Abstract: The present invention relates to a carbohydrate hydrolase-immobilized magnetic nanoparticle; a method of preparing ethanol from graminaceous plants and a continuous system of preparing ethanol.

Abstract: A composite for inhibiting algae growth comprising a polypore base carrier and a nano-metal mixture coated on the carrier, wherein the mixture comprising a nano-metal particle and a substance for fixing the particle on the carrier.

Abstract: A composite for inhibiting algae growth comprising a polypore base carrier and a nano-metal mixture coated on the carrier, wherein the mixture comprising a nano-metal particle and a substance for fixing the particle on the carrier.

Abstract: The present invention provides a method for preparing polyporous materials having nanoparticles. The present invention also provides polyporous material having nanoparticles.

Abstract: A gas sensor and manufacturing method thereof. The gas sensor includes a substrate, a pair of electrodes disposed on the substrate, and a gas sensing thin film covering the electrodes, the gas sensing thin film is made up of carbon nanotubes and tin oxide.

Abstract: The invention provides an on-line sampling apparatus for the metal nanoparticle fluid of the vacuum submerged arc process and the method thereof, using the principle of the pressure difference between the vacuum pump and the vacuum chamber and the constant temperature design of the sample pipeline to make the sample precisely be caught and flow into the predetermined collector, and the disadvantage of the vaporization of the sample due to the temperature rise caused by the ambient temperature can be prevented. Further, the invention integrates with a particle size analysis apparatus to carry out real time measurement and data analysis of the nanoparticle fluid with real time process characteristics, wherein the nanoparticle fluid is caught from the nanofluid process line, thus, the optimal design work of the process and the system parameters and particle quality monitoring may be proceeded efficiently.

Abstract: A chip photoelectric sensor assembly includes a substrate with a printed circuit board mounted thereon. A photoelectric sensor chip is provided with a plurality of photoelectric sensors and is mounted on the substrate such that the photoelectric sensor chip is electrically connected with the substrate. The photoelectric sensors of the photoelectric sensor chip are masked by a photosensitive protective layer made of a photosensitive hard coating material. The photosensitive protective layer has a thickness ranging between 1 and 10 microns. The very thin photosensitive protective layer is thus capable of minimizing the light refraction distortion.

Abstract: The invention is to provide a method for reproducing a plurality of audio/video files from an optical information recording medium in accordance with at least one schedule file. In a preferred embodiment of the invention, seven schedule files, which each corresponds to one of seven days of a week, are created. The seven schedule files and the audio/video files are recorded onto the optical information recording medium. When a user want to reproduce the audio/video files from the optical information recording medium, according to a current day of the week, the schedule file corresponding to the current day is retrieved from the optical information recoding medium. Then, the audio/video files are reproduced from the optical information recording medium according to the retrieved schedule file.

Abstract: The present invention relates to a test strip and a biosensor having an increased conductivity and a slurry comprising a fiber, meal particles having a size in nanometer and a bioactive substance. The invention is characterized by incorporating metal particles having size in nanometer into the reaction layer of test strip and biosensor to increase the conductivity between the reaction layer and the electrodes so that the redox reaction can be readily completed and the measurement time can thus be shortened.

Abstract: A chip photoelectric sensor assembly comprises a substrate with a printed circuit board mounted thereon. A photoelectric sensor chip is provided with a plurality of photoelectric sensors and is mounted on the substrate such that the photoelectric sensor chip is electrically connected with the substrate. The photoelectric sensors of the photoelectric sensor chip are masked by a photosensitive protective layer made of a photosensitive hard coating material. The photosensitive protective layer has a thickness ranging between 1 and 10 microns. The very thin photosensitive protective layer is thus capable of minimizing the light refraction distortion.

Abstract: One or more through holes are formed by a process in a printed circuit board substrate formed of a resinous dielectric sheet and a conductive layer covering one surface of the dielectric sheet. The process involves the forming by laser one or more cavities on other surface of the dielectric sheet such that the cavities penetrate only the dielectric sheet, without penetrating the conductive layer. Both surfaces of the dielectric sheet are coated with a liquid photoresist layer such that the cavities are filled with the photoresist. A plurality of small areas are formed by photolithography on the surface which is covered with the conductive layer. The small areas are corresponding in location and shape to the cavities which may be of any shape. The small areas are stripped of the conductive, layer by etching before the cavities are stripped of the photoresist. The through holes are thus formed in the small areas defined by the cavities.

Abstract: A chip photoelectric sensor assembly comprises a substrate with a printed circuit board mounted thereon. A photoelectric sensor chip is provided with a plurality of photoelectric sensors and is mounted on the substrate such that the photoelectric sensor chip is electrically connected with the substrate. The photoelectric sensors of the photoelectric sensor chip are masked by a photosensitive protective layer made of a photosensitive hard coating material. The photosensitive protective layer has a thickness ranging between 1 and 10 microns. The very thin photosensitive protective layer is thus capable of minimizing the light refraction distortion.