Abstract: This disclosure relates to a composition that includes at least one first ruthenium removal rate enhancer; at least one copper removal rate inhibitor; at least one low-k removal rate inhibitor; and an aqueous solvent.

Abstract: A dual lens imaging module suitable for an electronic device is provided. The dual lens imaging module includes a first lens, a second lens, and a moving module. The moving module is connected to the second lens and is adapted to move or tilt the second lens, wherein the first lens is a lens having an autofocus function, and a working distance of the dual lens imaging module is adapted to be changed according to a spacing of the first lens and the second lens.

Abstract: A dual lens imaging module suitable for an electronic device is provided. The dual lens imaging module includes a first lens, a second lens, and a moving module. The moving module is connected to the second lens and is adapted to move or tilt the second lens, wherein the first lens is a lens having an autofocus function, and a working distance of the dual lens imaging module is adapted to be changed according to a spacing of the first lens and the second lens.

Abstract: A method for manufacturing a fingerprint identification module is provided. In a step (a), a fingerprint sensor comprising a substrate, a sensing chip and a package layer is provided. The sensing chip is disposed on the substrate. The sensing chip is encapsulated by the package layer. In a step (b), an ink material is coated on the package layer, so that a color ink layer is formed on the package layer. In a step (c), a stamping tool is used to stamp the color ink layer, so that a top surface of the color ink layer becomes a first high gloss surface. In a step (d), the color ink layer to be heated through baking or irradiated with UV light, so that the color ink layer is hardened.

Abstract: A method for manufacturing a fingerprint identification module is provided. In a step (a), a fingerprint sensor comprising a substrate, a sensing chip and a package layer is provided. The sensing chip is disposed on the substrate. The sensing chip is encapsulated by the package layer. In a step (b), an ink material is coated on the package layer, so that a color ink layer is formed on the package layer. In a step (c), a stamping tool is used to stamp the color ink layer, so that a top surface of the color ink layer becomes a first high gloss surface. In a step (d), the color ink layer to be heated through baking or irradiated with UV light, so that the color ink layer is hardened.