end of first rake metal and the corresponding data line. The ?-Si layer is used to serve as a discharging path for performing through breakdown to the ?-Si layer so as to eliminate electrostatic charges.

Abstract: A process for repairing defects applied in producing a liquid crystal display, wherein the liquid crystal display includes a pixel array formed by a plurality of scanning lines crossing with a plurality of data lines. The process includes steps of providing an essential repair line located on one side of the pixel array, welding a first intersection point of a defecting data line and the essential repair line and a second intersection point of a normal data line adjacent to the defecting data line and the essential repair line by a first laser to achieve electrical connection, and cutting a first breaking point and a second breaking point of the essential repair line by a second laser to achieve a broken circuit, wherein the first and second intersection points are located two sides of a line segment constructed by the first and second intersection points respectively.

Abstract: A process for repairing defects applied in producing a liquid crystal display, wherein the liquid crystal display includes a pixel array formed by a plurality of scanning lines crossing with a plurality of data lines. The process includes steps of providing an essential repair line located on one side of the pixel array, welding a first intersection point of a defecting data line and the essential repair line and a second intersection point of a normal data line adjacent to the defecting data line and the essential repair line by a first laser to achieve electrical connection, and cutting a first breaking point and a second breaking point of the essential repair line by a second laser to achieve a broken circuit, wherein the first and second intersection points are located two sides of a line segment constructed by the first and second intersection points respectively.

Abstract: A process for repairing defects applied in producing a liquid crystal display, wherein the liquid crystal display includes a pixel array formed by a plurality of scanning lines crossing with a plurality of data lines. The process includes steps of providing an essential repair line located on one side of the pixel array, welding a first intersection point of a defecting data line and the essential repair line and a second intersection point of a normal data line adjacent to the defecting data line and the essential repair line by a first laser to achieve electrical connection, and cutting a first breaking point and a second breaking point of the essential repair line by a second laser to achieve a broken circuit, wherein the first and second intersection points are located two sides of a line segment constructed by the first and second intersection points respectively.

Abstract: A protecting structure for ESD is formed on a substrate of a TFT-LCD. A display area of the TFT-LCD is formed by a pixel array comprising lots of pixel units, scan lines and data lines. The protecting structure comprises a first rake metal and an ?-Si layer. The first rake metal is formed outside the display area and each short end of the first rake metal faces the data line by a spacing. Further, all tips of the short end and the data lines are sharp in shape so as to accumulate electrostatic charges. The ?-Si layer is formed directly under the predetermined short end of first rake metal and the corresponding data line. The ?-Si layer is used to serve as a discharging path for performing through breakdown to the ?-Si layer so as to eliminate electrostatic charges.

Abstract: A process for repairing defects applied in producing a liquid crystal display, wherein the liquid crystal display includes a pixel array formed by a plurality of scanning lines crossing with a plurality of data lines. The process includes steps of providing an essential repair line located on one side of the pixel array, welding a first intersection point of a defecting data line and the essential repair line and a second intersection point of a normal data line adjacent to the defecting data line and the essential repair line by a first laser to achieve electrical connection, and cutting a first breaking point and a second breaking point of the essential repair line by a second laser to achieve a broken circuit, wherein the first and second intersection points are located two sides of a line segment constructed by the first and second intersection points respectively.

Abstract: A process for repairing defects applied in producing a liquid crystal display, wherein the liquid crystal display includes a pixel array formed by a plurality of scanning lines crossing with a plurality of data lines. The process includes steps of providing an essential repair line located on one side of the pixel array, welding a first intersection point of a defecting data line and the essential repair line and a second intersection point of a normal data line adjacent to the defecting data line and the essential repair line by a first laser to achieve electrical connection, and cutting a first breaking point and a second breaking point of the essential repair line by a second laser to achieve a broken circuit, wherein the first and second intersection points are located two sides of a line segment constructed by the first and second intersection points respectively.

Abstract: The present invention includes forming a conductive layer on a substrate. Portions of the conductive layer are removed using a first photoresist layer as a mask. A first oxide layer is formed over the conductive layer and the substrate, and an amorphous silicon layer is then formed on the first oxide layer. After annealing the amorphous silicon layer, thereby transforming amorphous silicon layer to a polysilicon layer, a second oxide layer is formed on the polysilicon layer. The second oxide layer is removed using a second photoresist layer as a mask. An amorphous silicon carbon layer is formed over the second oxide layer and the polysilicon layer, and a heavily-doped amorphous silicon carbon layer is formed on the amorphous silicon carbon layer.

Abstract: The present invention includes forming a conductive layer on a substrate. Portions of the conductive layer are removed using a first photoresist layer as a mask. A first oxide layer is formed over the conductive layer and the substrate, and an amorphous silicon layer is then formed on the first oxide layer. After annealing the amorphous silicon layer, thereby transforming amorphous silicon layer to a polysilicon layer, a second oxide layer is formed on the polysilicon layer. The second oxide layer is removed using a second photoresist layer as a mask. An amorphous silicon carbon layer is formed over the second oxide layer and the polysilicon layer, and a heavily-doped amorphous silicon carbon layer is formed on the amorphous silicon carbon layer.