Patents by Inventor Hong Seo

Hong Seo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250107201
    Abstract: Presented are structures and methods for forming such structures that allow for electrical or diffusion breaks between transistors of one level of a stacked transistor device, without necessarily requiring that a like electrical or diffusion break exists in another level of the stacked transistor device. Also presented, an electrical break between transistor devices may be formed by providing a channel of a first polarity with a false gate comprising a work-function metal of an opposite polarity.
    Type: Application
    Filed: December 6, 2024
    Publication date: March 27, 2025
    Inventors: Byounghak Hong, Seunghyun Song, Kang-ill Seo, Daewon Ha, Jason Martineau
  • Publication number: 20250107226
    Abstract: Disclosed is a ternary CMOS device including a two-dimensional material layer formed of a two-dimensional material, an n-type MOSFET region stacked on a top of the two-dimensional material layer, and a p-type MOSFET region stacked on the top of the two-dimensional material layer, wherein the two-dimensional material layer includes a two-dimensional phase change material layer formed of a two-dimensional phase change material, an n-channel two-dimensional semiconductor material layer stacked on a bottom of the n-type MOSFET region and connected to one end of the two-dimensional phase change material layer, and a p-channel two-dimensional semiconductor material layer stacked on a bottom of the p-type MOSFET region and connected to the other end of the two-dimensional phase change material layer.
    Type: Application
    Filed: September 24, 2024
    Publication date: March 27, 2025
    Inventors: Jiwon Chang, Sekwon Hong, Changwook Lee, Jae Eun Seo
  • Publication number: 20250101158
    Abstract: Disclosed is a method of preparing ethylene vinyl acetate including adding a monomer containing ethylene and vinyl acetate and a solvent containing alkyl acetate to a reactor and performing polymerization.
    Type: Application
    Filed: August 9, 2024
    Publication date: March 27, 2025
    Inventors: Kwang In KIM, In Hwa HONG, Seok Kyoo SEO, Wan Keun KIM
  • Publication number: 20250103288
    Abstract: Disclosed is an accelerator performing an accumulation operation on a plurality of data, each being a floating point type. A method of operating the accelerator includes loading first data, finding a first exponent, which is a maximum value among exponents of the first data, generating aligned first fractions by performing a bit shift on first fractions of the first data based on the first exponent, and generating a first accumulated value by an accumulation operation on the aligned first fractions, loading second data, finding a second exponent, which is a maximum value among exponents of the second data, and generating a first aligned accumulated value by a bit shift on the first accumulated value, generating aligned second fractions by a bit shift on second fractions of the second data, and generating a second accumulated value by an accumulation operation on the aligned second fractions and the first aligned accumulated value.
    Type: Application
    Filed: August 29, 2024
    Publication date: March 27, 2025
    Applicants: Samsung Electronics Co., Ltd., NAVER CORPORATION
    Inventors: Jae Hun JANG, Hong Rak SON, Dong-Min SHIN, JongYoon YOON, Younho JEON, Sejung KWON, Byeoungwook KIM, Baeseong PARK, Mankeun SEO, Byungmin AHN, Dongsoo LEE
  • Publication number: 20250107172
    Abstract: A multi-stack semiconductor device includes: a substrate; a multi-stack transistor formed on the substrate and including a nanosheet transistor and a fin field-effect transistor (FinFET) above the nanosheet transistor, wherein the nanosheet transistor includes a plurality nanosheet layers surrounded by a lower gate structure except between the nanosheet layers, the FinFET includes at least one fin structure, of which at least top and side surfaces are surrounded by an upper gate structure, and each of the lower and upper gate structures includes: a gate oxide layer formed on the nanosheet layers and the at least one fin structure; and a gate metal pattern formed on the gate oxide layer. At least one of the lower and upper gate structures includes an extra gate (EG) oxide layer formed between the gate oxide layer and the nanosheet layers and/or between the gate oxide layer and the at least one fin structure.
    Type: Application
    Filed: December 9, 2024
    Publication date: March 27, 2025
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byounghak Hong, Seungchan Yun, Kang-ill Seo
  • Publication number: 20250092154
    Abstract: The present invention relates to humanized antibodies or antigen-binding fragments capable of binding specifically to mesothelin antigen and various uses thereof.
    Type: Application
    Filed: February 23, 2024
    Publication date: March 20, 2025
    Applicant: UCI THERAPEUTICS INC.
    Inventors: Su Yeong JEONG, Sang Won YOON, Min Koo SEO, Jun Yop AN, Byoungseok HONG
  • Patent number: 12255248
    Abstract: A system and a method are disclosed for forming a bottle-neck shaped backside contact structure in a semiconductor device, wherein the bottle-neck shaped backside contact structure has a first side partially within the first source/drain structure, a second side contacting a backside power rail, and a liner extending from the first side to the backside power rail. The liner includes a first region comprised of either a Ta silicide liner or a Ti silicide liner, a second region comprised of a Ti/TiN liner and a third region comprised of either a Ta silicide liner or a Ti silicide liner. The backside contact structure includes a first portion having a positive slope and a second portion, adjacent to the first portion, having no slope.
    Type: Grant
    Filed: December 14, 2023
    Date of Patent: March 18, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wonhyuk Hong, Jongjin Lee, Taesun Kim, Myunghoon Jung, Kang-ill Seo
  • Publication number: 20250084026
    Abstract: The present disclosure relates to a novel salt of a 1-sulfonyl pyrrole derivative, and to a novel salt having excellent solubility in vivo, stability, bioavailability, and the like, a preparation method thereof, and a pharmaceutical composition comprising the same.
    Type: Application
    Filed: December 14, 2022
    Publication date: March 13, 2025
    Inventors: Hong Chul Yoon, Joon Tae Park, Jung Woo Lee, Kyung Mi An, Chang Hee Hong, Jae Eui Shin, Soo Jin Lee, Hanna Seo, Jae Hong Lee
  • Patent number: 12249603
    Abstract: Resistor structures of stacked devices and methods of forming the same are provided. The, resistor structures may include a substrate, an upper semiconductor layer that may be spaced apart from the substrate in a vertical direction, a lower semiconductor layer that may be between the substrate and the upper semiconductor layer, and first and second resistor contacts that may be spaced apart from each other in a horizontal direction. At least one of the upper semiconductor layer, the lower semiconductor layer, and a portion of the substrate may contact the first and second resistor contacts.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: March 11, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byounghak Hong, Seungchan Yun, Inchan Hwang, Hyoeun Park, Kang-ill Seo
  • Patent number: 12240259
    Abstract: Disclosed is a substrate processing device which includes a substrate transfer part on which a transfer object is received and a jetting system part includes an ink jet body that jets and prints ink on the transfer object over an upper surface of the substrate transfer part, an ink module transfer part that transfers the ink jet body, an encoder disposed around the ink module transfer part to output a movement signal per unit movement distance of the ink module transfer part, an ink ejection controller that interworks with the ink jet body to control an ink jetting timing of the ink jet body, and a signal splitter that interworks with the encoder to count the movement signal, reset a width of the counted movement signal, and transmit the movement signal, the width of which is reset, to the ink ejection controller.
    Type: Grant
    Filed: December 29, 2022
    Date of Patent: March 4, 2025
    Assignee: SEMES CO., LTD.
    Inventors: Sang Min Ha, Hyeong Jun Cho, Jae Hong Kim, Sang Hyun Son, Young-Joo Seo
  • Patent number: 12244053
    Abstract: The present disclosure relates to an antenna RF module, an RF module assembly including the antenna RF modules, and an antenna apparatus including the RF module assembly. Particularly, the antenna RF module includes an RF module, a radiation element module arranged on a first side of the RF filter, and an amplification unit board arranged on a second side of the RF filter, an analog amplification element being mounted on the amplification unit board. A plurality of antenna RF modules constitute the RF module assembly, and the RF module assembly and an antenna housing constitute the antenna apparatus. Accordingly, a radome that interrupts dissipation of heat to in front of an antenna is unnecessary, and heat generated from heat generating elements of the antenna apparatus is spatially separated. Thus, it is possible that the heat is dissipated in a distributed manner toward the front and rear directions of the antenna apparatus. The effect of greatly improving performance in heat dissipation can be achieved.
    Type: Grant
    Filed: April 16, 2023
    Date of Patent: March 4, 2025
    Assignee: KMW INC.
    Inventors: Duk Yong Kim, Young Chan Moon, Nam Shin Park, Sung Ho Jang, Jae Hong Kim, Joon Hyong Shim, Bae Mook Jeong, Min Seon Yun, Sung Hwan So, Yong Won Seo, Oh Seog Choi, Kyo Sung Ji, Chi Back Ryu, Seong Min Ahn, Jae Eun Kim
  • Patent number: 12235054
    Abstract: The present invention relates to an integrated connector and a heat exchanger including the same, in which a connector main body is formed by pressing one pipe, a cap is press-fitted into the connector main body, such that the integrated connector is formed so that an interior of the connector main body is blocked by the cap. Therefore, the number of components used to manufacture a connector, which connects and securely couples a header tank and a gas-liquid separator, may be reduced, the integrated connector may be easily manufactured, and a brazing defect may be reduced at portions where the integrated connector is joined to the header tank and the gas-liquid separator of the heat exchanger.
    Type: Grant
    Filed: September 27, 2023
    Date of Patent: February 25, 2025
    Assignee: HANON SYSTEMS
    Inventors: Seung Hark Shin, Woon Sik Kim, Dae Sung Noh, Hyunwoo Cho, Min Won Seo, Sung Hong Shin, Jong Du Lee, Jung Hyun Cho, Uk Huh
  • Publication number: 20250062192
    Abstract: Integrated circuit devices and methods of forming the same. As an example, an integrated circuit device may include a substrate; a first transistor structure on the substrate; a second transistor structure stacked in a vertical direction on the first transistor structure; an isolation layer between the first transistor structure and the second transistor structure in the vertical direction; and a diode structure on the substrate and adjacent to the first transistor structure in a horizontal direction. The diode structure may be part of a discharging path between a gate electrode of the second transistor structure and the substrate. The discharging path may extend through the isolation layer.
    Type: Application
    Filed: August 15, 2024
    Publication date: February 20, 2025
    Inventors: JAEHONG LEE, SOOYOUNG PARK, WONHYUK HONG, KANG-ILL SEO
  • Publication number: 20250063765
    Abstract: Nanosheet transistor devices are provided. A nanosheet transistor device includes a transistor stack that includes a lower nanosheet transistor having a first nanosheet width and a lower gate width. The transistor stack also includes an upper nanosheet transistor that is on the lower nanosheet transistor and that has a second nanosheet width and an upper gate width that are different from the first nanosheet width and the lower gate width, respectively. Related methods of forming a nanosheet transistor device are also provided.
    Type: Application
    Filed: November 6, 2024
    Publication date: February 20, 2025
    Inventors: Jeonghyuk Yim, Byounghak Hong, Jungsu Kim, Kang-ill Seo
  • Publication number: 20250063825
    Abstract: Integrated circuit devices and methods of forming the same. As an example, an integrated circuit device may include a first substrate; a first transistor structure on the substrate; a second transistor structure stacked in a vertical direction on the first transistor structure; an isolation layer between the first transistor structure and the second transistor structure in the vertical direction; a diode structure on the first substrate and adjacent to the first transistor structure in a horizontal direction; and a second substrate on the second transistor structure in the vertical direction. The diode structure may be part of a discharging path between a gate electrode of the second transistor structure and the second substrate. The discharging path may extend through the isolation layer.
    Type: Application
    Filed: June 6, 2024
    Publication date: February 20, 2025
    Inventors: JAEHONG LEE, WONHYUK HONG, KANG-ILL SEO
  • Patent number: 12224314
    Abstract: A multi-stack semiconductor device includes: a substrate; and a plurality of multi-stack transistor structures arranged on the substrate in a channel width direction, wherein the multi-stack transistor structure include at least one lower transistor structure and at least one upper transistor structure stacked above the lower transistor structure, wherein the lower and upper transistor structures include at least one channel layer as a current channel, wherein the lower transistor structures of at least two multi-stack transistor structures have different channel-layer widths.
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: February 11, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Gunho Jo, Ki-il Kim, Byounghak Hong, Kang-ill Seo
  • Publication number: 20250042872
    Abstract: The present disclosure relates to a novel salt of a 1-sulfonyl pyrrole derivative, and to a novel salt having excellent solubility in vivo, stability, bioavailability, and the like, a preparation method thereof, and a pharmaceutical composition comprising the same.
    Type: Application
    Filed: December 14, 2022
    Publication date: February 6, 2025
    Inventors: Hong Chul YOON, Joon Tae PARK, Jung Woo LEE, Kyung Mi AN, Chang Hee HONG, Jae Eui SHIN, Soo Jin LEE, Hanna SEO, Jae Hong LEE
  • Publication number: 20250035990
    Abstract: The present application provides a substrate comprising a spacer pattern. The present application can provide a substrate, which is applied to various optical devices, capable of evenly and stably maintaining a gap between substrates while maximally securing an active region without causing any optical defects, including a diffraction phenomenon, and the like. The present application can also provide an optical device comprising the substrate.
    Type: Application
    Filed: December 7, 2022
    Publication date: January 30, 2025
    Applicant: LG Chem, Ltd.
    Inventors: Han Min Seo, Seung Heon Lee, Jin Hong KIm, Min Jun Gim, Young Jin Park
  • Publication number: 20250028827
    Abstract: Provided is a cyber threat information processing method including receiving a CTI analysis request for a file from a client; analyzing the file to obtain analysis information of the CTI for the file; generating a CTI query related to the file based on the analyzed CTI and delivering the CTI query to a natural language model; and providing natural language description information according to the CTI query obtained from the CTI for the analyzed file and the natural language model to the client as visualization information based on a Web service.
    Type: Application
    Filed: August 18, 2023
    Publication date: January 23, 2025
    Applicant: SANDS LAB INC.
    Inventors: Ki Hong KIM, Shin Kyo IN, Jin Ki CHEON, Ji Woo SEO
  • Publication number: 20250030704
    Abstract: Provided is a cyber threat information processing method including receiving a CTI analysis request for assembly code from a client; analyzing the assembly code to obtain analysis information of the CTI for the assembly code; generating a CTI query related to a file based on the analyzed CTI and delivering the CTI query to a natural language model; and providing natural language description information according to the CTI query obtained from the CTI for the assembly code and the natural language model as visualization information based on a web service.
    Type: Application
    Filed: August 18, 2023
    Publication date: January 23, 2025
    Applicant: SANDS LAB INC.
    Inventors: Ki Hong KIM, Shin Kyo IN, Jin Ki CHEON, Ji Woo SEO