Abstract: A cooling structure includes a base with a plate shape, that extends in a first direction along a refrigerant flow direction and in a second direction perpendicular or substantially perpendicular to the first direction, a thickness of which extending in a third direction perpendicular or substantially perpendicular to the first direction and the second direction, and fins that protrude from the base to one side in the third direction, that extend in the first direction, and that are side by side in the second direction. Each of the fins includes a curved portion that is curved due to a convex portion, protruding to one side in the second direction, and a concave portion, recessed from the other side to the one side in the second direction, located at a same position in the first direction.

Abstract: A fastening device includes a fixing nut and a fixing base. The fixing base includes a base plate, an anti-falling wall, a door piece, and an anti-tilt arm. The anti-falling wall, the door piece and the anti-tilt arm are formed on the base plate, and the anti-tilt arm is arranged opposite to the door piece. An accommodation space is formed between the anti-falling wall, the door piece and the anti-tilt arm, and the fixing nut is rotatably arranged in the accommodation space. In addition, a heat dissipation module with the fastening device is also disclosed herein.

Abstract: A heat dissipation device includes a first fin group, a second fin group, a heat pipe and a base. The base is in thermal contact with a heat source. The heat pipe includes a first pipe part and a second pipe part. The second pipe part is connected with the first pipe part and extended upwardly. The first pipe part is arranged between the base and the second fin group. The second pipe part is penetrated through the first fin group. The distance between a top surface of the first fin group and the base is larger than the distance between a top surface of the second fin group and the base. Since influences of the dissipating area and the wind resistance are taken into consideration, the heat dissipation device has enhanced heat dissipating efficacy.

Abstract: A heat dissipation device includes a first fin group, a second fin group, a heat pipe and a base. The base is in thermal contact with a heat source. The heat pipe includes a first pipe part and a second pipe part. The second pipe part is connected with the first pipe part and extended upwardly. The first pipe part is arranged between the base and the second fin group. The second pipe part is penetrated through the first fin group. The distance between a top surface of the first fin group and the base is larger than the distance between a top surface of the second fin group and the base. Since influences of the dissipating area and the wind resistance are taken into consideration, the heat dissipation device has enhanced heat dissipating efficacy.

Abstract: A heat sink includes a bottom surface, a top surface, plural first fins and plural second fins. The plural first fins and the plural second fins are alternately and separately arranged between the top surface and the bottom surface along a specified axis direction. Moreover, plural airflow channels are defined by the plural first fins, the plural second fins, the top surface and the bottom surface collaboratively. The first fin has a first non-overlapped zone and a second non-overlapped zone with respect to a projection area of the second fin along the specified axis direction. The first non-overlapped zone is located at an airflow inlet. In the first non-overlapped zone, the lower portion is wider than the upper portion. The second non-overlapped zone is located at an airflow outlet. In the second non-overlapped zone, the upper portion is wider than the lower portion.

Abstract: A heat sink includes a bottom surface, a top surface, plural first fins and plural second fins. The plural first fins and the plural second fins are alternately and separately arranged between the top surface and the bottom surface along a specified axis direction. Moreover, plural airflow channels are defined by the plural first fins, the plural second fins, the top surface and the bottom surface collaboratively. The first fin has a first non-overlapped zone and a second non-overlapped zone with respect to a projection area of the second fin along the specified axis direction. The first non-overlapped zone is located at an airflow inlet. In the first non-overlapped zone, the lower portion is wider than the upper portion. The second non-overlapped zone is located at an airflow outlet. In the second non-overlapped zone, the upper portion is wider than the lower portion.

Abstract: A cooling device includes a heat sink base plate for mounting on a circuit board to absorb waste heat from a heat source, a radiation fin unit consisting of a set of radiation fins, mounted on the heat sink base plate opposite to the circuit board and defining a plurality of heat-dissipation passages between each two adjacent ones of the radiation fins, a cooling fan unit mounted on the radiation fin unit for creating currents of air toward the heat-dissipation passages, a plurality of thermal tubes supported on the heat sink base plate and fastened to the radiation fins. Each radiation fin has first wind guiding wall portions and second wind guiding wall portions respectively tilted in reversed directions to facilitate the flow of air through the heat-dissipation passages.

Abstract: A low noise block down-converter with integrated feed (LNBF) assembly includes an LNBF main body, a connection portion including at least one LNBF locating hole, a support arm including at least one support arm locating hole, at least one locating spring piece including a fix end fixed on the support arm and a locating protrusion, a holder, a holding cam, and a pivot for connecting the holding cam to the holder, wherein when the connection portion inserts into the support arm, each locating protrusion penetrates the corresponding support arm locating hole and the corresponding LNBF locating hole to fix relative position between the connection portion and the support arm, and the holding cam is rotated to make a perimeter of the holding cam abut against the support arm completely and retain each locating protrusions in a penetration state.

Abstract: A cooling device includes a heat sink base plate for mounting on a circuit board to absorb waste heat from a heat source, a radiation fin unit consisting of a set of radiation fins, mounted on the heat sink base plate opposite to the circuit board and defining a plurality of heat-dissipation passages between each two adjacent ones of the radiation fins, a cooling fan unit mounted on the radiation fin unit for creating currents of air toward the heat-dissipation passages, a plurality of thermal tubes supported on the heat sink base plate and fastened to the radiation fins. Each radiation fin has first wind guiding wall portions and second wind guiding wall portions respectively tilted in reversed directions to facilitate the flow of air through the heat-dissipation passages.

Abstract: A lighting device includes a housing, and a light-emitting module mounted in an accommodation chamber inside the housing and carrying a set of light-emitting devices on a circuit board thereof for emitting light, a plurality of refracting prisms for refracting a part of the light emitted by the light-emitting devices horizontally toward two opposing sides through the light transmissive peripheral wall of the top cover shell of the housing and two opposing double-beveled reflectors for reflecting the other part of the light emitted by the light-emitting devices toward the outside through the light transmissive peripheral wall of the top cover shell of the housing in the same opposing directions. Thus, the invention extends the luminous range of the light-emitting devices, enhances the luminance and reduces light loss.

Abstract: A light-emitting unit adapter module includes a mounting base for mounting, a circuit board accommodated in the mounting base and having electrode pins connectable to an external power source, a light-emitting unit mountable in the mounting base, and a holding-down device fastenable to the mounting base to hold down the light-emitting unit, keeping the tubular electrodes of the light-emitting unit in positive contact with the electrode pins of the circuit board for power input and the heat sink of the light-emitting unit suspending outside the mounting base for quick dissipation of waste heat during operation of the light-emitting devices of the light-emitting unit.

Abstract: A light-emitting device pressure ring structure includes a mounting base for mounting, a circuit board accommodated in the mounting base and having electrode pins connectable to an external power source, a holder member insertable in the mounting base, a light-emitting unit fixedly mounted in the holder member with a bottom heat sink thereof suspending outside the holder member and tubular electrodes thereof connectable to the electrode pins of the circuit board for power input, and a pressure ring cap detachably threaded onto the mounting base to hold down the holder member and to keep the heat sink of the light-emitting unit outside the mounting base for quick dissipation of waste heat from the light-emitting devices of the light-emitting unit.

Abstract: A low noise block down-converter with integrated feed (LNBF) assembly capable of quick fabrication includes an LNBF main body, a connection portion including at least one LNBF locating hole, a support arm including at least one support arm locating hole, at least one locating spring piece including a fix end fixed on the support arm and a locating protrusion, a holder, a holding cam, and a pivot for connecting the holding cam to the holder, wherein when the connection portion inserts into the support arm, each locating protrusion penetrates the corresponding support arm locating hole and the corresponding LNBF locating hole to fix relative position between the connection portion and the support arm, and the holding cam is rotated to make the perimeter of the holding cam abut against the support arm completely and retain each locating protrusions in a penetration state.

Abstract: A lighting device includes a housing, and a light-emitting module mounted in an accommodation chamber inside the housing and carrying a set of light-emitting devices on a circuit board thereof for emitting light, a plurality of refracting prisms for refracting a part of the light emitted by the light-emitting devices horizontally toward two opposing sides through the light transmissive peripheral wall of the top cover shell of the housing and two opposing double-beveled reflectors for reflecting the other part of the light emitted by the light-emitting devices toward the outside through the light transmissive peripheral wall of the top cover shell of the housing in the same opposing directions. Thus, the invention extends the luminous range of the light-emitting devices, enhances the luminance and reduces light loss.

Abstract: A LED device includes a LED having a light-emitting surface and adapted for emitting light through the light-emitting surface, and a reflector formed of three or more than three reflecting layers having the peripheral surfaces thereof sloping at different angles and arranged in a stack on the light-emitting surface of the LED for letting the light emitted by the LED pass and/or reflecting and/or refracting the light to enhance luminous uniformity and luminous brightness and to avoid light concentration at the center or the formation of a corona.

Abstract: A light-emitting unit adapter module includes a mounting base for mounting, a circuit board accommodated in the mounting base and having electrode pins connectable to an external power source, a light-emitting unit mountable in the mounting base, and a holding-down device fastenable to the mounting base to hold down the light-emitting unit, keeping the tubular electrodes of the light-emitting unit in positive contact with the electrode pins of the circuit board for power input and the heat sink of the light-emitting unit suspending outside the mounting base for quick dissipation of waste heat during operation of the light-emitting devices of the light-emitting unit.

Abstract: A light-emitting device pressure ring structure includes a mounting base for mounting, a circuit board accommodated in the mounting base and having electrode pins connectable to an external power source, a holder member insertable in the mounting base, a light-emitting unit fixedly mounted in the holder member with a bottom heat sink thereof suspending outside the holder member and tubular electrodes thereof connectable to the electrode pins of the circuit board for power input, and a pressure ring cap detachably threaded onto the mounting base to hold down the holder member and to keep the heat sink of the light-emitting unit outside the mounting base for quick dissipation of waste heat from the light-emitting devices of the light-emitting unit.

Abstract: A cooler module formed of a heat sink and a cooling fan is disclosed. A heat receiving base member of the heat sink has a flat bottom center contact surface and a plurality of bottom sloping surfaces (or one tapered bottom surface) obliquely upwardly extended from the border of the flat bottom center contact surface to the border of the heat receiving base member for spreading heat in all directions rapidly and evenly.

Abstract: A heat sink fastener includes a locating bolt having a compressible barbed tip for securing the heat sink to the circuit board, and a buffer spring mounted on the locating bolt and adapted to force the heat sink downwards into close contact with the CPU at the circuit board, the buffer spring has a top ring defining a top receiving space, a bottom ring defining a bottom receiving space, and a double conical spiral spring body connected between the top ring and the bottom ring and receivable in the top receiving space and the bottom receiving space when compressed.

Abstract: A heat sink fastener includes a locating bolt having a compressible barbed tip for securing the heat sink to the circuit board, and a buffer spring mounted on the locating bolt and adapted to force the heat sink downwards into close contact with the CPU at the circuit board, the buffer spring has a top ring defining a top receiving space, a bottom ring defining a bottom receiving space, and a double conical spiral spring body connected between the top ring and the bottom ring and receivable in the top receiving space and the bottom receiving space when compressed.