Patents by Inventor Hong M. Lu

Hong M. Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible impedance network system
    Patent number: 11581299
    Abstract: Techniques and architecture are disclosed for a method for making a custom circuit comprising forming a common wafer template, selecting at least two elements of the common wafer template to be chosen elements, and adding at least one metal layer to interconnect the chosen elements to form a circuit. The common wafer template includes a plurality of transistors, a plurality of resistors, a plurality of capacitors, and a plurality of bond pads. Final circuit customization of the common wafer template is accomplished by adding at least one metal layer that forms interconnects to passive and active elements in the template in order to complete the circuit.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: February 14, 2023
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Carlton T. Creamer, Daniel C. Boire, Kanin Chu, Hong M. Lu, Bernard J. Schmanski
  • FLEXIBLE IMPEDANCE NETWORK SYSTEM
    Publication number: 20200294987
    Abstract: Techniques and architecture are disclosed for a method for making a custom circuit comprising forming a common wafer template, selecting at least two elements of the common wafer template to be chosen elements, and adding at least one metal layer to interconnect the chosen elements to form a circuit. The common wafer template includes a plurality of transistors, a plurality of resistors, a plurality of capacitors, and a plurality of bond pads. Final circuit customization of the common wafer template is accomplished by adding at least one metal layer that forms interconnects to passive and active elements in the template in order to complete the circuit.
    Type: Application
    Filed: March 12, 2020
    Publication date: September 17, 2020
    Applicant: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Carlton T. Creamer, Daniel C. Boire, Kanin Chu, Hong M. Lu, Bernard J. Schmanski