Patents by Inventor Hong-Kuen Lee

Hong-Kuen Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible copper foil structure and fabrication method thereof
    Patent number: 7052781
    Abstract: A new copper foil structure with enhanced flexibility and its fabrication method thereof are disclosed. This inventive structure includes a copper base foil having a matte side and shiny side, and a more thermally stable deposited layer overlying at least the matte side of the copper base foil.
    Type: Grant
    Filed: May 11, 2004
    Date of Patent: May 30, 2006
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Chung Chen, Hong-Kuen Lee
  • Flexible copper foil structure and fabrication method thereof
    Publication number: 20050142374
    Abstract: A new copper foil structure with enhanced flexibility and its fabrication method thereof are disclosed. This inventive structure includes a copper base foil having a matte side and shiny side, and a more thermally stable deposited layer overlying at least the matte side of the copper base foil.
    Type: Application
    Filed: May 11, 2004
    Publication date: June 30, 2005
    Inventors: Yu-Chung Chen, Hong-Kuen Lee