Patents by Inventor Hong Kun KIM

Hong Kun KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POLYIMIDE COPOLYMER AND POLYIMIDE FILM USING THE SAME
    Publication number: 20230013378
    Abstract: A polyimide copolymer according to an embodiment of the present disclosure includes a plurality of structural units. The plurality of structural units include a structural unit derived from dianhydride having an alicyclic structure and a structural unit derived from aromatic diamine including an ether group, thereby mechanical properties, thermal stability and optical characteristics of the polyimide film may be improved.
    Type: Application
    Filed: June 21, 2022
    Publication date: January 19, 2023
    Inventors: Jin Hae CHANG, Hong Kun KIM, Lee Ku KWAC, Seon Ju LEE, Moon Young CHOI