Abstract: An integrated circuit (IC) with through-circuit vias (TCVs) and methods of forming the same are disclosed. The IC includes a semiconductor device, first and second interconnect structures disposed on first and second surfaces of the semiconductor device, respectively, first and second inter-layer dielectric (ILD) layers disposed on front and back surfaces of the substrate, respectively, and a TCV disposed within the first and second interconnect structures, the first and second ILD layers, and the substrate. The TCV is spaced apart from the semiconductor device by a portion of the substrate and portions of the first and second ILD layers. A first end of the TCV, disposed over the front surface of the substrate, is connected to a conductive line of the first interconnect structure and a second end of the TCV, disposed over the back surface of the substrate, is connected to a conductive line of the second interconnect structure.

Abstract: A flow battery stack is provided with carbon-felt electrodes etched with canals. The stack comprises carbon-felt electrodes, bipolar plates, separating membranes, and electrolytes. A plurality of canals are etched on the surface of the electrode to increase the flow rate of electrolyte for improving reactivity. With the carbon-felt electrodes used in the flow battery stack, a long-term and stable charging/discharging operation is achieved with the cost of electricity storage effectively reduced.

Abstract: A heat dissipation module is adapted for being installed on a circuit board. The heat dissipation module includes a fixed base and a heat dissipating device. One end of the fixed base is adapted for being fixed to the circuit board, and the other end has a rotating component. The rotating component is pivoted on the fixed base along a rotation axis. The heat dissipation device includes a heat dissipation body and an alignment member extending from the heat dissipation body, and the alignment member is adapted to be detachably connected to the rotating component. When the heat dissipation device is connected to the rotating component through the alignment member, the heat dissipation body is adapted to flip relative to the fixed base along the rotating axis.

Abstract: A method of providing merchant risk monitoring may include receiving structured data that is directly associated with transactional operations of a merchant, and is formatted for application to a risk rating module, receiving unstructured data that is directly associated with the transactional operations of the merchant, but which is not formatted for application to the risk rating module, receiving non-traditional data that is not directly associated with the transactional operations of the merchant and is not formatted for application to the risk rating module, filtering the non-traditional data for relevance to merchant risk to define filtered data, pre-treating the unstructured data to generate pre-treated data that is formatted for application to the risk rating module, and applying the filtered data, the pre-treated data and the structured data to the risk rating module to employ machine learning for generation of a risk rating for the merchant.

Abstract: A method of extracting and conditioning content for use in a hierarchically structured merchant risk monitoring environment may include receiving an indication of a merchant under consideration, identifying one or more web pages likely to have information associated with travel exposure for the merchant under consideration based on the indication, conducting data scraping on the identified one or more web pages to attempt to obtain scraped travel exposure data, responsive to obtaining the scraped travel exposure data, employing a machine learning module to determine a travel risk exposure estimate based on the scraped travel exposure data, and responsive to not obtaining the scraped travel exposure data, determining the risk exposure estimate based on a predefined travel risk estimate associated with an industry classification of the merchant under consideration.

Abstract: An apparatus, for use with a projectile launching device, includes the sight, including a viewfinder that permits a user to view an image of a target in association with a reticle, a digital image system for capturing images of the target, multiple sensors to detect a firing time the apparatus for capturing multiple first images at or close to said firing time, wherein an image processor compares images captured after said firing time with said multiple first images, and to identify an indication of a projectile impact on said target, the apparatus being configured to capture multiple second images after said firing time and including said projectile impact indication, and wherein the apparatus includes a reticle adjuster to automatically position the reticle in the viewfinder in accordance with comparison between first images and second images and the associated positions of the reticle and the projectile impact indication.

Abstract: A crossbeam for measuring deformation velocities of a surface of a material under a dynamic load includes a crossbeam body, a first type of velocimeter and a second type of velocimeter-mounted on the crossbeam body. The crossbeam body is mounted on a measurement carrier. The measurement carrier is configured to move along the surface of the material and apply a dynamic load to the surface. The first type of velocimeter is configured to measure the vertically resilient deformation velocity of the surface behind an action force of the dynamic load. The second type of velocimeter is configured to measure the vertical downward deformation velocity of the surface in front of the action force of the dynamic load. The vertically resilient deformation velocity and the vertically downward deformation velocity of the surface can be simultaneously and quickly obtained by the first and second types of velocimeters.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A socket of a testing tool is configured to provide testing signals. A device-under-test (DUT) board is configured to provide electrical routing. An integrated circuit (IC) die is disposed between the socket and the DUT board. The testing signals are electrically routed to the IC die through the DUT board. The IC die includes a substrate in which plurality of transistors is formed. A first structure contains a plurality of first metallization components. A second structure contains a plurality of second metallization components. The first structure is disposed over a first side of the substrate. The second structure is disposed over a second side of the substrate opposite the first side. A trench extends through the DUT board and extends partially into the IC die from the second side. A signal detection tool is configured to detect electrical or optical signals generated by the IC die.

Abstract: A method for detecting a deflection basin based on a deformation velocity of a pavement under a rolling load is provided.

Abstract: A precision three-dimensional pavement faulting measurement method includes: acquiring three-dimensional pavement contour data; based on the three-dimensional pavement contour data, obtaining a contour reference surface and a contour deviation between measuring points in the three-dimensional pavement contour data and the contour reference surface; based on the contour deviation, obtaining a suspected joint point; based on the suspected joint point, obtaining a suspected joint denoised binary image; based on a row direction projection feature of target measuring points in the suspected joint denoised binary image, obtaining an original joint target image and a joint representative position; based on the suspected joint denoised binary image, the original joint target image, and the joint representative position, obtaining a target joint binary image by means of a joint extension operation; and based on the target joint binary image and the three-dimensional pavement contour data, obtaining pavement faulting i

Abstract: This document describes an electro-optic modulator with an integrated memory device comprising a micro-ring resonator and the memory device comprising a ferroelectric capacitor disposed in a partial circumference of a raised ring waveguide of the micro-ring resonator. An electric field is generated between transparent electrodes of the ferroelectric capacitor when a voltage is applied between these two layers, whereby the electric filed causes a polarization state of the ferroelectric capacitor to change based on the strength of the electric field. The electric field then extends between the ferroelectric capacitor and a bottom electrode layer of the micro-ring resonator when the applied voltage is removed, causing a refractive index of a non-centrosymmetric material of the micro-ring resonator to change based on the strength of the extended electric field.

Abstract: An integrated circuit (IC) with through-circuit vias (TCVs) and methods of forming the same are disclosed. The IC includes a semiconductor device, first and second interconnect structures disposed on first and second surfaces of the semiconductor device, respectively, first and second inter-layer dielectric (ILD) layers disposed on front and back surfaces of the substrate, respectively, and a TCV disposed within the first and second interconnect structures, the first and second ILD layers, and the substrate. The TCV is spaced apart from the semiconductor device by a portion of the substrate and portions of the first and second ILD layers. A first end of the TCV, disposed over the front surface of the substrate, is connected to a conductive line of the first interconnect structure and a second end of the TCV, disposed over the back surface of the substrate, is connected to a conductive line of the second interconnect structure.

Abstract: A silicon interconnect die includes through-substrate via (TSV) structures extending through a silicon substrate; an insulating spacer layer including a horizontally-extending portion overlying a top surface of the silicon substrate and a plurality of tubular insulating material portions laterally surrounding a respective one of the TSV structures; and a front metallic shield layer including a horizontally-extending metallic shield portion and at least one tubular metallic shield portion laterally surrounding a respective one of the tubular insulating material portions.

Abstract: A lifting device is provided. The lifting device includes a stationary member, a lifting member, positioning bases, reels, and springs. The lifting member is slidably coupled to the stationary member. The lifting member is fixed to a back portion of the display. The positioning bases are disposed on the stationary member and the lifting member. The reels are pivoted on the positioning bases. The springs are wound around the reels and connected to the other of the stationary member and the lifting member relative to the positioning bases. When the display or the lifting member is subjected to an applied force toward a sliding direction, the lifting member slides toward the sliding direction relative to the stationary member. The springs stretched by the lifting member generate an elastic force, so that the lifting member and the display no longer subjected to a force stay at a height position after sliding.

Abstract: Provided herein are KRAS modulating compounds, such as compounds of Formula (I), (I-A), (I-B), (I-C), (I-C*), (I-D), (I-E), (I-F), (I-G), (I-H), (I-I), (I-J), or pharmaceutically acceptable salts, solvates, stereoisomers, atom labelled, or tautomers of any one thereof. The compounds provided herein are useful for modulating KRAS GD12 and/or other G12 mutants.

Abstract: A display device includes a display panel, a backlight module and a circuit. The display panel includes multiple regions. The back light module includes multiple light emitting units, and each region corresponds to at least one of the light emitting units. The circuit includes a calibration lookup table corresponding to a first light emitting unit. The calibration lookup table records a parameter and multiple duty cycles. The circuit accesses the calibration lookup table and determines an output duty cycle according to the duty cycles. The circuit determines a current value of the first light emitting unit to drive the first light emitting unit according to the output duty cycle and the parameter.

Abstract: Provided herein are KRAS modulating compounds, such as compounds of Formula (I), (II) (II*) (III) or pharmaceutically acceptable salts, solvates, stereoisomers, atom labelled, or tautomers of any of the foregoing, useful for modulating KRAS GD12 and/or other G12 mutants.

Abstract: The object of the present disclosure is to provide a method for treating diabetes by using an Antrodia camphorata compound, wherein the Antrodia camphorata compound is shown in the following formula 1: or the pharmacologically acceptable salts of the formula 1.