Patents by Inventor Hong-San Kim
Hong-San Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20120056215Abstract: Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.Type: ApplicationFiled: November 15, 2011Publication date: March 8, 2012Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Chung Hoon LEE, Keon Young LEE, Hong San KIM, Dae Won KIM, Hyuck Jung CHOI
-
Patent number: 8076680Abstract: Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.Type: GrantFiled: October 26, 2005Date of Patent: December 13, 2011Assignee: Seoul Semiconductor Co., Ltd.Inventors: Chung Hoon Lee, Keon Young Lee, Hong San Kim, Dae Won Kim, Hyuck Jung Choi
-
Publication number: 20110241054Abstract: Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.Type: ApplicationFiled: June 14, 2011Publication date: October 6, 2011Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Chung Hoon LEE, Keon Young LEE, Hong San KIM, Dae Won KIM, Hyuck Jung CHOI
-
Publication number: 20110175128Abstract: Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.Type: ApplicationFiled: March 29, 2011Publication date: July 21, 2011Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Chung Hoon LEE, Keon Young LEE, Hong San KIM, Dae Won KIM, Hyuck Jung CHOI
-
Publication number: 20110140135Abstract: Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.Type: ApplicationFiled: February 24, 2011Publication date: June 16, 2011Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Chung Hoon LEE, Keon Young LEE, Hong San KIM, Dae Won KIM, Hyuck Jung CHOI
-
Publication number: 20110031891Abstract: Disclosed is an improved light-emitting device for an AC power operation. A conventional light emitting device employs an AC light-emitting diode having arrays of light emitting cells connected in reverse parallel. The arrays in the prior art alternately repeat on/off in response to a phase change of an AC power source, resulting in short light emission time during a ½ cycle and the occurrence of a flicker effect. An AC light-emitting device according to the present invention employs a variety of means by which light emission time is prolonged during a ½ cycle in response to a phase change of an AC power source and a flicker effect can be reduced. For example, the means may be switching blocks respectively connected to nodes between the light emitting cells, switching blocks connected to a plurality of arrays, or a delay phosphor.Type: ApplicationFiled: October 20, 2010Publication date: February 10, 2011Applicant: SEOUL OPTO DEVICE CO., LTD.Inventors: Chung Hoon LEE, James S. SPECK, Hong San KIM, Jae Jo KIM, Sung Han KIM, Jae Ho LEE
-
Patent number: 7880183Abstract: Disclosed is a light emitting device having a plurality of light emitting cells. The light emitting device comprises a thermally conductive substrate, such as a SiC substrate, having a thermal conductivity higher than that of a sapphire substrate. The plurality of light emitting cells are connected in series on the thermally conductive substrate. Meanwhile, a semi-insulating buffer layer is interposed between the thermally conductive substrate and the light emitting cells. For example, the semi-insulating buffer layer may be formed of AlN or semi-insulating GaN. Since the thermally conductive substrate having a thermal conductivity higher than that of a sapphire substrate is employed, heat-dissipating performance can be enhanced as compared with a conventional sapphire substrate, thereby increasing the maximum light output of a light emitting device that is driven under a high voltage AC power source.Type: GrantFiled: May 5, 2010Date of Patent: February 1, 2011Assignee: Seoul Opto Device Co., Ltd.Inventors: Chung Hoon Lee, Hong San Kim, James S. Speck
-
Publication number: 20100277084Abstract: Disclosed is an improved light-emitting device for an AC power operation. A conventional light emitting device employs an AC light-emitting diode having arrays of light emitting cells connected in reverse parallel. The arrays in the prior art alternately repeat on/off in response to a phase change of an AC power source, resulting in short light emission time during a ½ cycle and the occurrence of a flicker effect. An AC light-emitting device according to the present invention employs a variety of means by which light emission time is prolonged during a ½ cycle in response to a phase change of an AC power source and a flicker effect can be reduced. For example, the means may be switching blocks respectively connected to nodes between the light emitting cells, switching blocks connected to a plurality of arrays, or a delay phosphor.Type: ApplicationFiled: July 16, 2010Publication date: November 4, 2010Applicant: Seoul Opto Device Co., Ltd.Inventors: Chung Hoon LEE, James S. Speck, Hong San Kim, Jae Jo Kim, Sung Han Kim, Jae Ho Lee
-
Publication number: 20100224904Abstract: Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.Type: ApplicationFiled: May 18, 2010Publication date: September 9, 2010Applicant: Seoul Semiconductor Co., Ltd.Inventors: Chung Hoon LEE, Keon Young Lee, Hong San Kim, Dae Won Kim, Hyuck Jung Choi
-
Publication number: 20100213468Abstract: Disclosed is a light emitting device having a plurality of light emitting cells. The light emitting device comprises a thermally conductive substrate, such as a SiC substrate, having a thermal conductivity higher than that of a sapphire substrate. The plurality of light emitting cells are connected in series on the thermally conductive substrate. Meanwhile, a semi-insulating buffer layer is interposed between the thermally conductive substrate and the light emitting cells. For example, the semi-insulating buffer layer may be formed of AlN or semi-insulating GaN. Since the thermally conductive substrate having a thermal conductivity higher than that of a sapphire substrate is employed, heat-dissipating performance can be enhanced as compared with a conventional sapphire substrate, thereby increasing the maximum light output of a light emitting device that is driven under a high voltage AC power source.Type: ApplicationFiled: May 5, 2010Publication date: August 26, 2010Applicant: Seoul Opto Device Co., Ltd.Inventors: Chung Hoon Lee, Hong San Kim, James S. Speck
-
Patent number: 7772601Abstract: Disclosed is a light emitting device having a plurality of light emitting cells. The light emitting device comprises a thermally conductive substrate, such as a SiC substrate, having a thermal conductivity higher than that of a sapphire substrate. The plurality of light emitting cells are connected in series on the thermally conductive substrate. Meanwhile, a semi-insulating buffer layer is interposed between the thermally conductive substrate and the light emitting cells. For example, the semi-insulating buffer layer may be formed of AlN or semi-insulating GaN. Since the thermally conductive substrate having a thermal conductivity higher than that of a sapphire substrate is employed, heat-dissipating performance can be enhanced as compared with a conventional sapphire substrate, thereby increasing the maximum light output of a light emitting device that is driven under a high voltage AC power source.Type: GrantFiled: July 5, 2005Date of Patent: August 10, 2010Assignee: Seoul Opto Device Co., Ltd.Inventors: Chung Hoon Lee, Hong San Kim, James S. Speck
-
Patent number: 7772602Abstract: Disclosed is a light emitting device having a plurality of light emitting cells. The light emitting device comprises a thermally conductive substrate, such as a SiC substrate, having a thermal conductivity higher than that of a sapphire substrate. The plurality of light emitting cells are connected in series on the thermally conductive substrate. Meanwhile, a semi-insulating buffer layer is interposed between the thermally conductive substrate and the light emitting cells. For example, the semi-insulating buffer layer may be formed of AlN or semi-insulating GaN. Since the thermally conductive substrate having a thermal conductivity higher than that of a sapphire substrate is employed, heat-dissipating performance can be enhanced as compared with a conventional sapphire substrate, thereby increasing the maximum light output of a light emitting device that is driven under a high voltage AC power source.Type: GrantFiled: March 24, 2009Date of Patent: August 10, 2010Assignee: Seoul Opto Device Co., Ltd.Inventors: Chung Hoon Lee, Hong San Kim, James S. Speck
-
Publication number: 20090267085Abstract: Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.Type: ApplicationFiled: October 26, 2005Publication date: October 29, 2009Applicant: Seoul Semiconductor Co., Ltd.Inventors: Chung Hoon Lee, Keon Young Lee, Hong San Kim, Dae Won Kim, Hyuck Jung Choi
-
Publication number: 20090189166Abstract: Disclosed is a light emitting device having a plurality of light emitting cells. The light emitting device comprises a thermally conductive substrate, such as a SiC substrate, having a thermal conductivity higher than that of a sapphire substrate. The plurality of light emitting cells are connected in series on the thermally conductive substrate. Meanwhile, a semi-insulating buffer layer is interposed between the thermally conductive substrate and the light emitting cells. For example, the semi-insulating buffer layer may be formed of AlN or semi-insulating GaN. Since the thermally conductive substrate having a thermal conductivity higher than that of a sapphire substrate is employed, heat-dissipating performance can be enhanced as compared with a conventional sapphire substrate, thereby increasing the maximum light output of a light emitting device that is driven under a high voltage AC power source.Type: ApplicationFiled: March 24, 2009Publication date: July 30, 2009Applicant: Seoul Opto Device Co., Ltd.Inventors: Chung Hoon LEE, Hong San Kim, James S. Speck
-
Publication number: 20080211421Abstract: Disclosed is an improved light-emitting device for an AC power operation. A conventional light emitting device employs an AC light-emitting diode having arrays of light emitting cells connected in reverse parallel. The arrays in the prior art alternately repeat on/off in response to a phase change of an AC power source, resulting in short light emission time during a ½ cycle and the occurrence of a flicker effect. An AC light-emitting device according to the present invention employs a variety of means by which light emission time is prolonged during a ½ cycle in response to a phase change of an AC power source and a flicker effect can be reduced. For example, the means may be switching blocks respectively connected to nodes between the light emitting cells, switching blocks connected to a plurality of arrays, or a delay phosphor.Type: ApplicationFiled: May 9, 2006Publication date: September 4, 2008Applicant: SEOUL OPTO DEVICE CO., LTD.Inventors: Chung Hoon Lee, James S. Speck, Hong San Kim, Jae Jo Kim, Sung Han Kim, Jae Ho Lee
-
Publication number: 20080197363Abstract: Disclosed is a light emitting device having a plurality of light emitting cells. The light emitting device comprises a thermally conductive substrate, such as a SiC substrate, having a thermal conductivity higher than that of a sapphire substrate. The plurality of light emitting cells are connected in series on the thermally conductive substrate. Meanwhile, a semi-insulating buffer layer is interposed between the thermally conductive substrate and the light emitting cells. For example, the semi-insulating buffer layer may be formed of AlN or semi-insulating GaN. Since the thermally conductive substrate having a thermal conductivity higher than that of a sapphire substrate is employed, heat-dissipating performance can be enhanced as compared with a conventional sapphire substrate, thereby increasing the maximum light output of a light emitting device that is driven under a high voltage AC power source.Type: ApplicationFiled: July 5, 2005Publication date: August 21, 2008Applicant: SEOUL OPTO DEVICE CO., LTD.Inventors: Chung Hoon Lee, Hong San Kim, James S. Speck
-
Patent number: 7042022Abstract: A chip light emitting diode having a wide viewing angle, and a fabrication method thereof. The chip light emitting diode has a resin package sealing a light emitting chip which has at least one curved projecting part. The curved projecting part has a cross section which is substantially semicircular, or substantially or partially elliptical or parabolic. The curved projecting part preferably has a cross section which is comprised of a plurality of straight lines, an angle being formed between adjacent lines. The cross section is elongated to form a cylindrical outer surface of the resin package.Type: GrantFiled: January 9, 2004Date of Patent: May 9, 2006Assignee: Seoul Semiconductor Co., Ltd.Inventors: Kwan-Young Han, Do-Hyung Kim, Seung-Man Yang, Chung-Hoon Lee, Hong-San Kim, Kwang-Il Park
-
Publication number: 20050017259Abstract: A chip light emitting diode having a wide viewing angle, and a fabrication method thereof. The chip light emitting diode has a resin package sealing a light emitting chip which has at least one curved projecting part. The curved projecting part has a cross section which is substantially semicircular, or substantially or partially elliptical or parabolic. The curved projecting part preferably has a cross section which is comprised of a plurality of straight lines, an angle being formed between adjacent lines. The cross section is elongated to form a cylindrical outer surface of the resin package.Type: ApplicationFiled: January 9, 2004Publication date: January 27, 2005Inventors: Kwan-Young Han, Do-Hyung Kim, Seung-Man Yang, Chung-Hoon Lee, Hong-San Kim, Kwang-Il Park
-
Patent number: RE42112Abstract: A chip light emitting diode having a wide viewing angle, and a fabrication method thereof. The chip light emitting diode has a resin package sealing a light emitting chip which has at least one curved projecting part. The curved projecting part has a cross section which is substantially semicircular, or substantially or partially elliptical or parabolic. The curved projecting part preferably has a cross section which is comprised of a plurality of straight lines, an angle being formed between adjacent lines. The cross section is elongated to form a cylindrical outer surface of the resin package.Type: GrantFiled: January 11, 2007Date of Patent: February 8, 2011Assignee: Seoul Semiconductor Co., Ltd.Inventors: Kwan-Young Han, Do-Hyung Kim, Seung-Man Yang, Chung-Hoon Lee, Hong-San Kim, Kwang-Il Park