Patents by Inventor Hong-Ming Wu

Hong-Ming Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11343466
    Abstract: A video signal conversion device includes a frontend interface circuit, a FPGA video processor and a backend interface circuit. The frontend interface circuit receives a HDR video input signal from a video transmitting device. The FPGA video processor outputs a SDR first video output signal. A video receiving device receives the first video output signal and a HDR second video output signal from the FPGA video processor through the video bridge controller of the backend interface circuit by PCI-E.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: May 24, 2022
    Assignee: AVERMEDIA TECHNOLOGIES, INC.
    Inventors: Ssu-Ming Cheng, Hong-Wei Liu, Chen-Hsiang Wu, Shi-Jie Lin, Yen-Cheng Yao, Chih-Sheng Wang
  • Publication number: 20220052168
    Abstract: A method according to the present disclosure includes receiving a workpiece including a gate structure, a first source/drain (S/D) feature, a second S/D feature, a first dielectric layer over the gate structure, the first S/D feature, the second S/D feature, a first S/D contact over the first S/D feature, a second S/D contact over the second S/D feature, a first etch stop layer (ESL) over the first dielectric layer, and a second dielectric layer over the first ESL, forming a S/D contact via through the second dielectric layer and the first ESL to couple to the first S/D contact, forming a gate contact opening through the second dielectric layer, the first ESL, and the first dielectric layer to expose the gate structure, and forming a common rail opening adjoining the gate contact opening to expose the second S/D contact, and forming a common rail contact in the common rail opening.
    Type: Application
    Filed: December 4, 2020
    Publication date: February 17, 2022
    Inventors: Cheng-Wei Chang, Hong-Ming Wu, Chen-Yuan Kao, Li-Hsiang Chao, Yi-Ying Liu
  • Publication number: 20200343087
    Abstract: The present disclosure describes a method that includes forming a dielectric layer over a contact region on a substrate; etching the dielectric layer to form a contact opening to expose the contact region; and pre-cleaning the exposed contact region to remove a residual material formed by the etching. During the pre-cleaning, the contact region is exposed to an inductively coupled radio frequency (RF) plasma. Also, during the pre-cleaning, a direct current power supply unit (DC PSU) provides a bias voltage to the substrate and a magnetic field is applied to the inductively coupled RF plasma to collimate ions.
    Type: Application
    Filed: July 13, 2020
    Publication date: October 29, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Ting Lin, Chen-Yuan Kao, Rueijer Lin, Yu-Sheng Wang, I-Li Chen, Hong-Ming Wu
  • Patent number: 10714329
    Abstract: The present disclosure describes a method that includes forming a dielectric layer over a contact region on a substrate; etching the dielectric layer to form a contact opening to expose the contact region; and pre-cleaning the exposed contact region to remove a residual material formed by the etching. During the pre-cleaning, the first contact region is exposed to an inductively coupled radio frequency (RF) plasma. Also, during the pre-cleaning, a direct current power supply unit (DC PSU) provides a bias voltage to the substrate and a magnetic field is applied to the inductively coupled RF plasma to collimate ions.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: July 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Ting Lin, Chen-Yuan Kao, Rueijer Lin, Yu-Sheng Wang, I-Li Chen, Hong-Ming Wu
  • Publication number: 20200105519
    Abstract: The present disclosure describes a method that includes forming a dielectric layer over a contact region on a substrate; etching the dielectric layer to form a contact opening to expose the contact region; and pre-cleaning the exposed contact region to remove a residual material formed by the etching. During the pre-cleaning, the first contact region is exposed to an inductively coupled radio frequency (RF) plasma. Also, during the pre-cleaning, a direct current power supply unit (DC PSU) provides a bias voltage to the substrate and a magnetic field is applied to the inductively coupled RF plasma to collimate ions.
    Type: Application
    Filed: September 28, 2018
    Publication date: April 2, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Ting LIN, Chen-Yuan KAO, Rueijer LIN, Yu-Sheng WANG, I-Li CHEN, Hong-Ming WU
  • Patent number: 8942773
    Abstract: A protection case for a portable electronic device includes a case having a front part and a rear part, and the portable electronic device is accommodated between the front and rear parts. A rear cover is connected to the rear part and a front cover is connected to the front part. The front cover has a front decoration plate, a connection member and a locking member. The front decoration plate is removably connected to the front part. The connection member is flexible and has a first end connected to the front decoration plate and a second end of the connection member is clamped between the front and rear parts. The locking member has a hook hooked with the groove. The protection case can be easily replaced and changed.
    Type: Grant
    Filed: July 11, 2011
    Date of Patent: January 27, 2015
    Assignee: Jenn Yaw J. Y. Enterprises Co., Ltd.
    Inventor: Hong-Ming Wu
  • Publication number: 20130015081
    Abstract: A protection case for a portable electronic device includes a case having a front part and a rear part, and the portable electronic device is accommodated between the front and rear parts. A rear cover is connected to the rear part and a front cover is connected to the front part. The front cover has a front decoration plate, a connection member and a locking member. The front decoration plate is removably connected to the front part. The connection member is flexible and has a first end connected to the front decoration plate and a second end of the connection member is clamped between the front and rear parts. The locking member has a hook hooked with the groove. The protection case can be easily replaced and changed.
    Type: Application
    Filed: July 11, 2011
    Publication date: January 17, 2013
    Inventor: Hong-Ming Wu
  • Publication number: 20120231224
    Abstract: A waterproof composite material includes a substrate and a thermoplastic film. The substrate has an inner surface and an outer surface. The thermoplastic film has a waterproof property and has an inner surface and an outer surface. The inner surface of the thermoplastic film and the outer surface of the substrate form thermal fusion. When the thermoplastic film and the substrate are thermally fused together, a pressure is applied to the outer surface of the thermoplastic film. According to the above-mentioned structure, the firm combination, the smooth surface, the simple and quick manufacturing processes and the reduction of environment contamination can be obtained.
    Type: Application
    Filed: March 11, 2011
    Publication date: September 13, 2012
    Inventor: Hong-Ming Wu
  • Publication number: 20110173365
    Abstract: A rotary display stage includes a display ground, an integrated circuit device, and a data transmission port. The display ground includes a base, and a rotary table arranged on the base. The base has a sound-effect switch structure and a track switch structure. The integrated circuit device is disposed inside the base, and includes an amplifier structure and a storage media. The data transmission port is arranged on the display ground and communicated with an exterior device optionally. The sound-effect switch structure, the track switch structure and the data transmission port electrically connect the integrated circuit device. Therefore, various audio data, except the tracks saved in the storage media previously, could optionally be played on via the data transmission port.
    Type: Application
    Filed: December 27, 2010
    Publication date: July 14, 2011
    Applicant: JENN YAW J.Y. ENTERPRISES CO., LTD.
    Inventor: Hong-Ming Wu
  • Patent number: 7454819
    Abstract: A zipper tab assembly has a connecting member, a clamping member and a decorative tab. The connecting member has a through hole, an engaging channel and two engaging holes. The clamping member is detachably attached to the connecting member and has a resilient loop and two engaging ears. The resilient loop has a clamping space and an opening communicating with the clamping space. The engaging ears are formed on the resilient loop at two sides of the opening and are detachably mounted in the engaging channel in the connecting member. Each engaging ear has a protrusion extending into and engaging with one of the engaging holes in the connecting member. The decorative tab is mounted in and clamped inside the clamping space of the resilient loop.
    Type: Grant
    Filed: November 3, 2006
    Date of Patent: November 25, 2008
    Assignee: Jenn Yaw J. Y. Enterprises Co., Ltd.
    Inventor: Hong-Ming Wu
  • Publication number: 20080104806
    Abstract: A zipper tab assembly has a connecting member, a clamping member and a decorative tab. The connecting member has a through hole, an engaging channel and two engaging holes. The clamping member is detachably attached to the connecting member and has a resilient loop and two engaging ears. The resilient loop has a clamping space and an opening communicating with the clamping space. The engaging ears are formed on the resilient loop at two sides of the opening and are detachably mounted in the engaging channel in the connecting member. Each engaging ear has a protrusion extending into and engaging with one of the engaging holes in the connecting member. The decorative tab is mounted in and clamped inside the clamping space of the resilient loop.
    Type: Application
    Filed: November 3, 2006
    Publication date: May 8, 2008
    Applicant: JENN YAW J. Y. ENTERPRISES CO., LTD.
    Inventor: Hong-Ming WU