Abstract: A composite electronic component includes a composite body formed by combining a multilayer ceramic capacitor (MLCC) and a tantalum capacitor. The composite electronic component has an excellent acoustic noise reduction effect, low equivalent series resistance (ESR)/equivalent series inductance (ESL), enhanced DC-bias characteristics, and a reduced chip thickness.

Abstract: A composite electronic component includes a composite body having a multilayer ceramic capacitor and a tantalum capacitor coupled to each other, so as to have an excellent acoustic noise reduction effect, a low equivalent series resistance (ESR)/equivalent series inductance (ESL), improved direct current (DC)-bias characteristics, and a low chip thickness.

Abstract: A composite electronic component including a plurality of passive elements and a board having the same may includes: a tantalum capacitor including a body part containing a material formed of sintered tantalum powder and a tantalum wire disposed on one surface of the body part, a plurality of multilayer ceramic capacitors (MLCC) disposed upwardly of the tantalum capacitor and including a ceramic body in which a plurality of dielectric layers and internal electrodes are alternatingly disposed, and a molding part enclosing the tantalum capacitor and the plurality of multilayer ceramic capacitors.

Abstract: A composite electronic component includes: an insulating sheet; connection conductor parts disposed on one or more of upper and lower surfaces of the insulating sheet; a composite body disposed on the insulating sheet and including a tantalum capacitor and a multilayer ceramic capacitor (MLCC) coupled to each other; a molding part disposed to enclose the composite body; and a positive electrode terminal disposed on a first side surface of the molding part in a length direction of the molding part and a lower surface of the molding part and a negative electrode terminal disposed on a second side surface of the molding part in a length direction of the molding part and the lower surface of the molding part.

Abstract: A tantalum capacitor may include two tantalum wires exposed through two surfaces of a capacitor body opposing each other, first and second positive electrode terminals, connected to the tantalum wires, respectively, and disposed on two surfaces of a molded part opposing each other, and a negative electrode terminal disposed between the first and second positive electrode terminals. The negative electrode terminal may be electrically connected to the capacitor body by a via electrode or a pad electrode disposed between the negative electrode terminal and the capacitor body.

Abstract: A tantalum capacitor includes a capacitor body containing a tantalum powder and having a tantalum wire protruding to one side surface thereof, a molding part enclosing the tantalum wire and the capacitor body so as to allow an end portion of the tantalum wire to be exposed through one side surface thereof, a positive electrode terminal extended from one side surface of the molding part to a portion of a lower surface thereof and connected to the end portion of the tantalum wire, and a negative electrode terminal extended from the other side surface of the molding part to a portion of the lower surface thereof and connected to the other side surface of the capacitor body.

Abstract: A tantalum capacitor includes a capacitor body containing tantalum powder and having a tantalum wire extending downwardly; a molded part enclosing the capacitor body and exposing an end portion of the tantalum wire; a positive electrode lead frame disposed on a lower surface of the molded part and connected to the end portion of the tantalum wire; a negative electrode lead frame disposed on the lower surface of the molded part; and a conductive adhesive layer disposed between the capacitor body and the negative electrode lead frame.

Abstract: A solid electrolytic capacitor may include: a capacitor body containing a tantalum powder and having a tantalum wire formed on one end portion thereof; a mounting board formed on a lower surface of the capacitor body and including an insulating layer and wiring layers formed on an upper surface and a lower surface of the insulating layer; a side electrode contacting an end portion of the tantalum wire and connected to the wiring layers of the mounting board; and a molding part enclosing the capacitor body and the tantalum wire. The mounting board may have a via electrode penetrating through the insulating layer and electrically connecting the wiring layers formed on the upper surface and the lower surface of the insulating layer.

Abstract: There is provided a tantalum capacitor, including: a capacitor body including a tantalum powder and having a tantalum wire, a molding part formed to expose an end portion of the tantalum wire and enclose the capacitor body, an anode lead frame including an anode mounting part and an anode terminal part, the anode terminal part being connected to the tantalum wire, a thin plate electrode formed on a lower surface of the capacitor body and exposed through the other end surface of the molding part, and a cathode lead frame including a cathode mounting part and a cathode terminal part, the cathode terminal part being connected to the thin plate electrode.